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1. 发明申请

US20120247961A1 METAL OXIDE FILM, LAMINATE, METAL MEMBER AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：金属氧化物膜，层压板，金属构件及其制造方法
公开(公告)号：US20120247961A1
公开(公告)日：2012-10-04
申请号：US13463315
申请日：2012-05-03
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
IPC分类号： C25D11/04 , C25D3/00 , C25D19/00 , C25D5/50 , C25D11/10 , C25D7/00 , B82Y40/00 , B82Y99/00
CPC分类号： C25D11/06 , C25D11/18 , Y10T428/265
摘要： A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.
摘要翻译：适用于主要由铝组成的金属保护金属氧化物膜。金属氧化物膜包括厚度为10nm以上的主要由铝构成的金属的氧化物的膜，并且具有1E18mol / cm 2以下的膜的水分释放率。此外，提供了一种制造金属氧化物膜的方法，其中主要由铝组成的金属在pH值为4至10的化学溶液中进行阳极氧化，以获得金属氧化物膜。

2. 发明授权

US08206833B2 Metal oxide film, laminate, metal member and process for producing the same 有权
标题翻译：金属氧化物膜，层压体，金属构件及其制造方法
公开(公告)号：US08206833B2
公开(公告)日：2012-06-26
申请号：US11917614
申请日：2006-05-09
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
IPC分类号： B32B9/00
CPC分类号： C25D11/06 , C25D11/18 , Y10T428/265
摘要： A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.
摘要翻译：适用于主要由铝组成的金属保护金属氧化物膜。金属氧化物膜包括厚度为10nm以上的主要由铝构成的金属的氧化物的膜，并且具有1E18mol / cm 2以下的膜的水分释放率。此外，提供了一种制造金属氧化物膜的方法，其中主要由铝组成的金属在pH值为4至10的化学溶液中进行阳极氧化，以获得金属氧化物膜。

3. 发明授权

US08124240B2 Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structure 有权
标题翻译：金属构件的保护膜结构，采用保护膜结构的金属成分，以及使用保护膜结构制造半导体或平板显示器的设备
公开(公告)号：US08124240B2
公开(公告)日：2012-02-28
申请号：US11917633
申请日：2006-06-16
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa , Yukio Kishi
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa , Yukio Kishi
IPC分类号： B32B9/00
CPC分类号： C23C4/02 , C23C8/80 , C23C28/00 , C23C28/042 , C25D11/02 , C25D11/04 , C25D11/08 , C25D11/10 , C25D11/16 , C25D11/18 , Y10T428/26 , Y10T428/265 , Y10T428/31678
摘要： A protective film structure of a metal member for use in an apparatus for manufacturing a semiconductor or the like, the protective film structure including a first coating layer of faultless aluminum oxide formed by direct anodic oxidation of a base-material metal of an aluminum alloy; and a second coating layer formed on the first coating layer and made of yttrium oxide by a plasma spraying method.
摘要翻译：一种用于半导体制造装置的金属构件的保护膜结构，所述保护膜结构包括由铝合金的基材金属的直接阳极氧化形成的无缺陷氧化铝的第一涂层; 以及通过等离子喷涂法形成在第一涂层上并由氧化钇制成的第二涂层。

4. 发明申请

US20090142588A1 Protective Film Structure of Metal Member, Metal Component Employing Protective Film Structure, and Equipment for Producing Semiconductor or Flat-Plate Display Employing Protective Film Structure 有权
标题翻译：金属部件的保护膜结构，使用保护膜结构的金属部件以及使用保护膜结构的半导体或平板显示器的生产设备
公开(公告)号：US20090142588A1
公开(公告)日：2009-06-04
申请号：US11917633
申请日：2006-06-16
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa , Yukio Kishi
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa , Yukio Kishi
IPC分类号： B32B15/00
CPC分类号： C23C4/02 , C23C8/80 , C23C28/00 , C23C28/042 , C25D11/02 , C25D11/04 , C25D11/08 , C25D11/10 , C25D11/16 , C25D11/18 , Y10T428/26 , Y10T428/265 , Y10T428/31678
摘要： Multifunction production equipment enabling a plurality of processes in which deposition of reaction products on the inner wall of the processing chamber of equipment for producing a semiconductor or a flat-plate display, metal contamination due to corrosion of the inner wall, or the like, and fluctuation of the process due to discharged gas are suppressed, and a protective film structure for use therein. On the surface of a metal material, a first coating layer having an oxide coating of 1μ thick or less formed as an underlying layer by direct oxidation of a parent material, and a second coating layer of about 200 μm thick are formed. With such an arrangement, corrosion resistance against irradiation with ions or radicals can be imparted to a second layer protective film, and the effect of a protective layer for preventing corrosion of the surface of parent metal caused by diffusing molecules or ions into the second layer protective film can be imparted to the first layer oxide film. Consequently, contamination of the substrate with metals generated from each metal member and the inner surface of the process chamber is reduced, and stripping of the second layer protective film due to lowering in adhesion of the second layer protective film due to corrosion of the interface between the parent material and the second layer protective film can be suppressed.
摘要翻译：多功能生产设备能够实现多个工艺，其中在用于制造半导体或平板显示器的设备的处理室的内壁上沉积反应产物，由于内壁的腐蚀而引起的金属污染等，以及排出气体的处理的波动被抑制，以及用于其中的保护膜结构。在金属材料的表面上，形成通过母材直接氧化形成作为下层的1μm厚以下的氧化物被膜的第1被覆层和200μm厚的第2被覆层。通过这样的布置，可以对第二层保护膜赋予对离子或自由基的照射的耐腐蚀性，以及用于防止母体金属表面由于扩散分子或离子而导致的第二层保护层的腐蚀的保护层的效果可以将膜施加到第一层氧化物膜。因此，由金属构件和处理室的内表面产生的金属对衬底的污染减少，并且由于第二层保护膜的粘附性的降低而导致的第二层保护膜的剥离可以抑制母材和第二层保护膜。

5. 发明申请

US20090038946A1 METAL OXIDE FILM, LAMINATE, METAL MEMBER AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：金属氧化物膜，层压板，金属构件及其制造方法
公开(公告)号：US20090038946A1
公开(公告)日：2009-02-12
申请号：US11917614
申请日：2006-05-09
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
IPC分类号： C25D7/12 , B32B15/04 , C23F13/00
CPC分类号： C25D11/06 , C25D11/18 , Y10T428/265
摘要： A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.
摘要翻译：适用于主要由铝组成的金属保护金属氧化物膜。金属氧化物膜包括厚度为10nm以上的主要由铝构成的金属的氧化物的膜，并且具有1E18mol / cm 2以下的膜的水分释放率。此外，提供了一种制造金属氧化物膜的方法，其中主要由铝组成的金属在pH值为4至10的化学溶液中进行阳极氧化，以获得金属氧化物膜。

6. 发明授权

US09476137B2 Metal oxide film, laminate, metal member and process for producing the same 有权
标题翻译：金属氧化物膜，层压体，金属构件及其制造方法
公开(公告)号：US09476137B2
公开(公告)日：2016-10-25
申请号：US13463315
申请日：2012-05-03
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Hitoshi Morinaga , Yasuhiro Kawase , Masafumi Kitano , Fumikazu Mizutani , Makoto Ishikawa
IPC分类号： C25D11/06 , C25D11/18
CPC分类号： C25D11/06 , C25D11/18 , Y10T428/265
摘要： A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.
摘要翻译：适用于主要由铝组成的金属保护金属氧化物膜。金属氧化物膜包括厚度为10nm以上的主要由铝构成的金属的氧化物的膜，并且具有1E18mol / cm 2以下的膜的水分释放率。此外，提供了一种制造金属氧化物膜的方法，其中主要由铝组成的金属在pH值为4至10的化学溶液中进行阳极氧化，以获得金属氧化物膜。

7. 发明申请

US20050056545A1 Gold plating solution and gold plating method 失效
标题翻译：镀金液和镀金方法
公开(公告)号：US20050056545A1
公开(公告)日：2005-03-17
申请号：US10937392
申请日：2004-09-10
申请人： Fumikazu Mizutani , Hiroshi Takaha , Makoto Ishikawa , Yasuhiro Kawase
发明人： Fumikazu Mizutani , Hiroshi Takaha , Makoto Ishikawa , Yasuhiro Kawase
IPC分类号： C25D3/48 , H01M4/88 , C23C20/00
CPC分类号： C25D3/48
摘要： A gold plating solution comprising iodide ions, gold iodide complex ions and a non-aqueous solvent, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution. The present invention further provides a gold plating solution comprising iodide ions, gold iodide complex ions, a non-aqueous solvent and a water-soluble polymer, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution and which is capable of forming a gold plating film in which gold crystal particle sizes are very fine and grain boundaries are dense. The present invention further provides a gold plating method employing such a gold plating solution.
摘要翻译：包含碘离子，碘化金配合离子和非水溶剂的金电镀溶液，其毒性和稳定性较低，同时具有与氰化物型镀金液相当的性能。本发明还提供了一种含有碘离子，碘化金离子，非水溶剂和水溶性聚合物的金电镀溶液，其毒性和稳定性较低，同时具有与氰化物型镀金液相当的性能，其能够形成金结晶粒子非常细且晶界密集的镀金膜。本发明还提供了使用这种镀金液的镀金方法。

8. 发明授权

US07906004B2 Method of forming oxide film by anodically oxidizing in an electrolyte solution 有权
标题翻译：在电解液中通过阳极氧化形成氧化膜的方法
公开(公告)号：US07906004B2
公开(公告)日：2011-03-15
申请号：US11577144
申请日：2005-09-29
申请人： Fumikazu Mizutani , Toshiaki Sakakihara , Yasuhiro Kawase , Makoto Ishikawa
发明人： Fumikazu Mizutani , Toshiaki Sakakihara , Yasuhiro Kawase , Makoto Ishikawa
IPC分类号： C25D11/06 , C25D11/26
CPC分类号： C25D11/02 , C25D11/06 , C25D11/10 , C25D11/26
摘要： A high-quality oxide film which is free from a pinhole and surface roughing caused by anodic oxidation and which has surface smoothness on a surface of a material to be treated containing a metal as a principal component. An electrolyte solution which is used for forming an oxide film on a surface of a material to be treated containing a metal as a principal component by anodic oxidation, the electrolyte solution containing a non-aqueous solvent containing an alcoholic hydroxyl group and having 4 or more carbon atoms as a main solvent. This non-aqueous solvent preferably contains two or more alcoholic hydroxyl groups and is especially preferably one or two or more members selected from the group consisting of diethylene glycol, triethylene glycol and polyethylene glycol. A method of forming an oxide film including a step of anodically oxidizing a material to be treated containing a metal as a principal component in this electrolyte solution.
摘要翻译：一种高品质的氧化膜，其不含针孔和由阳极氧化引起的表面粗糙化，并且在待处理的材料的表面上具有表面平滑度，其中含有金属作为主要成分。一种用于在通过阳极氧化包含金属作为主要成分的待处理材料的表面上形成氧化物膜的电解质溶液，所述电解质溶液含有含有醇羟基且含有4个或更多个的羟基的非水溶剂碳原子作为主要溶剂。该非水溶剂优选含有两个以上的醇羟基，特别优选为选自二甘醇，三甘醇和聚乙二醇中的一种或两种以上的成分。一种形成氧化膜的方法，包括在该电解质溶液中对含有金属作为主要成分的待处理材料进行阳极氧化的步骤。

9. 发明申请

US20090023001A1 ELECTROLYTE SOLUTION AND METHOD OF FORMING OXIDE FILM USING THE SAME, STACK AND PROCESS OF PRODUCING THE SAME, AND METAL OXIDE FILM 有权
标题翻译：电解质溶液及使用其形成氧化膜的方法，其制造方法及其制备方法和氧化金属膜
公开(公告)号：US20090023001A1
公开(公告)日：2009-01-22
申请号：US11577144
申请日：2005-09-29
申请人： Fumikazu Mizutani , Toshiaki Sakakihara , Yasuhiro Kawase , Makoto Ishikawa
发明人： Fumikazu Mizutani , Toshiaki Sakakihara , Yasuhiro Kawase , Makoto Ishikawa
IPC分类号： B32B15/04 , C25D11/00
CPC分类号： C25D11/02 , C25D11/06 , C25D11/10 , C25D11/26
摘要： A high-quality oxide film which is free from a pinhole and surface roughing caused by anodic oxidation and which has surface smoothness on a surface of a material to be treated containing a metal as a principal component. An electrolyte solution which is used for forming an oxide film on a surface of a material to be treated containing a metal as a principal component by anodic oxidation, the electrolyte solution containing a non-aqueous solvent containing an alcoholic hydroxyl group and having 4 or more carbon atoms as a main solvent. This non-aqueous solvent preferably contains two or more alcoholic hydroxyl groups and is especially preferably one or two or more members selected from the group consisting of diethylene glycol, triethylene glycol and polyethylene glycol. A method of forming an oxide film including a step of anodically oxidizing a material to be treated containing a metal as a principal component in this electrolyte solution
摘要翻译：一种高品质的氧化膜，其不含针孔和由阳极氧化引起的表面粗糙化，并且在待处理的材料的表面上具有表面平滑度，其中含有金属作为主要成分。一种用于在通过阳极氧化包含金属作为主要成分的待处理材料的表面上形成氧化物膜的电解质溶液，所述电解质溶液含有含有醇羟基且含有4个或更多个的羟基的非水溶剂碳原子作为主要溶剂。该非水溶剂优选含有两个以上的醇羟基，特别优选为选自二甘醇，三甘醇和聚乙二醇中的一种或两种以上的成分。一种形成氧化膜的方法，包括在该电解质溶液中含有金属作为主要成分的待处理材料的阳极氧化步骤

10. 发明授权

US07407569B2 Gold plating solution and gold plating method 失效
标题翻译：镀金液和镀金方法
公开(公告)号：US07407569B2
公开(公告)日：2008-08-05
申请号：US10937392
申请日：2004-09-10
申请人： Fumikazu Mizutani , Hiroshi Takaha , Makoto Ishikawa , Yasuhiro Kawase
发明人： Fumikazu Mizutani , Hiroshi Takaha , Makoto Ishikawa , Yasuhiro Kawase
IPC分类号： C25D3/48
CPC分类号： C25D3/48
摘要： A gold plating solution comprising iodide ions, gold iodide complex ions and a non-aqueous solvent, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution. The present invention further provides a gold plating solution comprising iodide ions, gold iodide complex ions, a non-aqueous solvent and a water-soluble polymer, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution and which is capable of forming a gold plating film in which gold crystal particle sizes are very fine and grain boundaries are dense. The present invention further provides a gold plating method employing such a gold plating solution.
摘要翻译：包含碘离子，碘化金配合离子和非水溶剂的金电镀溶液，其毒性和稳定性较低，同时具有与氰化物型镀金液相当的性能。本发明还提供了一种含有碘离子，碘化金离子，非水溶剂和水溶性聚合物的金电镀溶液，其毒性和稳定性较低，同时具有与氰化物型镀金液相当的性能，其能够形成金结晶粒子非常细且晶界密集的镀金膜。本发明还提供了使用这种镀金液的镀金方法。

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