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1. 发明专利

JP2013159784A Method for producing plated material, and plated material 审中-公开
标题翻译：生产材料和材料的方法
公开(公告)号：JP2013159784A
公开(公告)日：2013-08-19
申请号：JP2012019646
申请日：2012-02-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Industries Corp , 株式会社豊田自動織機 , Du Pont Kk , デュポン株式会社 , Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： YANAGIMOTO HIROSHI , YOSHIDA TAKASHI , OMURO WATARU , TANIBUCHI SHUHEI , SAWAZAKI KOICHI , NAKATSUJI ERIKA
IPC分类号： C25D5/56 , B32B15/088 , C23C18/20 , C23C18/32
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a plated material, capable of securing, when a plated material having a nickel plating film formed by electroless plating and a copper plating film covering a surface of the nickel plating film is heated, the adhesion strength of the electrolytic nickel plating film to a treated surface of a resin substrate.SOLUTION: A method for producing the plated material 1 includes the steps of: adsorbing a metal catalyst to the treated surface 11 of the resin substrate 10; covering the treated surface 11 with the metal catalyst adsorbed thereto with the electroless nickel plating film 20; and covering the surface of the electroless nickel plating film 20 with the copper plating film 30. In the step of covering with the electroless nickel plating film 20, the electroless nickel plating film is formed until it has a film thickness capable of preventing, when the plated material 20 being produced is heated, ionized copper ions of the copper plating film 30 from dispersing to the resin substrate 10 through the electroless nickel plating film 20.
摘要翻译：要解决的问题：为了提供一种电镀材料的制造方法，当通过无电解电镀形成的镀镍膜的镀覆材料和覆盖镍镀膜的表面的镀铜膜被加热时，能够确保附着力将电解镍电镀膜的强度提高到树脂基板的处理表面。解决方案：制造电镀材料1的方法包括以下步骤：将金属催化剂吸附到树脂基板10的处理表面11上; 用被化学镀镍膜20吸附在其上的金属催化剂覆盖被处理表面11; 并且用镀铜膜30覆盖无电解镀镍膜20的表面。在用无电镀镍膜20覆盖的步骤中，形成化学镀镍膜，直到其具有能够防止当加热生产的镀覆材料20，镀铜膜30的离子化铜离子通过化学镀镍膜20分散到树脂基板10。

2. 发明专利

JP2009024244A Method for manufacturing resin substrate having metal-resin composite layer 有权
标题翻译：用于制造具有金属树脂复合层的树脂基材的方法
公开(公告)号：JP2009024244A
公开(公告)日：2009-02-05
申请号：JP2007191119
申请日：2007-07-23
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： BESSHO TAKESHI , NAGAMURA MANABU , YOSHIDA TAKASHI , KUMAGAI KYOKO , SHIMO TOSHIHISA
IPC分类号： C23C18/30 , H05K3/18 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To improve adhesion strength of a plating film to a resin-metal composite layer as thin as 10-200 nm.
SOLUTION: A plating deposition adjustment step of facilitating deposition of plating inside the resin-metal composite layer is carried out between a catalyst adsorption step and a plating step. This results in the formation of many anchors and therefore improves adhesion strength of the plating film by an anchoring effect.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提高镀膜对薄至10-200nm的树脂 - 金属复合层的粘附强度。解决方案：在催化剂吸附步骤和镀覆步骤之间进行电镀沉积调整步骤，其有利于电镀在树脂 - 金属复合层内的沉积。这导致许多锚的形成，因此通过锚固效果提高了镀膜的粘附强度。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2011063855A Method for manufacturing base material to be electroless-plated 有权
标题翻译：制造基材的电镀方法
公开(公告)号：JP2011063855A
公开(公告)日：2011-03-31
申请号：JP2009216029
申请日：2009-09-17
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： NAGAMURA MANABU , SHIMO TOSHIHISA , KATO ISAMI , YOSHIDA TAKASHI , BESSHO TAKESHI
IPC分类号： C23C18/20
CPC分类号： C23C18/26 , C23C18/204 , C23C18/2066
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a base material to be electroless-plated which can improve the lowering of an adhesion strength between a base resin material and an electroless-plated film, which occurs in an environment of high temperature and high humidity. SOLUTION: A method for manufacturing the base material to be electroless-plated is used for manufacturing the base material to be electroless-plated of which the surface is plated by electroless plating, and includes: an ozone treatment step of forming a modified layer on the surface of the body of the base material by bringing the body of the base material formed of a resin in contact with a solution containing ozone; and a surface layer removal step of imparting energy onto the surface of the modified layer to remove the surface layer of the modified layer after the ozone treatment step. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造无电镀基材的方法，其可以改善在高环境中发生的基础树脂材料和化学镀膜之间的粘附强度的降低温度和高湿度。解决方案：用于制造待化学镀的基材的方法用于制造通过无电镀覆盖表面的待化学镀的基材，并且包括：臭氧处理步骤，形成经修饰的通过使由树脂形成的基材的主体与含有臭氧的溶液接触而在基材的主体的表面上形成层; 以及表面层去除步骤，在臭氧处理步骤之后，在改性层的表面上施加能量以去除改性层的表面层。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009259900A Resin substrate with noble metal fixed to surface layer thereof, and manufacturing method therefor, and circuit board and manufacturing method therefor 有权
标题翻译：具有固定在其表面层上的金属的树脂基板及其制造方法及其电路板及其制造方法
公开(公告)号：JP2009259900A
公开(公告)日：2009-11-05
申请号：JP2008104651
申请日：2008-04-14
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： BESSHO TAKESHI , YOSHIDA TAKASHI , KUMAGAI KYOKO , NAGAMURA MANABU , SHIMO TOSHIHISA
IPC分类号： H05K3/18 , B32B15/08 , C08J7/04 , C23C18/30
摘要： PROBLEM TO BE SOLVED: To manufacture a printed-circuit board which is superior in fine interconnected board and the high-frequency characteristics, because the plating having high adhesive strength can be conducted on the smooth resin of a resin board, having the layer with the plating of copper or the like and a resin mixed in nanometer-scale on a resin surface layer, having a very high plating adhesion on the smooth resin.
SOLUTION: The method for manufacturing the resin board comprises the steps of: creating a triazine ring in the resin by heat-treating cyanate series built-up resin; and reforming the surface layer of the resin base substance by ozone water and immersing it in catalyst liquid, including a noble metal complex ion to integrally form a resin-metal composite layer with fine metal particles uniformly dispersed in the resin matrix, and fixing the noble metal by a triazine ring. The method for manufacturing the circuit board comprises the steps of: forming the metal film on the surface of the resin board, with the noble metal as a core by electroless plating; and removing the metal film, thereafter.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了制造精细互连板优异的印刷电路板和高频特性，因为可以在树脂板的光滑树脂上进行具有高粘合强度的电镀，具有具有铜等的电镀层和在树脂表面层上以纳米级混合的树脂，在光滑树脂上具有非常高的电镀附着力。解决方案：制造树脂板的方法包括以下步骤：通过热处理氰酸酯系列组合树脂在树脂中形成三嗪环; 用臭氧水重整树脂基体物质的表层，并将其浸渍在包含贵金属配合物离子的催化剂液体中，以一体地形成均匀分散在树脂基质中的金属微粒的树脂金属复合层，并将贵金属金属由三嗪环组成。制造电路板的方法包括以下步骤：在树脂板的表面上形成金属膜，用贵金属作为芯通过化学镀; 然后除去金属膜。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008291288A Ozone solution treatment method of resin substrate, and wiring board manufacturing method 有权
标题翻译：树脂基板的臭氧处理方法和接线板制造方法
公开(公告)号：JP2008291288A
公开(公告)日：2008-12-04
申请号：JP2007135747
申请日：2007-05-22
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： BESSHO TAKESHI , KUMAGAI KYOKO , YOSHIDA TAKASHI , NAGAMURA MANABU , SHIMO TOSHIHISA
IPC分类号： C23C18/30 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To maintain the surface smoothness of a resin substrate, to achieve high and uniform deposition strength of a plated film, and to shorten the ozone treatment time.
SOLUTION: A resin substrate is treated with a first ozone solution having the high activation rate, and after that, the resin substrate is treated with a second ozone solution having the activation rate lower than that of the first ozone solution. The first ozone solution easily erodes the resin substrate, and easily forms a modifying layer even when organic stain is deposited on its surface. By the subsequent treatment with the second ozone solution, unevenness is averaged, the surface smoothness is enhanced, and variance of local erosion is averaged thereby.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了保持树脂基板的表面光滑度，可以实现镀膜的高且均匀的沉积强度，并缩短臭氧处理时间。解决方案：用具有高活化速率的第一臭氧溶液处理树脂基板，然后用比第一臭氧溶液的活化速率低的第二臭氧溶液处理树脂基板。第一种臭氧溶液容易侵蚀树脂基材，即使有机污渍沉积在其表面上也容易形成改性层。通过随后用第二臭氧溶液处理，平均不均匀，提高了表面平滑度，从而平均了局部侵蚀的变化。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2011060969A Manufacturing method for wiring substrate 审中-公开
标题翻译：接线基板的制造方法
公开(公告)号：JP2011060969A
公开(公告)日：2011-03-24
申请号：JP2009208481
申请日：2009-09-09
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： BESSHO TAKESHI , HARA ATSUMASA , YOSHIDA TAKASHI , KUMAGAI KYOKO , NAGAMURA MANABU
IPC分类号： H05K3/18 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a wiring substrate which allows fabrication by a simple process with good adhesion between a resin substrate and a circuit, suppresses transmission loss in a high frequency band when used as a high-frequency antenna, and has a hole that enables precise etching due to the fact that a copper layer forming a circuit is thin. SOLUTION: The manufacturing method for the wiring substrate includes a process to form a hole 2 in a resin substrate 1 with a surface roughness (Rz) of less than 5 μm (preferably no more than 1 μm), a process to perform reform treatment on the surface of the resin substrate 1 using ozone water, a process to make copper plating on the surface of the resin substrate 1 after the reform treatment of the surface, and a process to perform etching treatment of the copper plated layer based on the predetermined pattern. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供允许通过树脂基板和电路之间的良好粘附性的简单工艺制造的布线基板，当用作高频天线时抑制高频带中的传输损耗，并且具有由于形成电路的铜层薄的事实，能够进行精密蚀刻的孔。解决方案：布线基板的制造方法包括在表面粗糙度（Rz）小于5μm（优选不大于1μm）的树脂基板1中形成孔2的工序，使用臭氧水对树脂基板1的表面进行改性处理，在表面改性处理之后，在树脂基板1的表面上进行镀铜的工序，以及对铜镀层进行蚀刻处理的工序，基于预定模式。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2008294077A Method of manufacturing wiring substrate and wiring substrate 审中-公开
标题翻译：制造接线基板和接线基板的方法
公开(公告)号：JP2008294077A
公开(公告)日：2008-12-04
申请号：JP2007135768
申请日：2007-05-22
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： BESSHO TAKESHI , KUMAGAI KYOKO , YOSHIDA TAKASHI , NAGAMURA MANABU , SHIMO TOSHIHISA
IPC分类号： H05K3/18 , C23C18/30 , H05K3/22 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To improve adhesion strength of a plating film even if a resin-metal composite layer is thin, 10 to 200 nm in concrete.
SOLUTION: A resin-metal composite layer is subjected to plating, and then a resin substrate is heated to shrink a resin matrix. The precipitated plating metal is surrounded by the shrunk resin, so that the adhesion strength of a plating film can be further improved.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提高电镀膜的粘合强度，即使树脂 - 金属复合层较薄，在混凝土中为10〜200nm。解决方案：对树脂金属复合层进行镀覆，然后加热树脂基板以收缩树脂基体。沉淀的电镀金属被收缩树脂包围，从而可以进一步提高镀膜的粘附强度。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008294074A Resin substrate for ozone treatment, and wiring substrate and its manufacturing method 有权
标题翻译：用于臭氧处理的树脂基材和配线基板及其制造方法
公开(公告)号：JP2008294074A
公开(公告)日：2008-12-04
申请号：JP2007135740
申请日：2007-05-22
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： BESSHO TAKESHI , KUMAGAI KYOKO , YOSHIDA TAKASHI , NAGAMURA MANABU , SHIMO TOSHIHISA
IPC分类号： H05K3/38 , H05K1/03
CPC分类号： C23C18/2086 , C23C18/1653 , C23C18/1694 , C23C18/2006 , C23C18/2033 , H05K3/181 , H05K3/381 , H05K2203/087
摘要： PROBLEM TO BE SOLVED: To improve adhesion strength of a plating film even if a resin-metal composite layer is thin, 10 to 200 nm in concrete. SOLUTION: A resin substrate, which is made of at least either of a plural kinds of resin mixtures with different erodable degrees by an ozone solution and a plural kinds of resin-containing elements with different erodable degrees by an ozone solution in their molecules, is treated by ozone water so as to form a modified layer, and a catalyst metal is absorbed by the modified layer to form a resin-metal composite layer, which is subjected to plating. Erodable elements by the ozone solution are eluted in the ozone solution, and a pore or a clearance at nano (nm) level is produced between a hard-to-erode element and an easy-to-erode element. At that time, plating is precipitated therein, thus improving adhesion strength by anchor effect. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提高电镀膜的粘合强度，即使树脂 - 金属复合层较薄，在混凝土中为10〜200nm。解决方案：一种树脂基板，其由臭氧溶液具有不同可蚀性程度的多种树脂混合物中的至少一种和通过臭氧溶液具有不同可侵蚀程度的多种含树脂的元件制成，分子被臭氧水处理以形成改性层，并且催化剂金属被改性层吸收以形成经过电镀的树脂 - 金属复合层。臭氧溶液中的可腐蚀元素在臭氧溶液中被洗脱，并且在难侵蚀元件和易于侵蚀的元件之间产生在纳米（nm）水平上的孔隙或间隙。此时，电镀沉淀在其中，从而通过锚固效果提高粘合强度。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2013104004A Filler and manufacturing method of the same 审中-公开
标题翻译：填料及其制造方法
公开(公告)号：JP2013104004A
公开(公告)日：2013-05-30
申请号：JP2011249401
申请日：2011-11-15
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KUDO HIDEHIRO , GOMI RYOSUKE , YOSHIDA TAKASHI , TANAKA KATSUAKI
IPC分类号： C09C3/08 , C07C67/08 , C07C69/40 , C07C69/82 , C07F5/06
摘要： PROBLEM TO BE SOLVED: To provide a filler that excels in the kneading properties with a resin, and is excellent in thermal conductivity, and a manufacturing method of the same.SOLUTION: The filler includes: an inorganic particle that has a hydroxyl group on the surface in the existence of water; and an organic modifying group that bonds to an atom that composes the inorganic particle of the surface of the inorganic particle shown by formula (1), and the manufacturing method of the same is disclosed. In the formula, Rdenotes a(n) (un)saturated hydrocarbon in which an optional hydrogen atom may be replaced with a carboxyl group.

10. 发明专利

JP2012253151A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2012253151A
公开(公告)日：2012-12-20
申请号：JP2011123695
申请日：2011-06-01
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KUDO HIDEHIRO , YOSHIDA TAKASHI , TANAKA KATSUAKI , GOMI RYOSUKE
IPC分类号： H05K7/20 , C09C3/08 , C09J11/04 , C09J163/00 , F04B39/00 , F04C29/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic device which is capable of cooling a heating element and can be easily miniaturized.SOLUTION: A bottom wall 12a of a housing as a heat dissipation member and a power module 22 as a heating element are bonded together via an adhesive layer B. The adhesive layer B contains a modified thermally conductive filler having an organic compound bonded to surfaces of inorganic particles, and an epoxy resin.

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