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1. 发明专利

JP2013159784A Method for producing plated material, and plated material 审中-公开
标题翻译：生产材料和材料的方法
公开(公告)号：JP2013159784A
公开(公告)日：2013-08-19
申请号：JP2012019646
申请日：2012-02-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Industries Corp , 株式会社豊田自動織機 , Du Pont Kk , デュポン株式会社 , Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： YANAGIMOTO HIROSHI , YOSHIDA TAKASHI , OMURO WATARU , TANIBUCHI SHUHEI , SAWAZAKI KOICHI , NAKATSUJI ERIKA
IPC分类号： C25D5/56 , B32B15/088 , C23C18/20 , C23C18/32
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a plated material, capable of securing, when a plated material having a nickel plating film formed by electroless plating and a copper plating film covering a surface of the nickel plating film is heated, the adhesion strength of the electrolytic nickel plating film to a treated surface of a resin substrate.SOLUTION: A method for producing the plated material 1 includes the steps of: adsorbing a metal catalyst to the treated surface 11 of the resin substrate 10; covering the treated surface 11 with the metal catalyst adsorbed thereto with the electroless nickel plating film 20; and covering the surface of the electroless nickel plating film 20 with the copper plating film 30. In the step of covering with the electroless nickel plating film 20, the electroless nickel plating film is formed until it has a film thickness capable of preventing, when the plated material 20 being produced is heated, ionized copper ions of the copper plating film 30 from dispersing to the resin substrate 10 through the electroless nickel plating film 20.
摘要翻译：要解决的问题：为了提供一种电镀材料的制造方法，当通过无电解电镀形成的镀镍膜的镀覆材料和覆盖镍镀膜的表面的镀铜膜被加热时，能够确保附着力将电解镍电镀膜的强度提高到树脂基板的处理表面。解决方案：制造电镀材料1的方法包括以下步骤：将金属催化剂吸附到树脂基板10的处理表面11上; 用被化学镀镍膜20吸附在其上的金属催化剂覆盖被处理表面11; 并且用镀铜膜30覆盖无电解镀镍膜20的表面。在用无电镀镍膜20覆盖的步骤中，形成化学镀镍膜，直到其具有能够防止当加热生产的镀覆材料20，镀铜膜30的离子化铜离子通过化学镀镍膜20分散到树脂基板10。

2. 发明专利

JP2009019096A Cover-lay 审中-公开
标题翻译：封面
公开(公告)号：JP2009019096A
公开(公告)日：2009-01-29
申请号：JP2007182279
申请日：2007-07-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： C08G73/10 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a cover-lay that exhibits excellent dimensional stability and excellent heat resistance, is endowed with properties adaptable to AOI and is excellent in running properties (easily sliding properties) and adhesive properties.
SOLUTION: The cover-lay comprises a polyimide film mainly composed of p-phenylene diamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride as an acid dianhydride component and an adhesive layer formed on one surface thereof, where in the polyimide film a powder is dispersed mainly composed of inorganic particles having a particle size within the range of 0.01-1.5 μm and an average particle size of 0.05-0.7 μm in a ratio of 0.1-0.9 wt.% based on the weight of the film resin.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的尺寸稳定性和优异的耐热性的覆盖层，具有适用于AOI的性能，并且具有优异的运行性能（易滑动性）和粘合性能。解决方案：覆盖层包括主要由对苯二胺和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜和作为酸二酐组分的均苯四酸二酐和在其一个表面上形成的粘合剂层，其中在聚酰亚胺膜中，主要由0.01〜1.5μm的粒径和0.05〜0.7μm的平均粒径的无机粒子构成的粉末以0.1-0.9重量％的比例分散，薄膜树脂。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009018520A Copper clad plate 审中-公开
标题翻译：铜箔板
公开(公告)号：JP2009018520A
公开(公告)日：2009-01-29
申请号：JP2007183773
申请日：2007-07-13
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , KOKUNI MASAHIRO , SAWAZAKI KOICHI
IPC分类号： B32B15/088 , C08J5/12 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate reduced in the rate of dimensional change after etching while satisfying both dimensional change and heat resistance, having characteristics adaptable for AOI, also excellent in running property (slidability) and adhesiveness, and suitable for a high-performance flexible printed wiring board.
SOLUTION: The copper clad plate comprises: a polyimide film mainly including 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as diamine component and pyromellitic dianhydride as acid dianhydride component, the film having slidability obtained by adding inorganic fine particles to generate surface projections thereon; a copper plate adhered to one surface of the polyimide film through an adhesive; and a copper plate adhered to the other surface of the film without adhesive.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在蚀刻后减小尺寸变化率的铜包覆板，同时满足尺寸变化和耐热性，具有适用于AOI的特性，还具有优异的运行性能（滑动性）和粘合性，以及适用于高性能柔性印刷线路板。解决方案：铜包覆层包括：主要包含3,4'-二氨基二苯醚和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜和作为酸二酐组分的均苯四酸二酐，该膜具有通过添加无机物获得的滑动性细颗粒以在其上产生表面突起; 通过粘合剂粘附在聚酰亚胺膜的一个表面上的铜板; 并且在没有粘合剂的情况下粘附到膜的另一个表面的铜板。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008211045A Chip-on film 审中-公开
标题翻译：芯片电影
公开(公告)号：JP2008211045A
公开(公告)日：2008-09-11
申请号：JP2007047427
申请日：2007-02-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： H01L21/60 , C08J5/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a chip-on film which has high dimension stability, a moderate elasticity, excellent smoothability and flexibility and is applicable to an automatic optical inspection (AOI) system. SOLUTION: In the chip-on film having a wiring 2 formed on at least one surface of a polyimide film 1 so as to mount an IC chip, the polyimide film 1 principally comprises PPD and ODA as diamine components and pyromellitic dianhydride and BPDA as dianhydride components, and inorganic particles having particle size of 0.01-1.5 μm and an average particle size of 0.05-0.7 μm and having particle size distribution in which particles of 0.15-0.60 μm has ≥80 volume% in total particles are dispersed/contained in a proportion of 0.1-0.9 wt.% per film resin weight in the polyimide film 1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有高尺寸稳定性，适度弹性，优异的平滑性和柔韧性的贴片膜，并且适用于自动光学检查（AOI）系统。解决方案：在具有形成在聚酰亚胺膜1的至少一个表面上的布线2以便安装IC芯片的贴片膜上，聚酰亚胺膜1主要包含作为二胺组分的PPD和ODA作为二氢苯四酸二酐，作为二酐成分的BPDA，粒径为0.01〜1.5μm，平均粒径为0.05〜0.7μm，粒径分布为0.15〜0.60μm的粒子的总粒子的体积％为80体积％的无机粒子，在聚酰亚胺膜1中以每薄膜树脂重量计0.1-0.9重量％的比例含有。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008208255A Chip-on-film 审中-公开
标题翻译： CHIP-ON-FILM
公开(公告)号：JP2008208255A
公开(公告)日：2008-09-11
申请号：JP2007047429
申请日：2007-02-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： C08J5/18 , C08K3/00 , C08L79/00 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a chip-on-film having moderate modulus in combination with high dimensional stability and also having excellent slipperiness and bendability, and adaptable to the automatic optical inspection (AOI) system. SOLUTION: The chip-on-film has a wiring formed on at least one side of a polyimide film so as to mount IC chips. In this chip-on-film, the polyimide film is composed mainly of 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as diamine components and pyrromellitic dianhydride as an acid dianhydride component, and 0.1-0.9 wt.%, per film resin weight of inorganic particles being 0.01-1.5 μm in size with an average size of 0.05-0.7 μm and having such a size distribution that particles 0.15-0.60 μm in size account for 80 vol.% or greater of the total particles are dispersed in the polyimide film. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有中等模量的片上芯片，具有高尺寸稳定性并且还具有优异的滑爽性和弯曲性，并且适用于自动光学检测（AOI）系统。解决方案：膜上芯片具有形成在聚酰亚胺膜的至少一侧上的布线，以安装IC芯片。在该片上胶片中，聚酰亚胺膜主要由3,4'-二氨基二苯醚和4,4'-二氨基二苯醚作为二胺成分和作为酸二酐成分的吡咯单体二酐组成，0.1-0.9重量％每个薄膜树脂重量的无机颗粒尺寸为0.01-1.5μm，平均尺寸为0.05-0.7μm，并且具有这样的尺寸分布，使得尺寸为0.15-0.60μm的颗粒占总颗粒的80体积％或更大分散在聚酰亚胺膜中。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008166555A Flexible printed wiring board 审中-公开
标题翻译：柔性印刷接线板
公开(公告)号：JP2008166555A
公开(公告)日：2008-07-17
申请号：JP2006355334
申请日：2006-12-28
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , SAWAZAKI KOICHI , MAEDA SHU
IPC分类号： H05K1/03 , C08J5/18 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which minute wiring can be formed and which has proper running performance (easy slidability) and will not deform, even if lead-free solder is used.
SOLUTION: The flexible printed wiring board contains a polyimide film, principally comprising 3,4'-diaminophenylether and 4,4'-diaminodiphenylether as a diamine component and a pyromellitic acid dihydride as an acid dihydride component, and further containing minute inorganic particles, wherein wiring is formed on one surface or on both surfaces of the polyimide film, with or without an adhesive.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使使用无铅焊料，也可以提供能够形成微细布线且具有适当的运行性能（易滑动性）并且不会变形的柔性印刷布线板。解决方案：柔性印刷线路板包含聚酰亚胺膜，主要包含作为二胺组分的3,4'-二氨基苯基醚和4,4'-二氨基二苯基醚和作为酸二酐组分的均苯四酸二酐，并且还含有微量无机颗粒，其中在聚酰亚胺膜的一个表面或两个表面上形成布线，具有或不具有粘合剂。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008143037A Copper clad plate 审中-公开
标题翻译：铜箔板
公开(公告)号：JP2008143037A
公开(公告)日：2008-06-26
申请号：JP2006333207
申请日：2006-12-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , KOKUNI MASAHIRO , SAWAZAKI KOICHI
IPC分类号： B32B15/088 , C08G73/10 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate reduced in its rate of dimensional change after etching, having characteristics adaptable to AOI, also superior in slidability and adhesiveness and suitable for a flexible printed wiring board.
SOLUTION: The copper clad plate is constituted by bonding a copper plate, via an adhesive, to one side or both sides of a film, which is a polyimide film formed of diamine components being 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether and an acid dianhydride component being a pyromellitic acid dianhydride. The polyimide film has inorganic particles having particle sizes of 0.01-1.5 μm, an average particle size of 0.05-0.7 μm and a particle size distribution wherein the ratio of inorganic particles with particle sizes of 0.15-0.60 μm occupies 80 vol.% or above of the whole particles dispersed therein in a ratio of 0.1-0.9 wt.% of the resin of the film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种在蚀刻后减小其尺寸变化率的铜包覆板，具有适用于AOI的特性，滑动性和粘合性也优异并且适用于柔性印刷线路板。解决方案：铜包覆板通过粘合剂将铜板与由二胺组分形成的聚酰亚胺膜作为3,4'-二氨基二苯基醚和4个二胺组成的膜的一侧或两侧，4'-二氨基二苯醚和酸二酐组分是均苯四酸二酐。聚酰亚胺膜具有粒径为0.01〜1.5μm，平均粒径为0.05〜0.7μm的无机粒子和粒径为0.15〜0.60μm的无机粒子的比率为80体积％以上的粒径分布。的分散在其中的整个颗粒的比例为膜的树脂的0.1-0.9重量％。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008106140A Polyimide film and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：JP2008106140A
公开(公告)日：2008-05-08
申请号：JP2006290151
申请日：2006-10-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08L79/08 , C08K3/00
CPC分类号： C08G73/1042 , C08J5/18 , C08J2379/08 , C08K7/18 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0266
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide film that has excellent running properties, adhesiveness and dimensional stability of a film and is applicable to an automatic optical inspection system (AOI) of a flexible printed circuit board (FPC) or a chip-on-film (COF) and to provide a method for producing the same. SOLUTION: The polyimide film is produced mainly by imidation from p-phenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic acid dianhydride as an acid dianhydride component and comprises 0.1-0.9 wt.% based on the weight of a film resin of inorganic particles, having particle diameters in a range of 0.01-1.5 μm, an average particle diameter of 0.05-0.7 μm and a particle size distribution in which ≥80 vol.% based on the total particles of inorganic particles having particle diameters of 0.15-0.60 μm, dispersed into the film. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有优异的运行性能，粘合性和膜的尺寸稳定性的聚酰亚胺膜，并且可应用于柔性印刷电路板（FPC）或芯片的自动光学检测系统（AOI） - 膜（COF），并提供其制造方法。解决方案：聚酰亚胺膜主要通过由对苯二胺和4,4'-二氨基二苯醚作为二胺组分和作为酸二酐组分的均苯四甲酸二酐的酰亚胺化产生，并且包含0.1-0.9重量％粒径为0.01〜1.5μm，平均粒径为0.05〜0.7μm，粒径分布为≥80体积％的无机粒子的无机粒子的薄膜状树脂直径为0.15-0.60μm，分散在膜中。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006182842A Polyimide film 有权
标题翻译：聚酰亚胺膜
公开(公告)号：JP2006182842A
公开(公告)日：2006-07-13
申请号：JP2004375848
申请日：2004-12-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , OSAKI IKURO , YONENAGA OSAMU
IPC分类号： C08J5/18 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film excellent in easily slidable property, capable of reducing the close adhesion of films with each other at a hinge part on laminating many layers of substrate plates by a hot press, and also dissolving a "sounding" trouble caused by the rubbing of the films with each other.
SOLUTION: This polyimide film is provided by having streak-like unevenness on its surface, 0.1-0.7 static frictional coefficient of the film surfaces with each other and 0.8-3.0 μm film surface roughness.
COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2004331788A Polyimide film and metal wiring board using the same 审中-公开
公开(公告)号：JP2004331788A
公开(公告)日：2004-11-25
申请号：JP2003128767
申请日：2003-05-07
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： YASUDA MASABUMI , SUEHIRO MORITSUGU , SAWAZAKI KOICHI
IPC分类号： C08J5/18 , C08G73/10 , H01L21/60 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film which, when applied for a metal wiring board substrate for a flexible printed circuit, CSP, BGA or TAB tape the surface of which is provided with a metal wiring, shows high elastic modulus, a low coefficient of thermal expansion, excellent alkali etching property and film formability; to provide its manufacturing method; and to provide a metal wiring circuit board comprising it as a substrate.
SOLUTION: The polyimide film, obtained from a polyamic acid using 3,4'-oxydianiline as the diamine component, has a number of times of folding endurance (MIT) of ≥20,000 and a coefficient of linear expansion (CTE) of 13-22 ppm/°C.
COPYRIGHT: (C)2005,JPO&NCIPI

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