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    • 4. 发明授权
    • Method of producing large-area membrane masks
    • 生产大面积膜面膜的方法
    • US06455429B1
    • 2002-09-24
    • US09669469
    • 2000-09-25
    • Jörg ButschkeFlorian LetzkusElisabeth PentekerReinhard SpringerBernd HöfflingerHans Löschner
    • Jörg ButschkeFlorian LetzkusElisabeth PentekerReinhard SpringerBernd HöfflingerHans Löschner
    • H01L21302
    • G03F1/20G03F1/22
    • Inventive methods are provided for the production of large-area membrane masks, wherein an inexpedient mechanical excessive strain on the membrane or of the membrane layer/etching stop layer/supporting wafer system or the resulting breaking of the components is avoided, which excessive strain occurs particularly due to the employment of an etching cell or generally due to the thin semiconductor layers. The stripping of the semiconductor support layer is preferably performed in two partial steps that are carried out in a mechanically sealed etching cell or with a protective coating, or that one partial step is performed with an etching cell and one with a protective coating, or that the stripping of the semiconductor support layer is performed in a mechanically sealed etching cell initially with a supporting grid and that the supporting grid is removed only after withdrawal from the etching cell.
    • 提供了用于生产大面积膜掩模的本发明的方法,其中避免了膜或膜层/蚀刻停止层/支撑晶片系统上的不适当的机械过度应变或所得到的部件断裂,这种过度的应变发生 特别是由于使用蚀刻单元或通常由于薄的半导体层而导致。 半导体支撑层的剥离优选以机械密封的蚀刻池或保护涂层中进行的两个部分步骤进行,或者用蚀刻池和一个保护涂层进行一个部分步骤,或 半导体支撑层的剥离在最初具有支撑栅格的机械密封蚀刻池中执行,并且仅在从蚀刻单元退出之后才移除支撑栅。
    • 5. 发明授权
    • Structuring device for processing a substrate
    • 用于处理基板的结构装置
    • US06419752B1
    • 2002-07-16
    • US09399303
    • 1999-09-17
    • Igor V. ShvetsIvajlo W. RangelowPeter GüthnerJens VoightGuido MariottoHans Löschner
    • Igor V. ShvetsIvajlo W. RangelowPeter GüthnerJens VoightGuido MariottoHans Löschner
    • C23C1600
    • H01J37/32357C23C16/04H01J2237/3321
    • A structuring device (SD) for processing a surface of a substrate (SB), comprising a substrate chamber (VC) for mounting the substrate (SB) and a reaction chamber (GC) enabling a gas reaction at a given operating pressure. The reaction chamber (GC) has at least one gas inlet (GL) for a reaction gas and at least one injection outlet (JL) leading into the substrate chamber, while the substrate chamber (VC) is provided with a pumping system (PP) for maintaining a vacuum within the substrate chamber at a pressure not above the operating pressure of the gas reaction in the reaction chamber (GC). The injection outlet (JL) is provided with at least one injection pipe ending into an injection opening of given width, the injection pipe having a length not smaller than the width of the injection opening, the injection pipe forming the gas particles originating from the gas reaction into a gas jet streaming out of the injection opening. For controlling the distance between the injection opening and the substrate surface (SB) at a height of the order of or below the width of the opening as measured along the axis of the injection pipe, the injection outlet and/or the substrate are provided with a positioning means (NP,SP).
    • 一种用于处理衬底表面的结构设备(SD),包括用于安装衬底(SB)的衬底室(VC)和能够在给定工作压力下进行气体反应的反应室(GC)。 反应室(GC)具有用于反应气体的至少一个气体入口(GL)和通向基板室的至少一个喷射出口(JL),而基板室(VC)设置有泵送系统(PP) 用于在不高于反应室(GC)中的气体反应的操作压力的压力下在基板室内保持真空。 注射口(JL)设置有至少一个注射管,其终止于给定宽度的注射开口,注射管的长度不小于注射开口的宽度,注射管形成来自气体的气体颗粒 反应成从喷射口流出的气体喷射。 为了控制注射开口和基底表面之间的距离(SB),其沿着注射管的轴线测量的开口宽度的数量级以下,注射口和/或基底设置有 定位装置(NP,SP)。