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    • 3. 发明申请
    • Megasonic processing system with gasified fluid
    • 具有气化流体的超声波处理系统
    • US20050087209A1
    • 2005-04-28
    • US10931457
    • 2004-09-01
    • Thomas NicolosiYi WuIsmail Kaskkoush
    • Thomas NicolosiYi WuIsmail Kaskkoush
    • B08B3/12H01L21/00
    • H01L21/67051B08B3/12B08B2203/005G03F7/42G03F7/425G03F7/428H01L21/02052
    • An apparatus and method for substrate processing, specifically including cleaning and/or photoresist stripping, in non-immersion type megasonic processing tools. In one embodiment, the invention utilizes the concept of dissolving a gas into a liquid at or near the point of use with a gasifier, such as a membrane contactor, during the processing of the substrate, thus eliminating the need for pre-made liquid/gas processing mixtures that are typically stored in auxiliary tanks. In one aspect, the invention is an apparatus comprising: a process chamber having a support for supporting a substrate; a source of liquid; a supply line coupling said source of liquid to said process chamber; a gasifier operatively coupled to said supply line, said gasifier causing a gas to be dissolved into said liquid to form a mixture of said liquid and said gas; means for applying a film of said mixture to one side of said substrate while on said support, said first means being in fluid association with said supply line; and a transmitter configured to apply sonic energy to said substrate. The method comprises, in one aspect: supporting a substrate in a process chamber; supplying a liquid to said process chamber from a source of said liquid via a supply line; dissolving a gas into said liquid with a gasifer operatively coupled to said supply line to form a mixture of said liquid and said gas; applying a film of said mixture to one side of said substrate; and applying sonic energy to said substrate while said mixture is being applied. When used to remove photoresist from substrates, the fluid will preferably be deionized water and the gas will be ozone gas.
    • 一种用于非浸没式兆声处理工具中的衬底处理的装置和方法,具体包括清洗和/或光刻胶剥离。 在一个实施方案中,本发明利用在基材处理期间将气体溶解到与使用点处或附近的液体的概念,例如膜接触器,因此不需要预制的液体/ 通常储存在辅助罐中的气体处理混合物。 一方面,本发明是一种装置,包括:处理室,具有用于支撑基板的支撑件; 液体来源; 将所述液体源连接到所述处理室的供应管线; 气化器,其可操作地耦合到所述供应管线,所述气化器引起气体溶解到所述液体中以形成所述液体和所述气体的混合物; 用于在所述支撑件上将所述混合物的膜施加到所述衬底的一侧上的装置,所述第一装置与所述供应管线流体相连; 以及发射机,被配置为向所述基底施加声能。 该方法在一个方面包括:在处理室中支撑衬底; 通过供应管线从所述液体源向所述处理室供应液体; 将气体溶解到所述液体中,其中气体可操作地连接到所述供应管线以形成所述液体和所述气体的混合物; 将所述混合物的膜施加到所述基底的一侧; 以及在施加所述混合物时将声能施加到所述衬底。 当用于从基底去除光致抗蚀剂时,流体优选是去离子水,气体将是臭氧气体。