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    • 1. 发明专利
    • Substrate support device and substrate conveyance device
    • 基板支撑装置和基板输送装置
    • JP2013131265A
    • 2013-07-04
    • JP2011279259
    • 2011-12-21
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • YOSHIZUKA KOICHIYAMADA SATOSHI
    • G11B5/84G11B5/851
    • B25J15/0047B25J15/0019B25J17/0233C23C14/505G11B5/8404
    • PROBLEM TO BE SOLVED: To provide a substrate support device capable of further improving a buffer effect to prevent damage and breakage of a substrate even when the soft substrate is used.SOLUTION: The substrate support device includes: a first connection section 81 which is connected to a substrate support section 5 for supporting the substrate and includes a first magnet 4a; a second connection section 82 which is disposed oppositely to the first connection section 81, can be connected to a conveyance robot for conveying the substrate to a conveyance holder and includes a second magnet 4b magnetically coupled to the first magnet 4a; and a spacer 40a for holding an interval between the first connection section 81 and the second connection section 82. The first connection section 81 and the second connection section 82 are relatively movable in a surface direction of the substrate via the spacer 40a.
    • 要解决的问题:提供一种能够进一步提高缓冲效果的基板支撑装置,即使在使用软基板时也能够防止基板的损坏和破损。解决方案:基板支撑装置包括:第一连接部81,其连接 到用于支撑基板的基板支撑部分5,并且包括第一磁体4a; 与第一连接部81相对设置的第二连接部82可以连接到输送机器人,用于将基板输送到输送保持器,并且包括磁耦合到第一磁体4a的第二磁体4b; 以及用于在第一连接部81和第二连接部82之间保持间隔的间隔件40a.第一连接部81和第二连接部82经由间隔件40a在基板的表面方向上相对移动。
    • 3. 发明专利
    • Sputtering apparatus having shutter mechanism
    • 具有快门机构的飞溅装置
    • JP2009155706A
    • 2009-07-16
    • JP2007337370
    • 2007-12-27
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • KOBAYASHI YUKIHIROYOSHIZUKA KOICHIOTA TOSHIYUKI
    • C23C14/34
    • C23C14/568C23C14/3407H01J37/34H01J37/3447
    • PROBLEM TO BE SOLVED: To provide a sputtering apparatus which surely prevents sputtered particles from scattering out and from flowing in a neighbor target, inhibits an occurrence of a shadow effect, and prevents the exfoliation of a film and the formation of particles by eliminating a contacting state.
      SOLUTION: A shutter device of the sputtering apparatus has a shutter mechanism provided on a plurality of targets 23 and 24 which are installed in the inside of vacuum chambers 17A to 17C for forming the film therein, so as to prevent the targets from contaminating each other. The shutter mechanism has fixed parts 53 and 54 of the shutter, and movable parts 56 and 59 of the shutter for shielding. When the shutter closes, the fixed part of the shutter and the movable part of the shutter which approach to each other form a gap. The gap is formed so as to have a bent shape, particularly a bent shape of being bent in a U-shape in a cross section that is perpendicular to the target, so that when a particle going straight ahead passes through the gap, it surely collides with a wall forming the gap; and accordingly forms a shielding state.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了提供一种能够可靠地防止溅射的颗粒在邻近目标物体中散射和流出的溅射装置,可以抑制阴影效应的发生,防止膜的剥离和颗粒的形成 消除接触状态。 解决方案:溅射装置的快门装置具有设置在多个靶23和24上的快门机构,该快门机构安装在用于在其中形成薄膜的真空室17A至17C的内部,以防止目标 互相污染 快门机构具有活门的固定部分53和54以及用于屏蔽的快门的可移动部分56和59。 当快门关闭时,快门的固定部分和彼此靠近的快门的可移动部分形成间隙。 该间隙形成为具有弯曲形状,特别是弯曲成与垂直于靶的横截面呈U字形的弯曲形状,使得当直线前进的颗粒通过间隙时,其可靠地 与形成间隙的壁碰撞; 并因此形成屏蔽状态。 版权所有(C)2009,JPO&INPIT