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    • 1. 发明专利
    • TEMPERATURE CONTROL LABEL
    • JPH07286914A
    • 1995-10-31
    • JP10147794
    • 1994-04-15
    • LINTEC CORPKIROKU SOZAI SOGO KENKYUSHO KK
    • SUGIZAKI TOSHIOOKABE HIDEAKIKOGURE MASAOSAITO TAKANORI
    • B42D15/00G01K11/12
    • PURPOSE:To easily and surely determine whether or not the storage temperature of an article has risen above a predetermined temperature by bonding first and second labeling sheets together using a porous sheet, and containing a temperature controlling agent in one or more of the sheets. CONSTITUTION:A first labeling sheet has an adhesive layer which is provided on one side of a base sheet made preferably of a vinyl chloride resin and the like and which contains an organic chelate coupler. A second labeling sheet has an adhesive layer which is provided on one side of a base sheet and which contains a metallic compound that is colored when reacted with the organic chelate coupler, and both adhesive layers are bonded together by a porous sheet and at least one of the sheets contains a temperature controlling agent such as n-paraffin. As the temperature controlling agent flows within the porous sheet in a melting temperature range, either the metallic compound or the organic chelate coupler migrates within the porous sheet and is colored by reaction between them on contact. The color does not disappear even with the sheet kept below the melting point, and is detected to easily and surely determine whether or not the storage temperature of an article has risen above a predetermined temperature.
    • 4. 发明专利
    • VIBRATION DAMPING AND REINFORCING SHEET
    • JPH0835538A
    • 1996-02-06
    • JP19367194
    • 1994-07-25
    • LINTEC CORP
    • SAITO MASAHIKOTAKANO AKIHIKOKOGURE MASAOSAITO TAKANORI
    • F16F15/02B32B7/02B32B15/04B32B25/04B32B27/00B32B27/06F16F9/30
    • PURPOSE:To obtain a vibration damping and reinforcing sheet which is provided with the reinforcing performance and vibration controlling performance of an attached body, by forming a lamination body which is formed by laminating a restrained layer for providing the reinforcing effect of the attached body and the vibration controlling layer for providing the vibration controlling effect of the attached body, through an adhesive agent layer. CONSTITUTION:A vibration controlling and reinforcing sheet A is constituted so that a lamination body 2 is formed by laminating a restrained layer 3 and a vibration controlling layer 5 through an adhesive agent layer 4, and a viscous adhesive agent layer 6 is formed on the vibration controlling layer 5 of the lamination body 2, and a mold separating sheet 7 is attached to the viscous adhesive agent layer 6. The vibration control layer 5 is constituted by a viscoelastic member which consists mainly of unvulcanized rubber and has a vulcanizing agent added to it, and the rubber hardness before vulcanization (JISK-6300 rotor L type Mooney viscometer ML1+4 100 deg.C) is 10-80. Further, the dynamic shearing elasticity modulus after vulcanization is 1X10 -1X10 dyn/cm . The restrained layer 3 is a layer for developing the reinforcing effect of an attached body, and is constituted by a relatively hard material. The viscous adhesive agent layer 6 is constituted by a viscous adhesive agent which possesses the strong adhesive force when hardened through heating, light beam irradiation, and ventilation cut-off.
    • 6. 发明专利
    • WAFER DICING METHOD AND RADIATION IRRADIATING DEVICE APPLYING SAID METHOD
    • JPH0536828A
    • 1993-02-12
    • JP19237891
    • 1991-07-31
    • LINTEC CORP
    • KOGURE MASAOMINEURA YOSHIHISANOGUCHI ISATO
    • H01L21/301H01L21/78
    • PURPOSE:To obtain a required chip interval in the expanding step by a method wherein the radiation dosage at which the wafer bonded part of a bonding agent layer is irradiated is specified as not to exceed the specific value of the radiation dosage at which the not wafer bonded part is irradiated. CONSTITUTION:A releasable sheet 4 is removed and after mounting the bonding agent layer 3 of a bonding sheet 1 upward, a semiconductor wafer A to be diced is bonded onto the surface of the bonding agent layer 3. Next, respective wafer chips are picked up from the bonding sheet 1 to be mounted on a specific base. At this time, the bonding agent layer 3 of the bonding sheet 1 is irradiated with the radiation B before or on the pick-up time so as to polymerize and set the polymerizing compound to be contained in the bonding agent layer 3. The bonding sheet 1 is irradiated with the radiation B from the surface of a base material 2 whereon the bonding agent layer 3 is not provided. At this time, the radiation dosage at which the wafer bonded part is irradiated is specified to be 1-90% preferably 5-30% of the radiation dosage at which the not wafer bonded part is irradiated.