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1. 发明专利

JP2014112743A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014112743A
公开(公告)日：2014-06-19
申请号：JP2014061706
申请日：2014-03-25
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA KEIJI , ISHIDA MASAAKI
IPC分类号： H01L23/12
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is highly reliable in that it does not emit electromagnetic noises to the outside.SOLUTION: A semiconductor device according to an embodiment comprises: a circuit board having an insulating substrate, a plurality of wires constituting a first wiring layer provided on the upper surface side of the insulating substrate, a plurality of wires constituting a second wiring layer provided on the lower surface side of the insulating substrate, and a copper or tungsten cutting plane exposed on a side surface of the insulating substrate; a semiconductor element mounted on the upper surface side of the circuit board; a sealing resin layer that is provided on the upper surface of the circuit substrate and seals the semiconductor element and a conductive member connected to the semiconductor element; a conductive shield layer covering the sealing resin layer and a part of an end of the circuit board; external connection terminals, on the lower side of the circuit board, connected to each of the plural wires constituting the second wiring layer; and a lead wire, on the lower side of the circuit board, connected to one wire disposed at the outermost side among the plural wires constituting the second wiring layer.
摘要翻译：要解决的问题：提供一种高可靠性的半导体器件，其不向外部发射电磁噪声。根据实施例的半导体器件包括：具有绝缘基板的电路板，构成设置在所述绝缘基板的上表面侧的第一布线层，构成设置在所述绝缘基板的下表面侧的第二布线层的多根布线以及暴露在所述绝缘基板的侧面的铜或钨切割面基质; 安装在电路板的上表面侧的半导体元件; 密封树脂层，设置在电路基板的上表面上并密封半导体元件和连接到半导体元件的导电构件; 覆盖所述密封树脂层和所述电路板的端部的一部分的导电屏蔽层; 电路板下侧的外部连接端子连接到构成第二布线层的多条线中的每一条线上; 以及在构成所述第二布线层的所述多根配线中的与配置在所述最外侧的一根导线连接的所述电路基板的下侧的引线。

2. 发明专利

JP2010187420A Waveguide diplexer and waveguide 有权
标题翻译：波导DIPLEX和波导
公开(公告)号：JP2010187420A
公开(公告)日：2010-08-26
申请号：JP2010126994
申请日：2010-06-02
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI , SESHIMO KIYOSHI , SHOJI TOSHIHIRO
IPC分类号： H01P1/213 , H01P3/123 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To improve performance by simply and easily achieving highly precise production. SOLUTION: First to third direct pipes 141, 142, 143 forming a waveguide path 14 are laminated to form a desired waveguide path shape by respectively piling up and disposing a plurality of plates of first to seventh plate-like bodies 101 to 107. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过简单且容易地实现高精度生产来提高性能。解决方案：通过分别堆叠和布置多个第一至第七板状体101至107的板，层压形成波导路径14的第一至第三直管141,142,143以形成所需的波导路径形状。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2008177667A Portable information terminal device 审中-公开
标题翻译：便携式信息终端设备
公开(公告)号：JP2008177667A
公开(公告)日：2008-07-31
申请号：JP2007007097
申请日：2007-01-16
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H04B1/50 , H04B1/18 , H04B1/3822 , H04B1/40 , H04B1/44 , H04B7/26 , H04W16/28 , H04W88/02
CPC分类号： H04B1/0057
摘要： PROBLEM TO BE SOLVED: To provide a portable information terminal device mounted with a multi-radio system capable of realizing radio communication having high CN ratio with the minimum number of antennas. SOLUTION: The portable information terminal device has a first casing 20a, a second casing 30a and a hinge 40. The first casing 20a has an antenna 21, active circuits 23a, 23b corresponding to a plurality of frequency bands; a demultiplexing/multiplexing circuit 22 for demultiplexing a received signal for each frequency, outputting the divided signals to the corresponding circuits 23a, 23b and multiplexing the transmitted signals; and a demultiplexing/multiplexing circuit 27 for multiplexing a reception signal and demultiplexing the transmission signal for each frequency and outputting the signals to the corresponding active circuits 23a, 23b. The second casing 30a has radio systems 32, 33; and a demultiplexing/multiplexing circuit 31 for demultiplexing the reception signal outputted from the demultiplexing/multiplexing circuit 27 for each frequency band and outputting the signals to the corresponding radio system, and multiplexing the transmission signals from the radio systems 32, 33. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装有能够实现具有最小数量天线的CN比高的无线电通信的多无线电系统的便携式信息终端装置。解决方案：便携式信息终端装置具有第一壳体20a，第二壳体30a和铰链40.第一壳体20a具有对应于多个频带的天线21，有源电路23a，23b; 用于对每个频率的接收信号进行解复用的解复用/多路复用电路22，将分频信号输出到相应的电路23a，23b并对发送的信号进行多路复用; 以及用于对接收信号进行多路复用和解复用每个频率的发送信号的解复用/多路复用电路27，并将信号输出到相应的有源电路23a，23b。第二壳体30a具有无线电系统32,33; 以及解复用/复用电路31，用于对从频分多路复用电路27输出的每个频带的接收信号进行解复用，并将信号输出到相应的无线电系统，并对来自无线电系统32,33的传输信号进行多路复用。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007208848A Antenna 审中-公开
标题翻译：天线
公开(公告)号：JP2007208848A
公开(公告)日：2007-08-16
申请号：JP2006027541
申请日：2006-02-03
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H01Q9/40 , H01Q9/38 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To provide an antenna which can be made compact in size, can achieve the widening of a frequency band and has improved antenna characteristics.
SOLUTION: An antenna 1 has: a dielectric layer 112; a first exciting layer 12 on the dielectric layer 112; dielectric layers 113-116 on the first exciting layer 12; a second exciting layer 17 disposed on the first exciting layer 12 while facing it through the dielectric layers 113-116; and a feeder 14 connected to one end of the first exciting layer 12 and one end of the second exciting layer 17. The feeder 14 is held between a first shield layer 12S and a second shield layer 17S. Furthermore, the antenna 1 is equipped with via wiring (13S and 16S) to connect the other end of the first exciting layer 12 and the other end of the second exciting layer 17.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以使其尺寸紧凑的天线，可以实现频带的扩大，并且具有改善的天线特性。解决方案：天线1具有：电介质层112; 电介质层112上的第一激发层12; 第一激发层12上的电介质层113-116; 第一激励层17，其设置在第一激励层12上，同时面向电介质层113-116; 以及连接到第一激励层12的一端和第二激发层17的一端的馈电器14.馈电器14保持在第一屏蔽层12S和第二屏蔽层17S之间。此外，天线1配备有通孔布线（13S和16S），以连接第一激励层12的另一端和第二激发层17的另一端。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006024618A Wiring board 审中-公开
标题翻译：接线板
公开(公告)号：JP2006024618A
公开(公告)日：2006-01-26
申请号：JP2004199203
申请日：2004-07-06
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H05K3/46 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which can be manufactured easily, assures small insertion loss, and can improve the electromagnetic shielding properties. SOLUTION: The wiring substrate comprises a first dielectric material layer 10 formed on a first ground pattern 11; a signal pattern 12 formed on the first dielectric material layer; first and second coplanar ground patterns 13, 14; a second dielectric material layer 15 formed on the first dielectric material layer covering the signal pattern, first coplanar ground pattern, and second coplanar ground pattern; a second ground pattern 16 formed on the second dielectric material layer; first through-holes 17 arranged at predetermined intervals so as to be in parallel with the signal pattern by connecting the first ground pattern, first coplanar ground pattern, and second ground pattern; and second through-holes 18 arranged at the predetermined intervals in parallel with the signal pattern by connecting the first ground pattern, second coplanar ground pattern, and second ground pattern. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供容易制造的布线板，确保小的插入损耗，并且可以提高电磁屏蔽性能。解决方案：布线基板包括形成在第一接地图案11上的第一介电材料层10; 形成在第一介电材料层上的信号图案12; 第一和第二共面接地图案13,14; 形成在覆盖信号图案的第一介电材料层上的第二介电材料层15，第一共面接地图案和第二共面接地图案; 形成在第二介电材料层上的第二接地图案16; 第一通孔17，其以预定间隔布置成与信号图案平行，通过连接第一接地图案，第一共面接地图案和第二接地图案; 以及通过连接第一接地图案，第二共面接地图案和第二接地图案，以与信号图案平行的预定间隔布置的第二通孔18。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005312068A Microwave module 有权
标题翻译：微波模块
公开(公告)号：JP2005312068A
公开(公告)日：2005-11-04
申请号：JP2005138710
申请日：2005-05-11
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H01P11/00 , H01P5/02 , H04B1/50
摘要： PROBLEM TO BE SOLVED: To promote downsizing to highly accurately separate a high frequency signal in a frequency manner. SOLUTION: In a diplexer 10, a waveguide 11 is formed for separating a high frequency transmission signal and a high frequency reception signal in a frequency manner, and a transmission system connecting port 12, a receiving system connecting port 13 and an antenna connecting port 14 communicated to the waveguide 11 are provided in its outer peripheral portion. On one side of the diplexer 10, a circuit part having a high frequency transmission circuit 18 connected to the transmitting system connecting port 12, a high frequency reception circuit 19 connected to the receiving system connecting port 13 and a DC circuit 17 is stacked and disposed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了促进小型化，以高频率的方式高精度地分离高频信号。解决方案：在双工器10中，形成用于以频率方式分离高频传输信号和高频接收信号的波导11，以及传输系统连接端口12，接收系统连接端口13和天线在其外周部设置有与波导11连通的连接口14。在双工器10的一侧，具有连接到发送系统连接端口12的高频传输电路18，连接到接收系统连接端口13的高频接收电路19和DC电路17的电路部分被堆叠和布置。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005277022A Multilayer substrate and transceiving module 审中-公开
标题翻译：多层基板和收发模块
公开(公告)号：JP2005277022A
公开(公告)日：2005-10-06
申请号：JP2004086849
申请日：2004-03-24
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H05K3/46 , H01P3/08 , H04B1/38
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a multilayer substrate capable of connecting the ground of a microstrip line and a housing ground with low impedance in a short distance, and a transceiving module capable of being reduced in size and price.
SOLUTION: The multilayer substrate includes a front face layer L1 having a low frequency region where lines 30-32 for use of low frequency signals are formed and a high frequency region where lines 33 and 34 for use of high frequency signals are formed, a rear face layer L4 connected with the housing ground 40, a first inner layer L2 formed between the front face layer L1 and the rear face layer L4 to face the low frequency regions 30-32 and connected with the rear face layer L4 through a through hole TH passing from the front face layer L1 through the rear face layer L4, and a second inner layer L3 formed between the first inner layer L1 and the rear face layer L4 to face the high frequency region and connected with the rear face layer L4 through an interstitial via hole IVH.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够在短距离内连接微带线路和低阻抗的壳体接地的多层基板，以及能够减小尺寸和价格的收发模块。解决方案：多层基板包括具有低频区域的正面层L1，其中形成用于低频信号的线30-32，以及形成用于高频信号的线33和34的高频区域与外壳接地40连接的背面层L4，形成在正面层L1和背面层L4之间的第一内层L2，以面对低频区域30-32并且通过一个通孔TH从前面层L1穿过背面层L4，第二内层L3形成在第一内层L1和背面层L4之间，以面向高频区域并与背面层L4连接通过间隙通孔IVH。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005012124A High-frequency module, and high-frequency apparatus having the module mounted thereon 审中-公开
标题翻译：高频模块和具有该模块的高频设备
公开(公告)号：JP2005012124A
公开(公告)日：2005-01-13
申请号：JP2003177072
申请日：2003-06-20
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a small-sized high-frequency module capable of preventing its input and output signals from coupling to each other.
SOLUTION: The small-sized high-frequency module is provided with a module substrate 11 having a module conductor layer 12, a second circuit element 14 having input and output portions 14a, 14b which is so provided on the surface of the module substrate 11 as to process high-frequency signals, and first and second bump-columns 59, 60 sandwiching the second circuit element 14 between them and provided in parallel with the direction of coupling to each other the input and output portions 14a, 14b of the second circuit element 14 and connected electrically with the module conductor layer 12.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够防止其输入和输出信号彼此耦合的小型高频模块。
解决方案：小型高频模块设置有具有模块导体层12的模块基板11，具有输入和输出部分14a，14b的第二电路元件14，其设置在模块的表面上用于处理高频信号的基板11以及将第二电路元件14夹在它们之间并与彼此并联的方向彼此并联设置的第一和第二突起柱59,60彼此连接的方式彼此相关联的输入和输出部分14a，14b 第二电路元件14并与模块导体层12电连接。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2009152705A Computer and switching circuit 审中-公开
标题翻译：计算机与开关电路
公开(公告)号：JP2009152705A
公开(公告)日：2009-07-09
申请号：JP2007326681
申请日：2007-12-19
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H04B1/40
CPC分类号： G06F1/1698 , G06F1/1616 , G06F1/1677 , H01Q1/2266
摘要： PROBLEM TO BE SOLVED: To provide a computer capable of continuing operation without stopping a communication function, while keeping a state where an SAR permission value is not exceeded.
SOLUTION: An RF module 42 generates a high-frequency transmission signal. An inclination sensor 31 detects an inclination of a computer to detect that an antenna is set in a state where the antenna may come close to a user's body. A mode sensor 32 detects that a first housing unit is closed by facing other main plane of a first housing unit and one main plane of the second housing unit. A control circuit 35 generates a switching signal when a detection signal is not less than a predetermined level, in a case where the mode sensor detects that the first housing unit is closed by facing other main plane of the first housing unit and one main plane of the second housing unit, and concurrently where the antenna is set in the state where the antenna may come close to a user's body. A switching circuit 36 outputs, to the antenna, the high-frequency transmission signal after relatively attenuating the high-frequency transmission signal in comparison with the high-frequency transmission signal in the case where the switching signal is not inputted, in a case where the switching signal is inputted.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不停止通信功能的情况下继续操作的计算机，同时保持没有超过SAR允许值的状态。解决方案：RF模块42产生高频传输信号。倾斜传感器31检测计算机的倾斜度，以检测天线设置在天线可能靠近用户身体的状态。模式传感器32通过面对第一壳体单元的另一个主平面和第二壳体单元的一个主平面来检测第一壳体单元是闭合的。当检测信号不小于预定值时，控制电路35产生切换信号，在模式传感器检测到第一壳体单元通过面对第一壳体单元的另一个主平面而闭合的情况下，以及一个主平面第二壳体单元，并且天线设置在天线可能靠近用户身体的状态的同时。在没有输入切换信号的情况下，开关电路36将与高频发送信号相比较的高频发送信号相对衰减后的高频发送信号输出到天线切换信号被输入。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2005012123A High-frequency circuit board and high-frequency module using same circuit board 审中-公开
标题翻译：高频电路板和使用相同电路板的高频模块
公开(公告)号：JP2005012123A
公开(公告)日：2005-01-13
申请号：JP2003177071
申请日：2003-06-20
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIDA MASAAKI
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a small-sized high-frequency circuit board and a high-frequency module using the same circuit board wherein the impedance matching of its wiring to its element is made possible without increasing the number of its components.
SOLUTION: The small-sized high-frequency circuit board has a ground wiring layer, each first wiring provided on the front surface of the ground wiring layer via a first insulation layer, each first electrode pad provided in the end portion of each first wiring and having a width-dimension nearly equal to each first wiring, each second wiring provided on the rear surface of the ground wiring layer via a second insulation layer and having an impedance nearly equal to each first wiring and having a different width-dimension from each first wiring, and each second electrode pad provided in the end portion of each second wiring and having a width-dimension nearly equal to each second wiring.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供使用相同电路板的小型高频电路板和高频模块，其中使得其线路与其元件的阻抗匹配成为可能而不增加其部件的数量。
解决方案：小型高频电路板具有接地布线层，每个第一布线经由第一绝缘层设置在接地布线层的前表面上，每个第一电极焊盘设置在每个第一绝缘层的端部第一布线并且具有几乎等于每个第一布线的宽度尺寸，每个第二布线经由第二绝缘层设置在接地布线层的后表面上，并且具有几乎等于每个第一布线的阻抗并且具有不同的宽度尺寸并且每个第二电极焊盘设置在每个第二布线的端部中，并且具有几乎等于每个第二布线的宽度尺寸。版权所有（C）2005，JPO＆NCIPI

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