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1. 发明专利

JP2013179449A Radio device and information processing device and memory device including the same 有权
标题翻译：无线电设备和信息处理设备和包括其的存储设备
公开(公告)号：JP2013179449A
公开(公告)日：2013-09-09
申请号：JP2012041832
申请日：2012-02-28
申请人： Toshiba Corp , 株式会社東芝
发明人： HASHIMOTO HIROSHI , TSUTSUMI YUKAKO , ITO TAKAYOSHI , AKITA KOJI , YAMADA KEIJI
IPC分类号： H04B1/38 , H01L23/00 , H01L23/29 , H01L23/31 , H01Q1/38 , H01Q1/40 , H01Q23/00 , H05K9/00
CPC分类号： H01L23/552 , H01L23/3128 , H01L2223/6677 , H01L2224/16225 , H01L2224/48227 , H01L2924/15311 , H01L2924/3025 , H01Q9/0407 , H01Q9/265 , H01Q9/285 , H01Q13/10 , H01Q23/00 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a radio device having an antenna which efficiently emits or receives electric waves while improving the shield effect.SOLUTION: A radio device includes: a circuit board 101; a semiconductor chip 102; a sealing resin 104; a conductive film 105; and an antenna element 103. The semiconductor chip 102 is mounted on the circuit board 101 and incorporates a transmitter-receiver circuit. The sealing resin 104 seals the semiconductor chip 102. The conductive film 105 covers a part of a surface of the sealing resin 104. Further, an opening 108 is formed at a position that is located in another part, excluding the part of the surface, on the surface of the sealing resin 104 and is the closest position to an antenna terminal 107 connected with the antenna element 103.
摘要翻译：要解决的问题：提供一种具有天线的无线电设备，该天线在提高屏蔽效果的同时有效地发射或接收电波。解决方案：无线电设备包括：电路板101; 半导体芯片102; 密封树脂104; 导电膜105; 和天线元件103.半导体芯片102安装在电路板101上并且包括发射机 - 接收机电路。密封树脂104密封半导体芯片102.导电膜105覆盖密封树脂104的一部分表面。此外，开口108形成在除了表面的一部分之外的另一部分中的位置，在密封树脂104的表面上并且是与天线元件103连接的天线端子107最接近的位置。

2. 发明专利

JP2012160578A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2012160578A
公开(公告)日：2012-08-23
申请号：JP2011019273
申请日：2011-01-31
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA KEIJI , ISHIDA MASAAKI
IPC分类号： H01L23/00 , H01L23/12 , H01L23/28 , H05K9/00
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3107 , H01L23/3128 , H01L23/49805 , H01L23/49811 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L23/5286 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48644 , H01L2224/48655 , H01L2224/48744 , H01L2224/48755 , H01L2224/48844 , H01L2224/48855 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/97 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2224/83 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which does not radiate electromagnetic noise to the exterior.SOLUTION: A semiconductor device according to the embodiment includes: a circuit board having an insulation substrate, multiple wiring lines forming a first wiring layer provided at the upper surface side of the insulation substrate, multiple wiring lines forming a second wiring layer provided at the lower surface side of the insulation substrate, and multiple vias penetrating from an upper surface to a lower surface of the insulation substrate; a semiconductor element mounted on an upper surface of the circuit board; a sealing resin layer sealing the semiconductor element and a conductive member and provided at the upper surface of the circuit substrate; and a conductive shield layer covering the sealing resin layer and a part of an end part of the circuit board. Any of the multiple vias are electrically connected with the conductive shield layer, and any of the multiple wire lines forming the second wiring layer may reach the ground potential. The respective wire lines of the second wiring layer which may reach the ground potential electrically connect with any of the multiple vias.
摘要翻译：要解决的问题：提供不会向外部辐射电磁噪声的高度可靠的半导体器件。解决方案：根据实施例的半导体器件包括：具有绝缘基板的电路板，形成设置在绝缘基板的上表面侧的第一布线层的多条布线，形成设置有第二布线层的多条布线在所述绝缘基板的下表面侧，从所述绝缘基板的上表面贯穿到所述绝缘基板的下表面的多个通孔; 安装在所述电路板的上表面上的半导体元件; 密封树脂层，密封半导体元件和导电构件，设置在电路基板的上表面; 以及覆盖密封树脂层和电路板的端部的一部分的导电屏蔽层。多个通孔中的任一个与导电屏蔽层电连接，并且形成第二布线层的多个线路中的任一个可能达到地电位。可能达到接地电位的第二布线层的相应线路与多个通孔中的任一个电连接。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012039104A Semiconductor package and mobile communication device using the same 有权
标题翻译：使用相同的半导体封装和移动通信设备
公开(公告)号：JP2012039104A
公开(公告)日：2012-02-23
申请号：JP2011155437
申请日：2011-07-14
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA KEIJI , YAMAZAKI TAKASHI , FUKUDA MASATOSHI , KOSHIO YASUHIRO
IPC分类号： H01L23/28 , H01L23/00 , H01L23/12
CPC分类号： H01L23/552 , H01L23/3114 , H01L23/3128 , H01L23/49805 , H01L23/49816 , H01L23/49827 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package which suppresses leakage of unnecessary electromagnetic waves from the semiconductor package and improves the adhesion between a shield layer and ground wiring of an interposer substrate.SOLUTION: According to an embodiment, a semiconductor package 1 comprises: a semiconductor chip 4 mounted on an interposer substrate 2; and a conductive shield layer 7 covering a sealing resin layer 5 and at least part of side surfaces of the interposer substrate 2. The interposer substrate 2 has multiple veers 24, which penetrate through an insulation base material 21. Parts (24A) of the multiple veers 24 are exposed to the side surfaces of the interposer substrate 2 and has a cut surface C which is cut in the thickness direction of the interposer substrate 2. The cut surface C of the veer 24A is electrically connected with the conductive shield layer 7.
摘要翻译：要解决的问题：提供一种半导体封装，其抑制来自半导体封装的不必要的电磁波的泄漏，并提高屏蔽层与插入器基板的接地布线之间的粘附性。解决方案：根据实施例，半导体封装1包括：安装在插入器基板2上的半导体芯片4; 以及覆盖密封树脂层5和中介层基板2的侧面的至少一部分的导电性屏蔽层7.内插基板2具有穿过绝缘基材21的多个转子24.多个部件（24A）转子24暴露于插入件基板2的侧面，并且具有沿着插入件基板2的厚度方向切割的切割面C.切割面24A的切割面C与导电性屏蔽层7电连接。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012033764A Electromagnetic shield sheet and method of producing the same 审中-公开
标题翻译：电磁屏蔽片及其制造方法
公开(公告)号：JP2012033764A
公开(公告)日：2012-02-16
申请号：JP2010172732
申请日：2010-07-30
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA KEIJI
IPC分类号： H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic shield sheet which exhibits excellent magnetic field shield properties even if it is made thin, and to provide a method of producing the same.SOLUTION: A plurality of first ferromagnetic layers 2 and second ferromagnetic layers 3 are laminated, and the laminated ferromagnetic layer is sandwiched by conductive layers 1, 1 to produce an electromagnetic shield sheet S1. The first and second ferromagnetic layers 2, 3 are ferromagnetic bodies having conductivity and magnetic anisotropy, and laminated such that the easy axis direction of the first ferromagnetic layer 2 and the easy axis direction of the second ferromagnetic layer 3 intersect perpendicularly.
摘要翻译：要解决的问题：提供一种即使薄得多也显示优异的磁场屏蔽性能的电磁屏蔽片，并提供其制造方法。解决方案：层叠多个第一铁磁层2和第二铁磁层3，并且将层叠的铁磁层夹在导电层1,1之间以产生电磁屏蔽片S1。第一和第二铁磁层2,3是具有导电性和磁各向异性的铁磁体，并且层压，使得第一铁磁层2的易轴方向和第二铁磁层3的易轴方向垂直相交。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2010206182A Electromagnetic shielding sheet 审中-公开
标题翻译：电磁屏蔽片
公开(公告)号：JP2010206182A
公开(公告)日：2010-09-16
申请号：JP2010014458
申请日：2010-01-26
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA KEIJI
IPC分类号： H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic shielding sheet having excellent magnetic field shielding characteristics even if the sheet is reduced in thickness, which solves such a problem that, since the use of a thin conductive sheet lowers a magnetic field shielding effect, the thickness of the conductive sheet should be increased to some extent, and as a result, it is difficult to completely seal electronic parts because of the poor flexibility of the sheet, thus failing to obtain the high shielding effect.
SOLUTION: The electromagnetic shielding sheet includes a laminate film formed by laminating ferromagnetic layers 2 between conductive layers 1 formed of a non-magnetic material. The ferromagnetic layer 2 has electric field/magnetic field shielding effects in both cases that μF is a positive value and where the μF is a negative value when the μF is the specific magnetic permeability of a ferromagnetic material. The electric field/magnetic field shielding effects become greater as the absolute value of the μF becomes greater.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使薄片厚度减小也具有优异的磁场屏蔽特性的电磁屏蔽片，这解决了由于使用薄导电片降低磁场屏蔽效应的问题导电片的厚度应该在一定程度上增加，结果是由于片材柔性差而难以完全密封电子部件，因此不能获得高屏蔽效果。解决方案：电磁屏蔽片包括通过在由非磁性材料形成的导电层1之间层叠铁磁层2而形成的层压膜。在μF为正值的两种情况下，铁磁层2具有电场/磁场屏蔽效应，并且当μF为铁磁材料的比磁导率时，μF为负值。当μF的绝对值变大时，电场/磁场屏蔽效应变大。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2014112743A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014112743A
公开(公告)日：2014-06-19
申请号：JP2014061706
申请日：2014-03-25
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA KEIJI , ISHIDA MASAAKI
IPC分类号： H01L23/12
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is highly reliable in that it does not emit electromagnetic noises to the outside.SOLUTION: A semiconductor device according to an embodiment comprises: a circuit board having an insulating substrate, a plurality of wires constituting a first wiring layer provided on the upper surface side of the insulating substrate, a plurality of wires constituting a second wiring layer provided on the lower surface side of the insulating substrate, and a copper or tungsten cutting plane exposed on a side surface of the insulating substrate; a semiconductor element mounted on the upper surface side of the circuit board; a sealing resin layer that is provided on the upper surface of the circuit substrate and seals the semiconductor element and a conductive member connected to the semiconductor element; a conductive shield layer covering the sealing resin layer and a part of an end of the circuit board; external connection terminals, on the lower side of the circuit board, connected to each of the plural wires constituting the second wiring layer; and a lead wire, on the lower side of the circuit board, connected to one wire disposed at the outermost side among the plural wires constituting the second wiring layer.
摘要翻译：要解决的问题：提供一种高可靠性的半导体器件，其不向外部发射电磁噪声。根据实施例的半导体器件包括：具有绝缘基板的电路板，构成设置在所述绝缘基板的上表面侧的第一布线层，构成设置在所述绝缘基板的下表面侧的第二布线层的多根布线以及暴露在所述绝缘基板的侧面的铜或钨切割面基质; 安装在电路板的上表面侧的半导体元件; 密封树脂层，设置在电路基板的上表面上并密封半导体元件和连接到半导体元件的导电构件; 覆盖所述密封树脂层和所述电路板的端部的一部分的导电屏蔽层; 电路板下侧的外部连接端子连接到构成第二布线层的多条线中的每一条线上; 以及在构成所述第二布线层的所述多根配线中的与配置在所述最外侧的一根导线连接的所述电路基板的下侧的引线。

7. 发明专利

JP2012038807A Electromagnetic shield sheet 审中-公开
标题翻译：电磁屏蔽片
公开(公告)号：JP2012038807A
公开(公告)日：2012-02-23
申请号：JP2010175449
申请日：2010-08-04
申请人： Tohoku Univ , Toshiba Corp , 国立大学法人東北大学 , 株式会社東芝
发明人： YAMADA KEIJI , YAMAGUCHI MASAHIRO , SHIMADA HIROSHI
IPC分类号： H05K9/00 , H01F1/00 , H01F1/16
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic shield sheet with an excellent magnetic-field shield property even if the sheet is made thinner.SOLUTION: An electromagnetic shield sheet includes a multilayer film having conductor layers 1 laminated to sandwich each of two or more ferromagnetic layers 2, 3. The ferromagnetic layers 2, 3 are made of two or more different kinds of ferromagnets.
摘要翻译：要解决的问题：即使使薄片变薄，也提供具有优异的磁场屏蔽性能的电磁屏蔽片。解决方案：电磁屏蔽片包括多层膜，其具有层叠以将两个或更多个铁磁层2,3中的每一个层叠的导体层1.铁磁层2,3由两种或更多种不同种类的铁磁体制成。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2014199902A 線路、スパイラルインダクタ、ミアンダインダクタ、ソレノイドコイル审中-公开
标题翻译：线，螺旋电感器，电感电感器和电磁线圈
公开(公告)号：JP2014199902A
公开(公告)日：2014-10-23
申请号：JP2013199056
申请日：2013-09-25
申请人：株式会社東芝 , Toshiba Corp
发明人： YAMADA KEIJI
IPC分类号： H01F27/00 , H01F17/00 , H01F17/06 , H01F27/28
CPC分类号： H01F5/00 , H01F17/06 , H01F2017/065
摘要：【課題】ノイズを低減できる線路を提供する。【解決手段】線路10は、中心導体20と被覆部30とを備える。前記被覆部30は、前記中心導体20を被覆する。前記被覆部30は、軟磁性体で形成されるとともに信号または電力供給を行う周波数における表皮深さよりも薄い層を少なくとも1層以上有する。【選択図】図1
摘要翻译：要解决的问题：提供能够降低噪音的线路。解决方案：线路10包括中心导体20和涂覆部分30.涂覆部分30覆盖中心导体20.涂覆部分30由软磁体材料，并且在提供信号或功率的频率中具有至少一层或多层比皮肤深度更薄的层。

9. 发明专利

JP2013179152A Wireless device, information processing apparatus comprising the same, and storage device 有权
标题翻译：无线装置，包含该装置的信息处理装置和存储装置
公开(公告)号：JP2013179152A
公开(公告)日：2013-09-09
申请号：JP2012041831
申请日：2012-02-28
申请人： Toshiba Corp , 株式会社東芝
发明人： TSUTSUMI YUKAKO , HASHIMOTO HIROSHI , ITO TAKAYOSHI , AKITA KOJI , YAMADA KEIJI
IPC分类号： H01L25/00 , H01L23/00 , H01L23/28
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/66 , H01L24/16 , H01L24/48 , H01L25/0655 , H01L25/0657 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2224/48227 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/10253 , H01L2924/1026 , H01L2924/10271 , H01L2924/10329 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01Q9/00 , H01Q13/00 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To radiate or receive electric waves efficiently while improving shielding effect.SOLUTION: A wireless device comprises a substrate, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a conductive wall. The semiconductor chip is arranged on a substrate, and comprises a transmission/reception circuit. The radiation element is formed on the substrate. The sealing resin seals the semiconductor chip. The conductive layer covers at least a part of a surface of the sealing resin. A first conductive wall is arranged in a position between the semiconductor chip and the radiation element, and is connected to the conductive layer.
摘要翻译：要解决的问题：在提高屏蔽效果的同时有效地辐射或接收电波。解决方案：无线装置包括基板，半导体芯片，辐射元件，密封树脂，导电层和导电壁。半导体芯片布置在基板上，并且包括发送/接收电路。辐射元件形成在基板上。密封树脂密封半导体芯片。导电层覆盖密封树脂表面的至少一部分。第一导电壁布置在半导体芯片和辐射元件之间的位置，并且连接到导电层。

10. 发明专利

JP2013179151A Semiconductor package, information processing apparatus comprising the same, and storage device 审中-公开
标题翻译：半导体封装，包含该封装的信息处理设备和存储设备
公开(公告)号：JP2013179151A
公开(公告)日：2013-09-09
申请号：JP2012041830
申请日：2012-02-28
申请人： Toshiba Corp , 株式会社東芝
发明人： ITO TAKAYOSHI , HASHIMOTO HIROSHI , TSUTSUMI YUKAKO , AKITA KOJI , YAMADA KEIJI
IPC分类号： H05K9/00 , H01L23/00 , H01L23/12 , H01L23/28 , H01L25/00
CPC分类号： H01L23/552 , H01L23/3121 , H01L23/66 , H01L2223/6627 , H01L2223/6677 , H01L2224/48091 , H01L2224/49175 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P5/028 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve antenna radiation while maintaining shielding performance against unnecessary electromagnetic waves.SOLUTION: A semiconductor package comprises a semiconductor chip, a first conductive layer, a second conductive layer, and a feeding portion. The semiconductor chip is arranged on a substrate, sealed by a resin, and includes a built-in transmission/reception circuit. The first conductive layer is a first conductive layer covering a first region on a surface of the resin, and is grounded. The second conductive layer is a second conductive layer covering a second region on a surface of the resin different from the first region, and is not grounded. The feeding portion electrically couples the semiconductor chip and the second conductive layer.
摘要翻译：要解决的问题：提高天线辐射，同时保持对不需要的电磁波的屏蔽性能。解决方案：半导体封装包括半导体芯片，第一导电层，第二导电层和馈电部分。半导体芯片布置在由树脂密封的基板上，并且包括内置的发送/接收电路。第一导电层是覆盖树脂表面上的第一区域并接地的第一导电层。第二导电层是覆盖与第一区域不同的树脂表面上的第二区域的第二导电层，并且不接地。馈电部分电耦合半导体芯片和第二导电层。

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