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热词
    • 95. 发明授权
    • Process for manufacturing a base for a semiconductor device
    • 半导体器件用基板的制造方法
    • US3893325A
    • 1975-07-08
    • US48608374
    • 1974-07-05
    • SATO YOSHIO
    • SATO YOSHIO
    • H01L21/06H01L21/48H01L23/488B21J13/02
    • H01L21/4878H01L21/06H01L23/488H01L2924/0002H01L2924/00
    • A process for manufacturing a base for a semiconductor device having a recess in the base on the upper surface to receive semiconductor means therein and a threaded stem extending from the bottom surface of the base, said process comprising the steps of preparing a blank of metal material; deforming by extrusion said blank with a shallower recess portion formed in said blank on the upper surface and with a shorter stem portion extending from the bottom of said blank while forming a projection on the bottom of said shallow recess portion in said blank; further deforming said blank so that said recess portion in said blank is deepened whereby said recess is formed in said base and so that said stem portion is lengthened whereby an unthreaded stem is formed; and threadedly rolling said stem on said blank.
    • 一种制造用于半导体器件的基底的方法,所述基底在所述基底上具有在所述上表面上的凹部以接收其中的半导体装置,以及从所述基底的底表面延伸的螺纹杆,所述方法包括以下步骤:制备金属材料的坯料 ; 通过挤出使所述坯料变形,其中在上表面上形成在所述坯件中的较浅的凹部,并且在从所述坯件的底部延伸的较短的杆部分上形成在所述坯件中的所述浅凹部的底部上的突起; 使所述坯料进一步变形,使得所述坯件中的所述凹部加深,由此所述凹部形成在所述基部中,并且使得所述杆部分被延长,由此形成无螺纹的杆; 并在所述坯件上螺纹地滚动所述杆。