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91. 发明授权

US07581666B2 Wire-bonding method for wire-bonding apparatus 有权
标题翻译：引线接合装置的接线方法
公开(公告)号：US07581666B2
公开(公告)日：2009-09-01
申请号：US11905868
申请日：2007-10-05
申请人： Ho-Ming Tong , Teck-Chong Lee , Chao-Fu Weng , Chian-Chi Lin , Chih-Nan Wei , Song-Fu Yang , Chia-Jung Tsai , Kao-Ming Su
发明人： Ho-Ming Tong , Teck-Chong Lee , Chao-Fu Weng , Chian-Chi Lin , Chih-Nan Wei , Song-Fu Yang , Chia-Jung Tsai , Kao-Ming Su
IPC分类号： B23K31/12 , B23K20/00 , B23K31/00
CPC分类号： H01L24/93 , B23K20/004 , H01L2224/78901 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , Y10S228/904
摘要： A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.
摘要翻译：提供了一种用于引线接合装置的引线接合方法。引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的几个第二芯片。引线键合方法包括以下步骤。首先，获得第一区域和第二区域的初始位置坐标。接下来，确定第一区域和第二区域之间的空间是否大于预定空间。当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

92. 发明申请

US20090197111A1 METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE 失效
标题翻译：生产电光器件和电光器件的方法
公开(公告)号：US20090197111A1
公开(公告)日：2009-08-06
申请号：US12365636
申请日：2009-02-04
申请人： Munehide Saimen
发明人： Munehide Saimen
IPC分类号： B32B15/16 , B23K31/00
CPC分类号： H05K3/363 , G02F1/13452 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/294 , H01L2224/2989 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/15788 , H01L2924/19043 , H01L2924/3025 , H05K3/323 , H05K3/361 , H05K2201/0221 , H05K2203/0278 , H05K2203/0425 , Y10T428/12569 , H01L2924/00014 , H01L2924/00
摘要： A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.
摘要翻译：一种制造用于将设置在电光面板上的第一端子部分电连接到基板的第二端子部分的电光装置的方法包括将包含由低熔点材料制成的导电颗粒的各向异性导电粘合剂涂覆到或者是第一端子部分或第二端子部分，并且通过在第二端子部分与第一端子部分的热压接合中通过施加热量来熔化导电颗粒而通过共晶接合将第一端子部分与第二端子部分电连接，各向异性导电粘合剂。

93. 发明授权

US07516879B1 Method of producing coaxial solder bump connections using injection molding of solder 失效
标题翻译：使用注射成型焊料生产同轴焊料凸点连接的方法
公开(公告)号：US07516879B1
公开(公告)日：2009-04-14
申请号：US12166481
申请日：2008-07-02
申请人： Stephen L. Buchwalter , Steven A. Cordes , Peter A. Gruber
发明人： Stephen L. Buchwalter , Steven A. Cordes , Peter A. Gruber
IPC分类号： B23K31/00 , B23K31/02
CPC分类号： B23K3/0638 , H05K1/0219 , H05K3/101 , H05K3/3436 , H05K3/3457 , H05K2201/09809 , H05K2203/0126
摘要： A method of forming coaxial solder bumps, which, in essence, provide rigid supports, with the use of hole-producing stencils being formed on a polymer insulator on a sacrificial substrate, wherein posts are formed within a ring structure. The holes are then filled with solder utilizing injection molding of solder, whereby both the ring and post are filled with solder, but are electrically insulated from each other, so as to provide inner and outer coaxial connections.
摘要翻译：一种形成同轴焊料凸块的方法，其本质上是提供刚性支撑件，其中使用在牺牲衬底上的聚合物绝缘体上形成的产生孔的模板，其中柱形成在环形结构内。然后利用焊料的注射成型填充焊料，由此环和柱均填充有焊料，但彼此电绝缘，从而提供内部和外部同轴连接。

94. 发明申请

US20090050679A1 METHOD AND FACILITY FOR ASSEMBLING COMPONENTS OF A VEHICLE BODY 有权
标题翻译：组装车身部件的方法和设备
公开(公告)号：US20090050679A1
公开(公告)日：2009-02-26
申请号：US11917670
申请日：2006-04-24
申请人： Gerd Gauggel
发明人： Gerd Gauggel
IPC分类号： B23K31/00 , B23K37/04
CPC分类号： B23K37/04
摘要： The assembly of body components using a geometry box (1) and clamping frames (7, 8) is described. At least for the larger components (9, 10), in particular the side wall parts of the body, a multipart clamping frame (8a, 8b) is used. The component (9, 10) is grasped and fed to the geometry box (1) using one clamping frame part, while the other clamping frame part is fed empty. Using both clamping frame parts, the component (9, 10) is then fixed precisely in position using positioning and fixing units acting between the geometry box (1) and the clamping frame (7, 8) in such a way that the components (6, 9, 10) to be connected to one another may be connected to one another, in particular welded.
摘要翻译：描述了使用几何形状盒（1）和夹紧框架（7,8）的主体部件的组装。至少对于较大的部件（9,10），特别是主体的侧壁部分，使用多部分夹紧框架（8a，8b）。夹紧部件（9,10），并使用一个夹紧框架部分将其馈送到几何形状盒（1），而另一个夹紧框架部分被供给空。使用两个夹紧框架部件，然后使用在几何形状盒（1）和夹紧框架（7,8）之间作用的定位和固定单元将组件（9,10）精确地固定就位，使得部件（6），9,10）可以彼此连接，特别是焊接。

95. 发明申请

US20090001608A1 Semiconductor device and wire bonding method 审中-公开
标题翻译：半导体器件和引线接合方法
公开(公告)号：US20090001608A1
公开(公告)日：2009-01-01
申请号：US12215317
申请日：2008-06-26
申请人： Tatsunari Mii , Hayato Kiuchi
发明人： Tatsunari Mii , Hayato Kiuchi
IPC分类号： H01L23/49 , B23K31/00
CPC分类号： H01L24/85 , B23K20/005 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48475 , H01L2224/49175 , H01L2224/78301 , H01L2224/78744 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： After bonding a wire to a pad on a surface of a semiconductor chip, a capillary is moved toward a lead and toward a direction opposite to the lead as the wire is fed out, and a first kink that is convex in a direction opposite to the lead, a second kink that is convex toward the lead, and a straight portion that continues from the second kink are formed in the wire. Then, the capillary is moved to form a loop and bonds the wire to the lead. During this bonding, the straight portion is formed into a linear portion in a direction along the surface of the lead, and the linear portion is pressed to the surface of the lead.
摘要翻译：在将导线接合到半导体芯片的表面上的焊盘之后，当引线被送出时，毛细管朝着引线移动并且朝向与引线相反的方向移动，并且沿与第一引线相反的方向凸起的第一扭结引线，朝向引线凸出的第二扭结，以及从第二扭结延续的直线部分形成在导线中。然后，毛细管被移动以形成环并将导线连接到引线。在该接合期间，直线部分沿着铅的表面的方向形成直线部分，并且直线部分被压到引线的表面。

96. 发明授权

US07429152B2 Uncoated cutting tool using brazed-in superhard blank 有权
标题翻译：无涂层切割工具采用钎焊超硬材料
公开(公告)号：US07429152B2
公开(公告)日：2008-09-30
申请号：US10463467
申请日：2003-06-17
申请人： Edward J. Oles , Alfred S. Gates, Jr. , Kent L. Reiner , William M. Alexander, IV , Jean-Pierre Genain
发明人： Edward J. Oles , Alfred S. Gates, Jr. , Kent L. Reiner , William M. Alexander, IV , Jean-Pierre Genain
IPC分类号： B23B27/22 , B23P15/28 , B23K31/00
CPC分类号： B23B27/065 , B23B27/148 , B23B2222/28 , B23B2226/125 , B23B2240/08 , B23K1/0008 , B23K31/025 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K2101/20 , B23P5/00 , B23P15/28 , C23C26/02 , C23C30/005 , Y10T82/10 , Y10T407/1904 , Y10T407/24 , Y10T407/25 , Y10T407/26 , Y10T407/27 , Y10T408/81 , Y10T428/12493 , Y10T428/12507 , Y10T428/12576
摘要： An uncoated cutting tool that comprises a body containing a pocket. A polycrystalline cubic boron nitride blank has a cutting tip. The blank is brazed into the pocket using a braze alloy whereby there is a braze joint between the body and the polycrystalline cubic boron nitride blank. The braze alloy has a liquidus temperature of at least about 900 degrees Centigrade wherein the braze alloy is selected from the group comprising a nickel-gold braze alloy containing nickel and gold, a copper-gold braze alloy containing copper and gold, a silver-titanium braze alloy containing silver and titanium, and a silver-palladium braze alloy containing silver and palladium.
摘要翻译：一种未涂覆的切削工具，其包括包含口袋的主体。多晶立方氮化硼坯料具有切割尖端。使用钎焊合金将坯料钎焊到口袋中，其中在主体和多晶立方氮化硼坯料之间存在钎焊接头。钎焊合金的液相线温度为至少约900摄氏度，其中钎焊合金选自包含镍和金的镍 - 金钎焊合金，含铜和金的铜 - 金钎焊合金，银 - 钛含有银和钛的钎焊合金以及含有银和钯的银 - 钯钎焊合金。

97. 发明申请

US20080210742A1 METAL ENCAPSULATION 有权
标题翻译：金属封装
公开(公告)号：US20080210742A1
公开(公告)日：2008-09-04
申请号：US11839257
申请日：2007-08-15
申请人： Zvi Yaniv , Prabhu Soundarrajan
发明人： Zvi Yaniv , Prabhu Soundarrajan
IPC分类号： B23K31/00
CPC分类号： C23C26/00 , B22F1/025 , B22F2999/00 , Y10S977/777 , Y10S977/888 , Y10S977/896 , B22F9/24
摘要： A process for encapsulating metal microparticles in a pH sensitive polymer matrix using a suspension containing the polymer. The process first disperses the metal particles in a polymeric solution consisting of a pH sensitive polymer. The particles are then encapsulated in the form of micro-spheres of about 5-10 microns in diameter comprising the pH sensitive polymer and the metal ions (Ni2+, Cu2+) to be coated. The encapsulated matrix includes first metal particles homogeneously dispersed in a pH sensitive matrix, comprising the second metal ions. A high shear homogenization process ensures homogenization of the aqueous mixture resulting in uniform particle encapsulation. The encapsulated powder may be formed using spray drying. The powder may be then coated in a controlled aqueous media using an electroless deposition process. The polymer is removed when the encapsulated micro-spheres encounter a pH change in the aqueous solution.
摘要翻译：使用含有聚合物的悬浮液将金属微粒包封在pH敏感性聚合物基质中的方法。该方法首先将金属颗粒分散在由pH敏感聚合物组成的聚合物溶液中。然后将颗粒以包含pH敏感聚合物和金属离子（Ni 2+），Cu 2+ / SUP的直径约5-10微米的微球的形式包封 >）进行涂布。包封的基质包括均匀分散在pH敏感基质中的第一金属颗粒，其包含第二金属离子。高剪切均匀化过程确保水性混合物的均匀化，导致均匀的颗粒包封。包封的粉末可以使用喷雾干燥形成。然后可以使用无电沉积方法将粉末涂覆在受控的水性介质中。当封装的微球遇到水溶液中的pH变化时，聚合物被去除。

98. 发明申请

US20080171174A1 ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD 失效
标题翻译：电导体互连系统和方法
公开(公告)号：US20080171174A1
公开(公告)日：2008-07-17
申请号：US11778461
申请日：2007-07-16
申请人： John Trezza
发明人： John Trezza
IPC分类号： B32B3/00 , B23K31/00 , B23K35/24
CPC分类号： H01L21/6836 , H01L21/6835 , H01L21/76898 , H01L23/427 , H01L23/48 , H01L23/481 , H01L23/49827 , H01L23/552 , H01L24/11 , H01L24/13 , H01L24/75 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68363 , H01L2223/6616 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05147 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/1147 , H01L2224/13012 , H01L2224/13099 , H01L2224/13147 , H01L2224/13609 , H01L2224/16 , H01L2224/75305 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2225/06513 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , Y10T428/24174 , H01L2924/00 , H01L2924/00014
摘要： An electrically conductive interconnect system has a post, extending above a supporting surface, the post including a rigid material, a coating on the rigid material, wherein the post and has a first width at the supporting surface and a second width at a distance removed from the supporting surface, and the post narrows from the first width to the second width. A method of electrically connecting a portion of a first supporting surface to a portion of a second supporting surface involves bringing a post on the first supporting surface into contact with an electrically conductive material located on the second supporting surface, softening the electrically conductive material, causing a separation distance between the first supporting surface and the second supporting distance to decrease so that a portion of the post will be surrounded by the electrically conductive material, and allowing the temperature of the electrically conductive material to decrease.
摘要翻译：导电互连系统具有在支撑表面上方延伸的柱，所述柱包括刚性材料，刚性材料上的涂层，其中所述柱在所述支撑表面处具有第一宽度，并且在距所述支撑表面一定距离处的第二宽度并且柱从第一宽度变窄到第二宽度。将第一支撑表面的一部分电连接到第二支撑表面的一部分的方法包括使第一支撑表面上的柱与位于第二支撑表面上的导电材料接触，软化导电材料，导致第一支撑表面和第二支撑距离之间的间隔距离减小，使得柱的一部分将被导电材料包围，并且允许导电材料的温度降低。

99. 发明申请

US20080164054A1 PRINTED CIRCUIT BOARD CAPABLE OF VOID CONTROL DURING SURFACE MOUNTING PROCESS 审中-公开
标题翻译：印刷电路板在表面安装过程中能够进行无声控制
公开(公告)号：US20080164054A1
公开(公告)日：2008-07-10
申请号：US11971854
申请日：2008-01-09
申请人： Dong-Woo SHIN , Dong-Chun LEE , Seong-Chan HAN , Hyo-Jae BANG , Si-Suk KIM , Su-Jin JUNG
发明人： Dong-Woo SHIN , Dong-Chun LEE , Seong-Chan HAN , Hyo-Jae BANG , Si-Suk KIM , Su-Jin JUNG
IPC分类号： H05K1/00 , B23K31/00
CPC分类号： B23K1/0016 , B23K1/20 , H05K3/3436 , H05K3/3452 , H05K2201/099 , H05K2201/2081 , Y02P70/613
摘要： Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.
摘要翻译：本发明的示例性实施例包括能够在表面安装处理期间控制空隙的尺寸和位置的印刷电路板（PCB）。为此，PCB包括：由绝缘材料制成的绝缘板; 形成在绝缘板上的印刷电路图案; 多个焊盘以支撑多个焊点，每个焊盘连接到每个印刷电路图案的一端; 以及安装在每个焊盘的表面上的防润湿层，用于焊接接头。抗潮湿层允许在表面安装过程期间产生的空隙移动到焊盘上的中心表面，使得焊球和焊盘之间的焊点可靠性增加。结果，提高了半导体器件的可靠性。

100. 发明授权

US07380699B2 Method and apparatus for vapour phase soldering 失效
标题翻译：气相焊接方法和装置
公开(公告)号：US07380699B2
公开(公告)日：2008-06-03
申请号：US10517815
申请日：2003-06-14
申请人： Lars Dokkedahl
发明人： Lars Dokkedahl
IPC分类号： B23K31/00 , B23K37/00
CPC分类号： B23K1/015
摘要： The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the apparatus being adapted to heat the items to be soldered to a temperature required for soldering by condensing the vapor. Further the invention relates to a method and an apparatus for flux deposition connected to a soldering machine, which soldering machine comprises a solder heating medium evaporated by heating means forming a vapor that heats elements to be soldered by heat transfer and by condensation, which apparatus comprises means for condensation, of a vapor containing flux where pumping means circulate vapor containing flux through the condensation means, where the condensation means comprises heat exchangers for cooling the vapor for flux condensation.
摘要翻译：本发明涉及一种用于对应用焊剂的物品执行焊接的方法和装置，其中焊接装置包括至少一个焊接区，其中焊接区包括用于产生蒸汽的装置，该装置适于加热物品通过冷凝蒸气而被焊接到焊接所需的温度。此外，本发明涉及一种与焊接机连接的助熔剂沉积的方法和装置，该焊接机包括通过加热装置蒸发的焊料加热介质，该加热装置形成通过热传递和通过冷凝加热待焊接的元件的蒸气，该装置包括含有蒸汽的通量的装置，其中泵送装置使含有助熔剂的蒸气循环通过冷凝装置，其中冷凝装置包括用于冷却蒸汽以进行助熔剂冷凝的热交换器。

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