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11. 发明授权

US08737087B2 Multilayer printed wiring board and manufacturing method of multilayer printed wiring board 有权
标题翻译：多层印刷线路板及多层印刷线路板的制造方法
公开(公告)号：US08737087B2
公开(公告)日：2014-05-27
申请号：US13729870
申请日：2012-12-28
申请人： Ibiden Co., Ltd.
发明人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
IPC分类号： H05K7/10
CPC分类号： H05K1/113 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H05K1/114 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/4614 , H05K2201/0391 , H05K2201/10674 , H05K2203/0574 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , H01L2224/0401
摘要： This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
摘要翻译：本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。

12. 发明申请

US20140131074A1 WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE 审中-公开
标题翻译：接线基板及制造接线基板的方法
公开(公告)号：US20140131074A1
公开(公告)日：2014-05-15
申请号：US14076554
申请日：2013-11-11
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K3/00
CPC分类号： H05K3/0052 , H05K3/0097 , H05K3/303 , H05K2201/10424 , H05K2203/107 , Y10T29/49162
摘要： A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame.
摘要翻译：布线基板具有包括金属材料并具有连接部分的框架，以及连接到框架的连接部分并且具有金属图案的件基板。片状基板的金属图案具有与框架的连接部的外缘对应的轮廓。

13. 发明授权

US09717151B2 Flex-rigid wiring board 有权
公开(公告)号：US09717151B2
公开(公告)日：2017-07-25
申请号：US14865061
申请日：2015-09-25
申请人： IBIDEN CO., LTD.
发明人： Hirotaka Taniguchi , Dongdong Wang , Michimasa Takahashi
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H05K3/4691 , H05K1/0206 , H05K1/0207 , H05K2201/0323 , H05K2201/096
摘要： A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.

14. 发明授权

US09603238B2 Combined wiring board 有权
公开(公告)号：US09603238B2
公开(公告)日：2017-03-21
申请号：US14076586
申请日：2013-11-11
申请人： IBIDEN CO., LTD.
发明人： Michimasa Takahashi , Teruyuki Ishihara
IPC分类号： H05K1/02 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/00
CPC分类号： H05K1/0271 , H05K1/14 , H05K1/183 , H05K3/0097 , H05K2201/068 , H05K2201/09145 , H05K2201/209 , H05K2203/0169
摘要： A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.

15. 发明授权

US09277655B2 Combined wiring board and method for manufacturing the same 有权
标题翻译：组合线路板及其制造方法
公开(公告)号：US09277655B2
公开(公告)日：2016-03-01
申请号：US14542721
申请日：2014-11-17
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K1/11 , H05K3/36 , H05K1/14 , H05K1/02
CPC分类号： H05K3/368 , H05K1/0228 , H05K1/0271 , H05K1/142 , H05K1/144 , H05K3/0052 , H05K3/0097 , H05K2201/2018 , H05K2201/2072 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.
摘要翻译：组合布线板包括具有多个布线板和一个或多个粘合剂部分的布线板组，使得布线板通过粘合剂部分或粘合剂部分彼此连接，并且金属框架具有容纳开口部分，形成为容纳布线板，使得布线板组位于金属框架的容纳开口部分中。

16. 发明申请

US20150083471A1 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：组合接线板及其制造方法
公开(公告)号：US20150083471A1
公开(公告)日：2015-03-26
申请号：US14496028
申请日：2014-09-25
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K1/14 , H05K3/36 , H05K1/11
CPC分类号： H05K3/0097 , H05K1/0298 , H05K1/11 , H05K1/142 , H05K3/0052 , H05K3/34 , H05K3/36 , H05K2201/0909 , H05K2201/09127 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.
摘要翻译：组合布线板包括分别具有多个开口部分的金属框架和容纳在金属框架的开口部分中的多个布线板。金属框架中的开口部分具有侧壁，其具有保持部分，使得保持部分将金属框架中的开口部分中的线路板保持在一起，并且金属框架具有与保持部分相邻的狭缝部分和连接狭缝部分的连接部分到开口部。

17. 发明申请

US20140063770A1 METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULTI-PIECE BOARD AND MULTI-PIECE BOARD 有权
标题翻译：插入式板替换方法，制造多层板和多层板的方法
公开(公告)号：US20140063770A1
公开(公告)日：2014-03-06
申请号：US14014654
申请日：2013-08-30
申请人： IBIDEN CO., LTD.
发明人： Teruyuki ISHIHARA , Michimasa Takahashi
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K1/142 , H05K3/0032 , H05K3/0097 , H05K3/225 , H05K3/36 , H05K2203/0169 , H05K2203/0554 , H05K2203/107 , H05K2203/1572 , Y10T29/49126
摘要： A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.
摘要翻译：插入式电路板的更换方法包括：准备具有单板的板，在所述板的第一表面上形成第一导电图案，在相对侧的第二表面上形成第二导电图案，使得所述第二图案位于所述板的相对侧上第一图案，沿着第一图案和第二图案在第一表面和第二表面上照射激光，使得该片从板上切出，并将该件装配到另一个板中。所述照射包括沿着所述第一图案将激光照射在所述第一表面上，使得沿着所述第二图案沿着所述第一图案的边缘部分和所述第一表面之间的边界处的激光照射激光，并且沿着所述第二图案激光沿所述第二表面照射激光，在所述第二图案的边缘部分和所述第二表面之间，使得所述片材通过所述板被切出。

18. 发明授权

US10004145B2 Combined wiring board and method for manufacturing the same 有权
公开(公告)号：US10004145B2
公开(公告)日：2018-06-19
申请号：US14496028
申请日：2014-09-25
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K1/14 , H05K1/11 , H05K3/36 , H05K3/00 , H05K1/02 , H05K3/34
CPC分类号： H05K3/0097 , H05K1/0298 , H05K1/11 , H05K1/142 , H05K3/0052 , H05K3/34 , H05K3/36 , H05K2201/0909 , H05K2201/09127 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.

19. 发明授权

US09750136B2 Wiring board and method for manufacturing the same 有权
公开(公告)号：US09750136B2
公开(公告)日：2017-08-29
申请号：US15375297
申请日：2016-12-12
申请人： IBIDEN CO., LTD.
发明人： Michimasa Takahashi , Katsutoshi Kitagawa
IPC分类号： H05K1/16 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46 , H05K3/42 , H05K1/09
CPC分类号： H05K1/115 , H05K1/0206 , H05K3/4007 , H05K3/42 , H05K2203/0733
摘要： A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.

20. 发明申请

US20150257269A1 COMBINED WIRING BOARD 审中-公开
标题翻译：组合接线板
公开(公告)号：US20150257269A1
公开(公告)日：2015-09-10
申请号：US14636780
申请日：2015-03-03
申请人： IBIDEN CO., LTD.
发明人： Teruyuki ISHIHARA , Michimasa Takahashi
IPC分类号： H05K1/14
CPC分类号： H05K3/0097 , H05K2203/0169 , H05K2203/167
摘要： A combined wiring board includes multiple metal frames arrayed in a first direction, and multiple wiring boards bonded to the metal frames such that the wiring boards are arrayed in the first direction. The metal frames directly or indirectly engage with the wiring boards such that each of the metal frames is positioned between two adjacent wiring boards of the wiring boards.
摘要翻译：组合布线板包括沿第一方向排列的多个金属框架，以及多个接线到金属框架的布线板，使得布线板沿第一方向排列。金属框架直接或间接地与布线板接合，使得每个金属框架位于布线板的两个相邻布线板之间。

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