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1. 发明申请

US20190235588A1 ELECTRICAL DEVICE, CIRCUIT BOARD, AND METHOD OF IDENTIFYING A TYPE OF A HOUSING OF AN ELECTRICAL DEVICE 审中-公开
公开(公告)号：US20190235588A1
公开(公告)日：2019-08-01
申请号：US16260729
申请日：2019-01-29
申请人： Fujitsu Technology Solutions Intellectual Property GmbH
发明人： Diana Langner , Bernhard Kannler , Martin Schmutzer , Andreas Maier , Georg Ahn
IPC分类号： G06F1/18 , H05K1/18 , H05K5/00 , H05K1/02
CPC分类号： G06F1/184 , G06F1/16 , H05K1/0203 , H05K1/181 , H05K5/0026 , H05K2201/10409 , H05K2201/2072
摘要： An electrical device includes a housing, a circuit board including at least one fastening means, at least one fastening element configured to fix the circuit board on the housing by the at least one fastening means, and a microcontroller arranged on the circuit board, wherein an electrical contact electrically connected to the microcontroller is arranged on the circuit board to be spaced apart from the fastening means by a specified spacing, the fastening element has a housing-specific diameter at an end facing the circuit board, and the microcontroller is configured to determine a type of the housing on the basis of whether the fastening element contacts the at least one electrical contact.

2. 发明授权

US09786584B2 Lateral element isolation device 有权
公开(公告)号：US09786584B2
公开(公告)日：2017-10-10
申请号：US13602597
申请日：2012-09-04
申请人： Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess
发明人： Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess
IPC分类号： H05K7/00 , H01L23/495 , H05K1/18 , H01L23/31 , H01L23/373 , H01L23/467 , H05K1/02
CPC分类号： H01L23/49568 , H01L23/3121 , H01L23/3735 , H01L23/467 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1301 , H01L2924/181 , H05K1/0209 , H05K1/0256 , H05K1/181 , H05K2201/2072 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： Representative implementations of devices and techniques provide isolation between a carrier and a component mounted to the carrier. A multi-layer device having lateral elements provides electrical isolation at a preset isolation voltage while maintaining a preselected thermal conductivity between the component and the carrier.

3. 发明申请

US20170215276A1 PLASTIC COMPONENT WITH AT LEAST ONE ELECTRICAL CONTACT ELEMENT AND METHOD FOR THE MANUFACTURE THEREOF 审中-公开
公开(公告)号：US20170215276A1
公开(公告)日：2017-07-27
申请号：US15327785
申请日：2015-07-20
申请人： KRALLMANN KUNSTSTOFFVERARBEITUNG GMBH ß
发明人： Eduard ENGELMANN
IPC分类号： H05K1/02 , H05K1/11 , H05K1/03 , H05K3/00
CPC分类号： H05K1/0284 , B29C45/16 , B29C2045/169 , B29C2045/1696 , H01H1/021 , H01H2011/065 , H05K1/0278 , H05K1/0296 , H05K1/0313 , H05K1/11 , H05K1/117 , H05K1/119 , H05K3/0014 , H05K3/101 , H05K3/107 , H05K3/4092 , H05K2201/09081 , H05K2201/09118 , H05K2201/09754 , H05K2201/2072
摘要： A plastic component with at least one electrical contact element has a plastic body and at least one electrical strip conductor, by which the electrical contact element can be electrically connected. Provisions are made for the plastic component to be manufactured by a combined injection molding and metal casting method, in which the plastic body is manufactured by an injection molding method and the at least one electrical strip conductor is manufactured by a metal casting or metal injection molding method one after another. The component formed last is molded onto the component formed first. Further, a method for manufacturing a corresponding plastic component is described.

4. 发明授权

US09656054B2 Implantable electrode and method of making the same 有权
公开(公告)号：US09656054B2
公开(公告)日：2017-05-23
申请号：US14676037
申请日：2015-04-01
申请人： NeuroNexus Technologies, Inc.
发明人： David S. Pellinen , Mayurachat Ning Gulari , Jamille Farraye Hetke , David J. Anderson , Daryl R. Kipke , Rio J. Vetter
IPC分类号： A61N1/05 , H05K1/11 , A61B5/04 , H05K1/03 , H05K3/46
CPC分类号： A61N1/05 , A61B5/04001 , A61B2562/0209 , A61N1/0529 , A61N1/0551 , H05K1/0393 , H05K1/113 , H05K3/4644 , H05K2201/09781 , H05K2201/2072 , Y10T29/49117
摘要： The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that overlaps a peripheral edge of the electrode layer. The anchor is mechanically interlocked with the insulator. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording and stimulating function.

5. 发明申请

US20170040249A1 WIRING BOARD AND ELECTRONIC COMPONENT DEVICE 有权
标题翻译：接线板和电子元器件
公开(公告)号：US20170040249A1
公开(公告)日：2017-02-09
申请号：US15228059
申请日：2016-08-04
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Hiroharu Yanagisawa , Kazuhiro Kobayashi
IPC分类号： H01L23/498 , H01L23/31 , H05K1/02 , H01L21/56 , H05K1/11 , H05K1/18 , H01L23/00 , H01L21/48
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/486 , H01L21/563 , H01L21/568 , H01L23/3128 , H01L23/3178 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/13144 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81395 , H01L2224/81444 , H01L2224/81447 , H01L2224/83005 , H01L2224/83385 , H01L2224/92125 , H01L2924/15153 , H01L2924/15311 , H01L2924/1816 , H05K1/0213 , H05K1/111 , H05K1/181 , H05K3/205 , H05K2201/0769 , H05K2201/09472 , H05K2201/09772 , H05K2201/098 , H05K2201/10674 , H05K2201/2072 , H05K2203/0278 , H05K2203/1105 , H01L2924/00014 , H01L2924/014
摘要： A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer; and the recess portion is filled with the insulating layer.
摘要翻译：布线板包括：绝缘层; 以及布线层，包括：上表面; 与上表面相对的下表面; 以及上表面和下表面之间的侧表面，其中布线层的上表面从绝缘层露出，并且布线层的侧表面和下表面嵌入在绝缘层中。在布线层的上表面的外缘部形成有凹部，并且凹部被绝缘层填充。

6. 发明申请

US20160360621A1 THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR SAME 审中-公开
标题翻译：三维电路板和焊锡组合物用于相同
公开(公告)号：US20160360621A1
公开(公告)日：2016-12-08
申请号：US15108635
申请日：2015-01-14
申请人： TAIYO INK MFG. CO., LTD.
发明人： Ayumu SHIMAMIYA , Naoki YONEDA , Shigeru USHIKI
IPC分类号： H05K3/34 , H05K3/18 , H05K1/18 , H05K3/00 , H05K1/02 , H05K3/06
CPC分类号： H05K3/341 , H05K1/0284 , H05K1/181 , H05K3/0014 , H05K3/064 , H05K3/105 , H05K3/18 , H05K3/182 , H05K3/3452 , H05K2201/09018 , H05K2201/09118 , H05K2201/2072 , H05K2203/0568 , H05K2203/107 , Y02P70/613
摘要： A three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. The three-dimensional circuit board includes a circuit formed on a three-dimensional board and a component mount unit. A solder resist is formed such that a component mount unit is open, and an electronic component is mounted on a component mount unit with solder. The solder resist can be a photoresist, and the three-dimensional board can be a resin molding with a circuit formed on the resin molding.
摘要翻译：可以防止组件安装期间焊料流动或电路短路的三维电路板，以及用于其的阻焊剂组合物。三维电路板包括形成在三维板上的电路和元件安装单元。形成阻焊剂，使得部件安装单元打开，并且电子部件安装在具有焊料的部件安装单元上。阻焊剂可以是光致抗蚀剂，三维板可以是在树脂成型体上形成的电路的树脂成型体。

7. 发明申请

US20160150642A1 WIRING BOARD AND MOUNTING STRUCTURE USING SAME 有权
标题翻译：接线板和安装结构
公开(公告)号：US20160150642A1
公开(公告)日：2016-05-26
申请号：US14779232
申请日：2014-03-26
申请人： KYOCERA CORPORATION
发明人： Satoshi KAJITA , Mitsuhiro HAGIHARA , Yuuhei MATSUMOTO
IPC分类号： H05K1/03 , H05K1/02 , H05K1/11 , H05K1/18 , H05K1/09
CPC分类号： H05K1/0306 , H05K1/0298 , H05K1/036 , H05K1/09 , H05K1/115 , H05K1/181 , H05K3/0038 , H05K3/421 , H05K3/4602 , H05K3/4655 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0266 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2201/2072
摘要： A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.
摘要翻译：布线板包括：无机绝缘层，其具有形成为在其厚度方向上穿透无机绝缘层的通孔; 设置在无机绝缘层上的导电层; 以及通孔导体，其粘附到通孔的内壁并与导电层连接。无机绝缘层包括：第一部分，其包括彼此部分连接的多个无机绝缘颗粒，以及位于无机绝缘颗粒之间的间隙中的树脂部分和介于第一部分和通孔导体之间的第二部分，包括彼此部分连接的多个无机绝缘颗粒和由位于无机绝缘颗粒之间的间隙中的通孔导体的一部分组成的导电部分。

8. 发明授权

US09348378B2 Computer provided with cooling system 有权
标题翻译：电脑配有冷却系统
公开(公告)号：US09348378B2
公开(公告)日：2016-05-24
申请号：US14394906
申请日：2012-04-19
申请人： Yoshihiro Kondo , Takayuki Fujimoto , Fumio Takeda , Takeshi Kato
发明人： Yoshihiro Kondo , Takayuki Fujimoto , Fumio Takeda , Takeshi Kato
IPC分类号： H05K7/20 , H01L23/427 , G06F1/20 , H05K1/02
CPC分类号： G06F1/20 , H01L23/427 , H01L2924/0002 , H05K1/0203 , H05K7/2039 , H05K7/20809 , H05K2201/2072 , H01L2924/00
摘要： The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.
摘要翻译：所述计算机具有安装在其两侧的半导体元件的模块板，安装有所述模块板的多个单元的主板和安装有所述母板的多个单元的机架柜，所述主板包括热虹吸管热连接到安装在模块板一侧上的半导体元件，与安装在模块板一侧的半导体元件热连接的金属板，传导金属板的热量的导热构件在将安装在模块板的一侧的半导体元件的热量转移到金属板的情况下，将热虹吸管和压电元件按压在安装在金属板上的半导体元件的按压部件上模块板。

9. 发明授权

US09226389B2 Quickly-mounted capacitor 有权
标题翻译：快速安装的电容器
公开(公告)号：US09226389B2
公开(公告)日：2015-12-29
申请号：US14234635
申请日：2012-09-25
申请人： SHANGHAI HAOYE ELECTRIC CO., LTD , SHANGHAI HAOYE CAPACITORS CO., LTD
发明人： Zikui Zhang , Feng Xu , Hao Pan
IPC分类号： H05K1/02 , H01G2/06 , H05K3/30
CPC分类号： H05K1/0256 , H01G2/06 , H05K3/301 , H05K2201/09063 , H05K2201/10015 , H05K2201/2072
摘要： A quickly-mounted capacitor consists of a capacitor (1) and a plug piece (10). The quickly-mounted capacitor is characterized in that a fixation mounting rod (22) or a screw (21) is extended from a lower end of a housing of the capacitor (1); the plug piece (10) comprises an insulating sheet (11) arranged in an upper portion, and a lower portion of the insulting sheet (11) is connected to an upper end of a connection part (13); a lower end of the connecting part (13) is connected to a plastic elastic card (12) to form a plastic anchor-shaped elastic card. An upper portion of the plug piece (10) is provided with a capacitor mounting hole (15). The capacitor not only is convenient to plug, but also can effectively play a role in insulation and prevent the accident caused by conducting leak electricity to an electric appliance casing when abnormal electricity leakage occurs in the capacitor.
摘要翻译：快速安装的电容器由电容器（1）和插头片（10）组成。快速安装的电容器的特征在于，固定安装杆（22）或螺钉（21）从电容器（1）的壳体的下端延伸; 插头片（10）包括布置在上部的绝缘片（11），并且绝缘片（11）的下部连接到连接部分（13）的上端; 连接部分（13）的下端连接到塑料弹性卡（12）以形成塑料锚定形弹性卡。插头片（10）的上部设有电容器安装孔（15）。电容器不仅方便插头，而且可以有效地发挥绝缘的作用，并防止在电容器发生异常电力泄漏时对电器外壳进行漏电而引起的事故。

10. 发明授权

US09210807B2 Wiring substrate 有权
标题翻译：接线基板
公开(公告)号：US09210807B2
公开(公告)日：2015-12-08
申请号：US14084038
申请日：2013-11-19
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Kei Imafuji , Jun Yoshiike
IPC分类号： H05K1/11 , H05K1/03 , H05K3/40 , H05K3/34 , H05K3/46
CPC分类号： H05K1/111 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/15311 , H05K1/11 , H05K3/3452 , H05K3/4007 , H05K3/4682 , H05K2201/0373 , H05K2201/0769 , H05K2201/099 , H05K2201/2072 , H05K2203/0594 , H05K2203/1184 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer.
摘要翻译：布线基板包括：具有第一表面的连接垫; 保护绝缘层，形成在连接焊盘的第一表面上并且在其中具有开口部分，其中连接焊盘的第一表面的一部分从开口部露出; 具有面向连接焊盘的第一表面的下表面的金属层和与下表面相对的上表面，并且形成在从开口部暴露的连接焊盘的第一表面上，金属层包括凸起部分，从金属层的上表面在其周边部分向上延伸; 以及形成在金属层的上表面上的凸块电极。

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