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11. 发明申请

US20190124765A1 PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20190124765A1
公开(公告)日：2019-04-25
申请号：US16165743
申请日：2018-10-19
申请人： IBIDEN CO., LTD.
发明人： Takema Adachi , Toshihide Makino , Hidetoshi Noguchi
IPC分类号： H05K1/11 , H05K3/00 , H05K3/42 , H05K3/46
CPC分类号： H05K1/115 , H05K3/0038 , H05K3/424 , H05K3/429 , H05K3/4644 , H05K3/465 , H05K3/4661 , H05K2201/09827 , H05K2203/0723 , H05K2203/107
摘要： A printed wiring board includes: a core substrate having a core layer, conductor layers on the core layer, and through-hole conductors; a first build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer; and a second build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer. Each of the conductor layers, inner side conductor layers, and outermost conductor layers has a metal foil, a seed layer and an electrolytic plating film, and that each inner side conductor layer has the smallest thickness among the conductor layers, inner side conductor layers and outermost conductor layers.

12. 发明授权

US10182518B2 Shield cap and method for manufacturing the same 有权
公开(公告)号：US10182518B2
公开(公告)日：2019-01-15
申请号：US15783330
申请日：2017-10-13
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takema Adachi , Hidetoshi Noguchi , Shota Tachibana
IPC分类号： H05K9/00 , H05K13/00
摘要： A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

13. 发明申请

US20180110164A1 SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20180110164A1
公开(公告)日：2018-04-19
申请号：US15783330
申请日：2017-10-13
申请人： IBIDEN CO., LTD
发明人： Toshiki FURUTANI , Takema Adachi , Hidetoshi Noguchi , Shota Tachibana
IPC分类号： H05K9/00 , H05K13/00
CPC分类号： H05K9/0086 , H05K9/003 , H05K9/0084 , H05K9/0088 , H05K13/0084 , H05K2201/0338 , H05K2201/0707
摘要： A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

14. 发明授权

US09837345B2 Interposer and circuit substrate 有权
公开(公告)号：US09837345B2
公开(公告)日：2017-12-05
申请号：US15211332
申请日：2016-07-15
申请人： IBIDEN CO., LTD.
发明人： Kota Noda , Takema Adachi
IPC分类号： H01L23/498 , H01L21/48 , H01L25/065 , H01L23/00 , H01L25/10
CPC分类号： H01L23/49838 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L23/562 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/105 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/14 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , H01L2924/3512 , H01L2224/32225 , H01L2924/00012 , H01L2224/45099
摘要： An interposer includes an insulating plate including insulating layers and having first, second, third and fourth surfaces such that the second surface is on the opposite side of the first surface, the third surface is perpendicular to the first surface, the fourth surface is on the opposite side of the third surface, and the insulating layers are laminated on the third surface, and conductor layers formed in the insulating plate such that each conductor layer is interposed between adjacent insulating layers and includes straight conductors having first electrodes exposed from the first surface and second electrodes exposed from the second surface, respectively. The insulating layers include second insulating layers each sandwiched by adjacent conductor layers such that each second insulating layer integrally has an inter-conductor-layer insulating layer portion formed between the adjacent conductor layers and inter-conductor insulating layer portions formed between adjacent straight conductors in a respective conductor layer.

15. 发明授权

US09401320B2 Combined substrate 有权
标题翻译：组合底物
公开(公告)号：US09401320B2
公开(公告)日：2016-07-26
申请号：US14638324
申请日：2015-03-04
申请人： IBIDEN CO., LTD.
发明人： Tomoya Daizo , Takema Adachi , Takeshi Furusawa , Wataru Nakamura , Yuki Ito , Yuki Yoshikawa , Tomoyoshi Hirabayashi
IPC分类号： H01L23/498 , H01L25/10 , H01L25/00 , H01L23/00
CPC分类号： H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/48 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/81191 , H01L2224/81815 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
摘要翻译：组合衬底包括具有多个第一金属柱的第一衬底，具有多个第二金属柱的第二衬底，使得第二金属柱分别定位成与第一金属柱相对，以及插入在第一金属柱和第二金属柱之间的多个焊料结构第二金属柱。第一金属柱和/或第二金属柱具有形成为使得焊料结构分别形成在凹陷表面上的凹陷表面。

16. 发明授权

US09185799B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09185799B2
公开(公告)日：2015-11-10
申请号：US13836123
申请日：2013-03-15
申请人： IBIDEN CO., LTD.
发明人： Naoto Ishida , Takema Adachi
IPC分类号： H05K1/00 , H05K1/03 , H05K3/46 , H05K1/02 , H05K1/18
CPC分类号： H05K1/0306 , H01L2224/16227 , H01L2224/81192 , H01L2924/15311 , H01L2924/3511 , H05K1/0271 , H05K1/185 , H05K3/4673 , H05K2201/0209 , H05K2201/068
摘要： A printed wiring board includes a core substrate including an insulative substrate, a first conductive layer formed on first surface of the insulative substrate, and a second conductive layer formed on second surface of the insulative substrate, a first buildup laminated on first surface of the core and including an interlayer insulation layer, a conductive layer formed on the insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer, and a second buildup laminated on second surface of the core and including an interlayer insulation layer, a conductive layer formed on the interlayer insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer. The insulation layer of the first buildup has thermal expansion coefficient set higher than thermal expansion coefficient of the insulation layer of the second buildup.
摘要翻译：印刷电路板包括具有绝缘基板的芯基板，形成在绝缘基板的第一面上的第一导电层和形成在绝缘基板的第二面上的第二导电层，层叠在芯的第一面上的第一积层并且包括层间绝缘层，形成在所述绝缘层上的导电层和穿过所述绝缘层并连接到所述导电层的通孔导体，以及层叠在所述芯的第二表面上并包括层间绝缘层的第二堆积层，形成在层间绝缘层上的导电层和穿过绝缘层并连接到导电层的通孔导体。第一次堆积的绝缘层的热膨胀系数设定为高于第二次堆积的绝缘层的热膨胀系数。

17. 发明授权

US09078366B2 Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09078366B2
公开(公告)日：2015-07-07
申请号：US14041858
申请日：2013-09-30
申请人： IBIDEN CO., LTD.
发明人： Takema Adachi
IPC分类号： H05K1/03 , H05K1/11 , H05K3/46 , H05K3/42
CPC分类号： H05K1/036 , H05K3/427 , H05K3/429 , H05K3/4602 , H05K3/465 , H05K3/4676 , H05K2201/09854 , Y10T29/49165
摘要： A printed circuit board has a core substrate, a first conductive pattern on first surface of the substrate, a second conductive pattern on second surface of the substrate, and a through-hole conductor formed of plated material through the substrate such that the conductor is connecting the first and second patterns. The plated material is filling a through hole in the substrate, the substrate includes an insulation layer including inorganic fiber and resin, a first resin layer on one surface of the insulation layer and having the first surface of the substrate, and a second resin layer on the opposite surface of the insulation layer and having the second surface of the substrate, the first and second resin layers do not contain inorganic fiber material, and the sum of thicknesses of the first and second resin layers is set in the range of 20% or less of thickness of the substrate.
摘要翻译：印刷电路板具有芯基板，在基板的第一表面上的第一导电图案，在基板的第二表面上的第二导电图案，以及由电镀材料穿过基板形成的通孔导体，使得导体连接第一和第二种模式。电镀材料填充基板中的通孔，基板包括绝缘层，其包括无机纤维和树脂，在绝缘层的一个表面上具有第一树脂层并且具有基板的第一表面，以及第二树脂层，绝缘层的相对表面并具有基板的第二表面，第一和第二树脂层不含有无机纤维材料，第一和第二树脂层的厚度之和设定在20％的范围内衬底厚度较小。

18. 发明授权

US10368440B2 Printed wiring board 有权
公开(公告)号：US10368440B2
公开(公告)日：2019-07-30
申请号：US16165743
申请日：2018-10-19
申请人： IBIDEN CO., LTD.
发明人： Takema Adachi , Toshihide Makino , Hidetoshi Noguchi
IPC分类号： H05K1/11 , H05K3/00 , H05K3/42 , H05K3/46
摘要： A printed wiring board includes: a core substrate having a core layer, conductor layers on the core layer, and through-hole conductors; a first build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer; and a second build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer. Each of the conductor layers, inner side conductor layers, and outermost conductor layers has a metal foil, a seed layer and an electrolytic plating film, and that each inner side conductor layer has the smallest thickness among the conductor layers, inner side conductor layers and outermost conductor layers.

19. 发明授权

US10271468B2 Shield cap and method for manufacturing the same 有权
公开(公告)号：US10271468B2
公开(公告)日：2019-04-23
申请号：US15782349
申请日：2017-10-12
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takema Adachi , Hidetoshi Noguchi , Shota Tachibana
IPC分类号： H05K9/00 , H01L23/60 , H05K3/46 , H01L23/552
摘要： A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

20. 发明授权

US10231336B2 Printed wiring board for mounting electronic component 有权
公开(公告)号：US10231336B2
公开(公告)日：2019-03-12
申请号：US15920594
申请日：2018-03-14
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takema Adachi , Toshihide Makino , Hidetoshi Noguchi
IPC分类号： H05K1/11 , H05K3/42 , H05K3/46 , H05K3/18 , H05K3/06 , H05K3/24 , H05K1/02 , H05K1/03 , H05K3/14
摘要： A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.

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