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1. 发明申请

US20190014695A1 ELECTROMAGNETIC-INTERFERENCE SHIELDING DEVICE 审中-公开
公开(公告)号：US20190014695A1
公开(公告)日：2019-01-10
申请号：US16115119
申请日：2018-08-28
申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.
发明人： Ting-Hao Lin , Chiao-Cheng Chang , Yung-Lin Chia
IPC分类号： H05K9/00
CPC分类号： H05K9/0024 , H05K9/003 , H05K9/0037 , H05K9/0088 , H05K9/0092
摘要： An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

2. 发明授权

US10068832B2 EMI shielding structure having heat dissipation unit and method for manufacturing the same 有权
公开(公告)号：US10068832B2
公开(公告)日：2018-09-04
申请号：US15840326
申请日：2017-12-13
申请人： Samsung Electronics Co., Ltd.
发明人： Eun-bong Han , Hyeon-hyang Kim
IPC分类号： H05K1/00 , H01L23/552 , H01L23/495 , H01L23/22 , H01L23/427 , H05K9/00 , H05K7/20 , G06F1/20 , H05K1/02 , H01L23/367 , F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , G06F1/1626 , G06F1/1656 , G06F1/203 , H01L23/3675 , H01L23/552 , H01L25/0655 , H01L2224/16225 , H01L2924/3025 , H05K1/0216 , H05K1/0218 , H05K3/284 , H05K7/20336 , H05K7/2099 , H05K9/003 , H05K9/0088 , H05K2201/0367 , H05K2201/064
摘要： An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

3. 发明申请

US20180110163A1 SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20180110163A1
公开(公告)日：2018-04-19
申请号：US15782275
申请日：2017-10-12
申请人： IBIDEN CO., LTD.
发明人： Toshiki FURUTANI , Takema ADACHI , Hidetoshi NOGUCHI , Shota TACHIBANA
IPC分类号： H05K9/00 , H05K5/06 , H05K13/00
CPC分类号： H05K9/0084 , H05K5/065 , H05K9/003 , H05K9/0088 , H05K13/00 , H05K13/0015 , H05K13/0084
摘要： A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space to accommodate an electronic component.

4. 发明授权

US09907179B2 Electronic circuit package 有权
公开(公告)号：US09907179B2
公开(公告)日：2018-02-27
申请号：US15137106
申请日：2016-04-25
申请人： TDK Corporation
发明人： Kenichi Kawabata
IPC分类号： H05K1/18 , H01F1/03 , H05K1/02
CPC分类号： H05K1/182 , H01F1/0306 , H01F1/26 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2924/19105 , H05K1/0216 , H05K1/0298 , H05K1/181 , H05K3/284 , H05K9/003 , H05K2201/083 , H05K2203/1316 , H01L2924/00012
摘要： Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106Ω.

5. 发明申请

US20170311448A1 ELECTRONIC CIRCUIT PACKAGE 有权
公开(公告)号：US20170311448A1
公开(公告)日：2017-10-26
申请号：US15137106
申请日：2016-04-25
申请人： TDK Corporation
发明人： Kenichi KAWABATA
IPC分类号： H05K1/18 , H05K1/02 , H01F1/03
CPC分类号： H05K1/182 , H01F1/0306 , H01F1/26 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2924/19105 , H05K1/0216 , H05K1/0298 , H05K1/181 , H05K3/284 , H05K9/003 , H05K2201/083 , H05K2203/1316 , H01L2924/00012
摘要： Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106Ω.

6. 发明授权

US09545043B1 Shielding encapsulation for electrical circuitry 有权
标题翻译：电路屏蔽封装
公开(公告)号：US09545043B1
公开(公告)日：2017-01-10
申请号：US12892309
申请日：2010-09-28
申请人： Brandon C. Hamilton , Guy N. Smith , Alan P. Boone
发明人： Brandon C. Hamilton , Guy N. Smith , Alan P. Boone
IPC分类号： H05K9/00 , H05K7/02 , H05K7/04 , H01L23/29
CPC分类号： H05K9/0081 , H01L23/295 , H01L23/552 , H05K9/0024 , H05K9/003 , H05K9/0083 , H05K9/0088 , H05K9/009
摘要： An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.
摘要翻译：公开了电磁干扰（EMI）屏蔽装置和制造EMI屏蔽装置的方法。 EMI屏蔽设备可以包括设置在电路的一部分上的电路和封装层。所述密封剂层具有分散在其中的多个颗粒，其中所述多个颗粒适用于屏蔽电路与EMI。制造EMI屏蔽设备的方法可以包括提供电路，以及将密封剂材料沉积在电路的一部分上，其中多个EMI屏蔽颗粒分散在密封剂材料内。另外的方法可以包括将电介质材料沉积在电路的一部分上，并将密封剂材料沉积在电介质材料的一部分和电路部分上，其中多个EMI屏蔽颗粒分散在密封剂材料内。

7. 发明授权

US09426935B2 Method for manufacturing circuit board, circuit board, and electronic device 有权
标题翻译：电路板，电路板和电子设备的制造方法
公开(公告)号：US09426935B2
公开(公告)日：2016-08-23
申请号：US14139253
申请日：2013-12-23
申请人： Huawei Device Co., Ltd.
发明人： Chunyu Gao
IPC分类号： H05K7/00 , H05K9/00 , H05K1/02 , H05K3/28
CPC分类号： H05K9/0081 , H05K1/0218 , H05K3/28 , H05K3/284 , H05K9/00 , H05K9/0022 , H05K9/003 , H05K9/0045 , H05K2201/0715 , H05K2201/2018 , H05K2203/107 , Y10T29/49124
摘要： Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided.
摘要翻译：本发明的实施方式公开了电路基板的制造方法以及电路基板。该方法包括：在电路板上分开固定至少两个功能模块和屏蔽框架，其中屏蔽框架位于至少两个功能模块之间; 通过使用塑料包装材料包装至少两个功能模块和屏蔽框架; 将对应于屏蔽框架的顶部的塑料封装材料切割到屏蔽框架的表面; 并且用导电材料覆盖塑料封装材料的外部和屏蔽框架的顶部，并用绝缘材料覆盖导电材料的表面。在实施例中，切割高度减小，处理时间短，并且提供良好的可制造性。

8. 发明授权

US09237645B2 Flexible printed circuit integrated with conductive layer 有权
标题翻译：柔性印刷电路集成导电层
公开(公告)号：US09237645B2
公开(公告)日：2016-01-12
申请号：US14113729
申请日：2012-04-26
申请人： Masayoshi Kido , Yoshihide Sekito
发明人： Masayoshi Kido , Yoshihide Sekito
IPC分类号： H05K9/00 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0218 , H05K1/02 , H05K1/028 , H05K1/0373 , H05K1/0393 , H05K9/003 , H05K2201/0715
摘要： A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.
摘要翻译：导电层一体化柔性印刷电路板包括：（A）电磁屏蔽导电层; （B）绝缘膜; 和（C）依次层叠电磁屏蔽导电层（A），绝缘体膜（B）和布线图案的膜（C）的布线图案的膜，绝缘膜（B ）包含至少（a）粘合剂聚合物和（b）球形有机珠粒。

9. 发明授权

US09192057B2 Electromagnetic interference shielding structures 有权
标题翻译：电磁干扰屏蔽结构
公开(公告)号：US09192057B2
公开(公告)日：2015-11-17
申请号：US13726890
申请日：2012-12-26
申请人： Apple Inc.
发明人： Shayan Malek , Gregory N. Stephens , Michael B. Wittenberg , Jared M. Kole , Warren Z. Jones
IPC分类号： H05K1/00 , H05K3/30 , H05K9/00
CPC分类号： H05K3/30 , H05K9/003 , H05K2201/09063 , H05K2201/10371 , H05K2201/10409 , Y10T29/49117 , Y10T29/4913
摘要： Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.
摘要翻译：电气部件安装在电子设备壳体中的印刷电路上。屏蔽罐结构可以包括具有导电垫片的金属板屏蔽罐层。印刷电路可以具有开口。螺丝穿过印刷电路中的开口和导电垫圈和金属板护罩罐层中的开口，以将屏蔽罐结构固定到壳体上。当固定时，垫圈中的唇缘位于印刷电路基板和壳体之间。垫圈可以由导电弹性体材料形成。屏蔽罐盖和柔性印刷电路可以嵌入在导电弹性体材料内，其提供热传导路径以从盖下方的电气部件散发热量。位于柔性印刷电路基板中的弯曲部的相对侧上的屏蔽罐构件可以通过导电弹性体桥接结构耦合。

10. 发明授权

US09179538B2 Electromagnetic shielding structures for selectively shielding components on a substrate 有权
标题翻译：用于选择性地屏蔽衬底上的组件的电磁屏蔽结构
公开(公告)号：US09179538B2
公开(公告)日：2015-11-03
申请号：US13488382
申请日：2012-06-04
申请人： James H. Foster , James W. Bilanski , Amir Salehi , Ramamurthy Chandhrasekhar , Nicholas Unger Webb
发明人： James H. Foster , James W. Bilanski , Amir Salehi , Ramamurthy Chandhrasekhar , Nicholas Unger Webb
IPC分类号： H05K9/00 , H05K1/02 , H01L23/552 , H01L25/065
CPC分类号： H05K1/0218 , H01L23/552 , H01L25/0655 , H01L2924/0002 , H01L2924/14 , H01L2924/15192 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K9/0026 , H05K9/003 , H05K9/0033 , H05K9/0037 , H05K9/0043 , Y10T29/49004 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.
摘要翻译：可以使用电磁屏蔽结构屏蔽衬底上的电子部件。可以使用绝缘材料来提供结构支撑并且有助于防止导电材料和部件之间的电短路。屏蔽结构可以包括使用围绕选定部件的金属栅栏或通过注射成型塑料形成的隔室。可以使用包裹在部件和基板上的金属箔来形成屏蔽结构。可以使用测试柱或痕迹来测试电子元件，以识别故障的组件。测试柱或迹线可以沉积在衬底上，并且可以用于在测试设备和组件之间传送测试信号。测试成功后，测试柱可能被永久屏蔽。或者，临时屏蔽结构可以用于在电子设备完全组装之前测试各个部件。

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