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1. 发明授权

US09980371B2 Printed wiring board 有权
公开(公告)号：US09980371B2
公开(公告)日：2018-05-22
申请号：US15044380
申请日：2016-02-16
申请人： IBIDEN CO., LTD.
发明人： Takayuki Katsuno , Yuki Ito , Takeshi Furusawa , Takema Adachi
IPC分类号： H05K1/11 , H05K1/02 , H05K3/00 , H05K3/24 , H05K3/02 , H05K3/18
CPC分类号： H05K1/0271 , H05K3/007 , H05K3/025 , H05K3/188 , H05K3/244 , H05K2201/0338 , H05K2201/0344 , H05K2201/098 , H05K2203/1184
摘要： A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer.

2. 发明授权

US09793200B2 Printed wiring board 有权
公开(公告)号：US09793200B2
公开(公告)日：2017-10-17
申请号：US14741122
申请日：2015-06-16
申请人： IBIDEN CO., LTD.
发明人： Kota Noda , Takeshi Furusawa
IPC分类号： H05K1/11 , H05K1/14 , H01L23/498 , H05K3/46 , H01L25/10 , H05K1/02 , H01L23/00
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L25/105 , H01L2224/131 , H01L2224/16227 , H01L2224/16237 , H01L2224/81192 , H01L2224/81395 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81464 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/15153 , H01L2924/3511 , H01L2924/3512 , H05K1/0271 , H05K3/4697 , H05K2201/09827 , H05K2201/10674 , H01L2924/014 , H01L2924/00014
摘要： A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board.

3. 发明申请

US20150366062A1 PRINTED WIRING BOARD 有权
标题翻译：印刷线路板
公开(公告)号：US20150366062A1
公开(公告)日：2015-12-17
申请号：US14741122
申请日：2015-06-16
申请人： IBIDEN CO., LTD.
发明人： Kota NODA , Takeshi Furusawa
IPC分类号： H05K1/14 , H05K1/11 , H05K1/03 , H05K1/02
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L25/105 , H01L2224/131 , H01L2224/16227 , H01L2224/16237 , H01L2224/81192 , H01L2224/81395 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81464 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/15153 , H01L2924/3511 , H01L2924/3512 , H05K1/0271 , H05K3/4697 , H05K2201/09827 , H05K2201/10674 , H01L2924/014 , H01L2924/00014
摘要： A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board.The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board.
摘要翻译：印刷电路板包括：第一电路板，其具有相对于第一表面的相反侧的第一表面和第二表面;以及第二电路板，其具有相对于第三表面的相反侧的第三表面和第四表面并且在第二电路板的第三表面上具有安装区域。第一电路板层叠在第二电路板的第三表面上，使得第一电路板的第一表面面向第二电路板的第三表面，并且第一电路板包括增强材料，并且具有暴露第二电路板的安装面积。

4. 发明授权

US09497849B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09497849B2
公开(公告)日：2016-11-15
申请号：US13754185
申请日：2013-01-30
申请人： IBIDEN CO., LTD.
发明人： Takashi Kariya , Toshiki Furutani , Takeshi Furusawa
IPC分类号： H05K1/02 , H05K3/46 , H01L21/48 , H01L23/498
CPC分类号： H05K1/02 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0271 , H05K3/4644 , H05K2201/029 , H05K2201/09136 , H01L2924/00
摘要： A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.
摘要翻译：印刷电路板分别包括芯基板，在芯的表面上的第一和第二累积结构以及分别在第一和第二结构上的第一和第二阻焊层。芯包括绝缘衬底，衬底表面上的导电层和连接导电层的通孔导体，第一结构包括第一结构中的层间绝缘层和导电层，第二结构包括层间绝缘层和导电层第二结构，第一和第二阻焊层的外表面之间的厚度设定在150μm以上且小于380μm的范围内，以及芯，第一和第二结构中的至少一个，第一和第二结构第二阻焊层包括增强材料，其量使得该板包括量为20至35体积的材料。％。

5. 发明申请

US20150255433A1 COMBINED SUBSTRATE 有权
标题翻译：组合基板
公开(公告)号：US20150255433A1
公开(公告)日：2015-09-10
申请号：US14638324
申请日：2015-03-04
申请人： IBIDEN CO., LTD.
发明人： Tomoya DAIZO , Takema Adachi , Takeshi Furusawa , Wataru Nakamura , Yuki Ito , Yuki Yoshikawa , Tomoyoshi Hirabayashi
IPC分类号： H01L25/065 , H01L23/00
CPC分类号： H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/48 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/81191 , H01L2224/81815 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
摘要翻译：组合衬底包括具有多个第一金属柱的第一衬底，具有多个第二金属柱的第二衬底，使得第二金属柱分别定位成与第一金属柱相对，以及插入在第一金属柱和第二金属柱之间的多个焊料结构第二金属柱。第一金属柱和/或第二金属柱具有形成为使得焊料结构分别形成在凹陷表面上的凹陷表面。

6. 发明授权

US09917025B2 Printed wiring board and method for manufacturing printed wiring board 有权
公开(公告)号：US09917025B2
公开(公告)日：2018-03-13
申请号：US14741011
申请日：2015-06-16
申请人： IBIDEN CO., LTD.
发明人： Kota Noda , Takeshi Furusawa
IPC分类号： H05K1/11 , H05K1/14 , H01L23/13 , H05K3/46 , H01L25/10 , H05K1/02 , H01L23/498 , H01L23/00
CPC分类号： H01L23/13 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L25/105 , H01L2224/131 , H01L2224/16227 , H01L2224/16237 , H01L2224/81192 , H01L2224/81395 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81464 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/15153 , H01L2924/3511 , H01L2924/3512 , H05K1/0271 , H05K3/4697 , H05K2201/09827 , H05K2201/10674 , Y10T29/49158 , H01L2924/014 , H01L2924/00014
摘要： A printed wiring board includes a first circuit board having a first surface and a second surface, and a second circuit board having a third surface and a fourth surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board is in contact with the third surface of the second circuit board, the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board, and the first circuit board and the second circuit board are formed such that a ratio H1/h1 is in a range that is greater than 0.75 and smaller than 2.4, where H1 represents a thickness of the first circuit board and h1 represents a thickness of the second circuit board.

7. 发明授权

US09713267B2 Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post 有权
公开(公告)号：US09713267B2
公开(公告)日：2017-07-18
申请号：US14674301
申请日：2015-03-31
申请人： IBIDEN CO., LTD.
发明人： Toru Furuta , Takeshi Furusawa , Tomoya Terakura
IPC分类号： H05K1/11 , H05K3/40 , H05K1/02 , H05K3/00 , H05K3/28 , H05K3/34
CPC分类号： H05K3/4007 , H05K1/0271 , H05K1/111 , H05K3/0097 , H05K3/282 , H05K3/3436 , H05K2201/0355 , H05K2201/0376 , H05K2201/09745 , H05K2201/09772 , H05K2203/0369 , H05K2203/1536 , Y02P70/611 , Y10T29/49165
摘要： A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.

8. 发明授权

US09474158B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09474158B2
公开(公告)日：2016-10-18
申请号：US14329453
申请日：2014-07-11
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takeshi Furusawa , Keisuke Shimizu , Yuichi Nakamura
IPC分类号： H05K1/18 , H05K3/46 , H01L23/00 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/34 , H01L21/56
CPC分类号： H05K1/185 , H01L21/568 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/73267 , H01L2224/83005 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/15311 , H01L2924/1533 , H01L2924/18162 , H01L2924/19105 , H05K1/0203 , H05K1/113 , H05K3/0097 , H05K3/3489 , H05K3/4602 , H05K3/4673 , H05K2201/068 , H05K2201/094 , H05K2203/1536 , H05K2203/308 , H01L2224/19
摘要： A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers.
摘要翻译：布线板包括第一树脂绝缘层，位于第一绝缘层的第一表面上的电子部件，形成在第一绝缘层的第一表面上的第二树脂绝缘层，使得第二绝缘层嵌入电子部件，形成在第二绝缘层上的导电层，形成在导电层和第二绝缘层上的第三树脂绝缘层和形成在第二绝缘层中的连接通孔导体，使得连接通孔导体是电子部件的连接电极和第二绝缘层上的导电层。第一绝缘层在第一绝缘层的与第一表面相对的第二表面侧具有衬垫结构，第一绝缘层的热膨胀系数设定为低于第二绝缘层和第三绝缘层的热膨胀系数。

9. 发明授权

US09401320B2 Combined substrate 有权
标题翻译：组合底物
公开(公告)号：US09401320B2
公开(公告)日：2016-07-26
申请号：US14638324
申请日：2015-03-04
申请人： IBIDEN CO., LTD.
发明人： Tomoya Daizo , Takema Adachi , Takeshi Furusawa , Wataru Nakamura , Yuki Ito , Yuki Yoshikawa , Tomoyoshi Hirabayashi
IPC分类号： H01L23/498 , H01L25/10 , H01L25/00 , H01L23/00
CPC分类号： H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/48 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/81191 , H01L2224/81815 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
摘要翻译：组合衬底包括具有多个第一金属柱的第一衬底，具有多个第二金属柱的第二衬底，使得第二金属柱分别定位成与第一金属柱相对，以及插入在第一金属柱和第二金属柱之间的多个焊料结构第二金属柱。第一金属柱和/或第二金属柱具有形成为使得焊料结构分别形成在凹陷表面上的凹陷表面。

10. 发明申请

US20130215586A1 WIRING SUBSTRATE 审中-公开
标题翻译：接线基板
公开(公告)号：US20130215586A1
公开(公告)日：2013-08-22
申请号：US13690689
申请日：2012-11-30
申请人： IBIDEN Co., Ltd.
发明人： Takeshi Furusawa , Shinobu Kato , Toshiki Furutani
IPC分类号： H05K1/18
CPC分类号： H05K1/184 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L2224/16 , H01L2224/73204 , H05K1/0206 , H05K1/113 , H05K1/115 , H05K3/4644 , H05K2201/096
摘要： A wiring substrate includes a motherboard including insulation layers, conductive layers and interlayer connection conductors, a packaging substrate mounted to the motherboard and having through-hole conductors, pads positioned to mount a semiconductor, uppermost via conductors connecting the through-hole conductors and the pads for the semiconductor, pads positioned to connect a motherboard and lowermost via conductors connecting the through-hole conductors and the pads for the motherboard, and bonding members interposed between the motherboard and packaging substrate and connecting the pads for the motherboard and an outermost conductive layer of the motherboard facing the packaging substrate. The pads for the motherboard, lowermost via conductors, through-hole conductors, uppermost via conductors, bonding members and interlayer connection conductors include a pad, a lowermost via conductor, a through-hole conductor, a bonding member and a stacked interlayer connection conductor structure which are positioned to align in a straight line.
摘要翻译：布线基板包括：主板，包括绝缘层，导电层和层间连接导体，安装在母板上并具有通孔导体的封装基板，定位成安装半导体的焊盘，最上层通孔导体，连接通孔导体和焊盘对于半导体，定位成连接主板和连接通孔导体和用于母板的焊盘的最下通孔导体的焊盘以及插入在母板和封装衬底之间的接合构件并且连接用于母板的焊盘和最外层的导电层主板面向封装基板。用于母板，最下通孔导体，通孔导体，最上通孔导体，接合部件和层间连接导体的焊盘包括焊盘，最下通孔导体，通孔导体，接合部件和层叠的层间连接导体结构其被定位成直线对准。

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