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21. 发明授权

US10446956B2 Flexible circuits for electrical harnesses 有权
公开(公告)号：US10446956B2
公开(公告)日：2019-10-15
申请号：US16371708
申请日：2019-04-01
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC分类号： H01B7/04 , H01R12/59 , H01B7/08 , H05K1/02 , B60J5/04 , B60R16/02 , H01B7/00 , H01R43/20 , H01R12/69 , H01B7/42 , H01B13/012
摘要： Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

22. 发明申请

US20190098745A1 SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER 审中-公开
公开(公告)号：US20190098745A1
公开(公告)日：2019-03-28
申请号：US16200227
申请日：2018-11-26
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown
IPC分类号： H05K1/02 , H05K1/18 , H01L33/64
摘要： Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

23. 发明授权

US10211443B2 Battery interconnects 有权
公开(公告)号：US10211443B2
公开(公告)日：2019-02-19
申请号：US15289028
申请日：2016-10-07
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown , Paul Tsao
IPC分类号： H01M2/20 , H01M2/34 , H05K1/11 , H05K1/18 , H05K3/40 , H01M10/48 , H01M10/42 , H05K1/02
摘要： Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

24. 发明申请

US20180301832A1 Flexible Circuits for Electrical Harnesses 审中-公开
公开(公告)号：US20180301832A1
公开(公告)日：2018-10-18
申请号：US15952773
申请日：2018-04-13
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC分类号： H01R12/59 , H01R12/69 , H01B7/08 , H01B7/04 , H01R43/20 , H01B7/00 , H05K1/02 , B60R16/02 , B60J5/04
CPC分类号： H01R12/592 , B60J5/0413 , B60R16/0215 , B60Y2410/115 , H01B7/0045 , H01B7/04 , H01B7/08 , H01B7/421 , H01B13/01254 , H01R12/69 , H01R43/205 , H01R2201/26 , H05K1/0201 , H05K1/028 , H05K2201/052
摘要： Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

25. 发明申请

US20180063943A1 SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER 审中-公开
公开(公告)号：US20180063943A1
公开(公告)日：2018-03-01
申请号：US15787676
申请日：2017-10-18
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown
IPC分类号： H05K1/02 , H05K1/18 , H01L33/64
CPC分类号： H05K1/0209 , H01L33/647 , H05K1/18 , H05K2201/10106
摘要： Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

26. 发明申请

US20170034902A1 SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER 有权
标题翻译：用于组合的热和电能传递的系统和方法
公开(公告)号：US20170034902A1
公开(公告)日：2017-02-02
申请号：US15259518
申请日：2016-09-08
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0209 , H01L33/647 , H05K1/18 , H05K2201/10106
摘要： Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.
摘要翻译：提供了用于将电和热能组合的连接到连接到这些电路的设备的互连电路。还提供了制造这种互连电路的方法。互连电路可以包括电热导体和至少一个绝缘体，其相对于彼此提供对导体的不同部分的支撑。绝缘体可以包括用于与电热导体电连接和/或热交换的一个或多个开口。导体的部分可以在最终电路中彼此电隔离。最初，这些部分可以由相同的导电片形成，例如具有至少约50微米厚度的金属箔。除了提供优异的导电性之外，该厚度确保了足够的热转印。在一些实施例中，导体可以包括表面涂层以保护其基材免受氧化，增强电连接和/或其它目的。

27. 发明公开

US20240154277A1 BATTERY INTERCONNECTS 审中-公开
公开(公告)号：US20240154277A1
公开(公告)日：2024-05-09
申请号：US18414170
申请日：2024-01-16
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Brown , Paul Tsao
IPC分类号： H01M50/581 , H01M10/48 , H01M50/503 , H01M50/522 , H01M50/526 , H05K1/11 , H05K1/18 , H05K3/40
CPC分类号： H01M50/581 , H01M10/482 , H01M50/503 , H01M50/522 , H01M50/526 , H05K1/118 , H05K1/189 , H05K3/4092 , H01M10/4257 , H01M2200/103
摘要： Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

28. 发明公开

US20240098873A1 INTERCONNECT CIRCUIT METHODS AND DEVICES 审中-公开
公开(公告)号：US20240098873A1
公开(公告)日：2024-03-21
申请号：US18521587
申请日：2023-11-28
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcom Parker Brown , Dongao Yang , Michael Lawrence Miller , Paul Henry Lego
IPC分类号： H05K1/02 , H01M50/519 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/20 , H05K3/28 , H05K3/46
CPC分类号： H05K1/0201 , H01M50/519 , H05K1/118 , H05K3/007 , H05K3/0073 , H05K3/06 , H05K3/20 , H05K3/281 , H05K3/4623 , H05K3/064 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2201/10037 , Y02E60/10
摘要： Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

29. 发明公开

US20230371174A1 FLEXIBLE INTERCONNECT CIRCUITS AND METHODS OF FABRICATION THEREOF 审中-公开
公开(公告)号：US20230371174A1
公开(公告)日：2023-11-16
申请号：US18351437
申请日：2023-07-12
申请人： CelLink Corporation
发明人： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
IPC分类号： H05K1/02 , H05K3/02
CPC分类号： H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
摘要： Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

30. 发明申请

US20230101123A1 TERMINAL-FREE CONNECTORS AND CIRCUITS COMPRISING TERMINAL-FREE CONNECTORS 有权
公开(公告)号：US20230101123A1
公开(公告)日：2023-03-30
申请号：US18060283
申请日：2022-11-30
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcom Parker Brown , Mark Terlaak , Will Findlay
IPC分类号： H01R12/77 , H01R12/59
摘要： Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.

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