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21. 发明申请

US20120212250A1 Semiconductor element testing system having air filter 审中-公开
标题翻译：具有空气过滤器的半导体元件测试系统
公开(公告)号：US20120212250A1
公开(公告)日：2012-08-23
申请号：US13067977
申请日：2011-07-13
申请人： Pi Hui Tai
发明人： Pi Hui Tai
IPC分类号： G01R31/26
CPC分类号： B01D46/0005 , B01D46/10 , B01D2279/45
摘要： A semiconductor element testing system having an air filter includes a testing apparatus, a first hollow frame, a fan assembly, a second hollow frame, and an air filter. The testing apparatus includes a housing having an opening. The first hollow frame is arranged on the housing and includes a flange, a bottom surface, and a side portion, wherein a plurality of hooks are fixedly arranged on the side portion. The fan assembly is fixed on the first hollow frame such that a forced airflow can be supplied toward inside of the housing. The second hollow frame includes an outer side portion fixedly arranged with a plurality of loop fasteners corresponding to the plural hooks. The air filter covers on the opening of the housing. Thereby, floating particles of the testing system can be reduced so as to lower the possibility of contamination for chips.
摘要翻译：具有空气过滤器的半导体元件测试系统包括测试设备，第一中空框架，风扇组件，第二中空框架和空气过滤器。测试装置包括具有开口的壳体。第一中空框架布置在壳体上并且包括凸缘，底表面和侧部，其中多个钩固定地布置在侧部上。风扇组件固定在第一中空框架上，使得朝向壳体内部供应强制气流。第二中空框架包括固定地布置有对应于多个钩的多个环紧固件的外侧部分。空气过滤器覆盖在外壳的开口上。因此，可以减少测试系统的漂浮颗粒，以降低芯片污染的可能性。

22. 发明授权

US07938611B2 Feeding apparatus of test equipment 失效
标题翻译：试验设备进料装置
公开(公告)号：US07938611B2
公开(公告)日：2011-05-10
申请号：US11280279
申请日：2005-11-17
申请人： Yuan-Chi Lin , Chih-Hung Hsieh
发明人： Yuan-Chi Lin , Chih-Hung Hsieh
IPC分类号： B65B69/00
CPC分类号： G01R31/2893
摘要： In the present invention, a feeding apparatus comprising a plurality of feeding mechanisms is provided. The feeding apparatus comprises a power source, a base, a rotating axle, a plurality of feeding mechanisms, a plurality of connecting units and a plurality of fixing units. The power source is driven to rotate the rotating axle, and then the feeding mechanisms are rotated by the rotating axle to proceed feeding process. In addition, the rotation of each of the feeding mechanisms is controlled by the connecting units and the fixing units. However, the feeding mechanisms can be rotated together or individually to proceed feeding process. Therefore, the production capacity is increased by the feeding apparatus, as well as the cost is reduced by decreasing power needed.
摘要翻译：在本发明中，提供了包括多个进给机构的进给装置。馈送装置包括电源，基座，旋转轴，多个馈送机构，多个连接单元和多个固定单元。驱动电源使旋转轴旋转，然后通过旋转轴旋转进给机构进行进给。此外，每个进给机构的旋转由连接单元和固定单元控制。然而，馈送机构可以一起旋转或单独旋转以进行馈送过程。因此，通过进给装置增加生产能力，并且通过减少所需的功率来降低成本。

23. 发明申请

US20110018568A1 Semiconductor test equipment with concentric pogo towers 有权
公开(公告)号：US20110018568A1
公开(公告)日：2011-01-27
申请号：US12591136
申请日：2009-11-10
申请人： Fong Jay Chen
发明人： Fong Jay Chen
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R31/2889
摘要： A semiconductor test equipment with concentric pogo towers is disclosed, which comprises a base, a tester head, an outer pogo tower, and an inner pogo tower. The inner pogo tower is concentrically received in the outer pogo tower, and a connecting slot of the inner pogo tower is correspondingly engaged with a connecting pin of the outer pogo tower. The outer pogo tower is fixed to the load board together with the inner pogo tower, whereby a plurality of outer pogo pins of the outer pogo tower and a plurality of inner pogo pins of the inner pogo tower are electrically connected to the load board respectively. Therefore, the present invention is capable of expanding the test specifications, but also to change rapidly from different test specifications through replacing a different probe card but without to modify any other hardware.

24. 发明授权

US07870527B2 Method for stacked pattern design of printed circuit board and system thereof 有权
标题翻译：印刷电路板的堆叠图案设计方法及其系统
公开(公告)号：US07870527B2
公开(公告)日：2011-01-11
申请号：US11970744
申请日：2008-01-08
申请人： Ming-Chin Tsai
发明人： Ming-Chin Tsai
IPC分类号： G06F17/50
CPC分类号： G06N3/126 , G06F17/5068 , H05K3/0005 , H05K3/4611 , H05K2201/0352 , H05K2201/09736
摘要： A method for designing stacked pattern of PCB utilizing genetic algorithm and the system thereof are disclosed. The method comprises the following steps: First of all, information data of stacked pattern is inputted into operational interface of the software; Next, initial solution sets of stacked pattern are generated; Then, duplications of the initial solution sets of stacked pattern are generated according to a fitness function; Afterward, crossover of the duplications of stacked pattern are performed at random; Then, mutations are executed by a probability at random; Finally, identification is performed to check if the solution approaches the standard of demand and the result of stacked pattern is shown; otherwise, operational step jumps to duplicate step and repeats above steps until satisfying solution is obtained. The most suitable way for package can be arranged out through making especially mathematical calculations by the system efficiently.
摘要翻译：公开了一种利用遗传算法设计PCB堆叠图案的方法及其系统。该方法包括以下步骤：首先将堆叠模式的信息数据输入软件的操作界面; 接下来，生成堆叠图案的初始解集; 然后，根据适应度函数生成堆叠模式的初始解集的重复; 之后，堆叠图案的重复的交叉随机进行; 然后，以概率随机地执行突变; 最后，进行识别以检查解决方案是否接近需求标准，并显示堆叠模式的结果; 否则，操作步骤跳转到重复步骤，重复上述步骤，直到获得满足的解。最合适的包装方式可以通过系统进行特别的数学计算来排除。

25. 发明申请

US20100237879A1 METHOD AND APPARATUS FOR IMPROVING YIELD RATIO OF TESTING 有权
标题翻译：用于提高测试屈服比的方法和装置
公开(公告)号：US20100237879A1
公开(公告)日：2010-09-23
申请号：US12610270
申请日：2009-10-30
申请人： WEI-PING WANG , Hsuan-Chung KO
发明人： WEI-PING WANG , Hsuan-Chung KO
IPC分类号： G01R27/28
CPC分类号： G01R31/2894 , G01R31/2879
摘要： A method and apparatus for improving yield ratio of testing are disclosed. The method includes the following steps. First of all, devices are tested and electromagnetic interference is measured. Next, the test results are examined for whether the devices pass the test or not. Then, electromagnetic interference data are examined for whether the electromagnetic interference data are over a predetermined standard if the devices fail the test. The above-mentioned steps are performed again if the electromagnetic interference data are over a predetermined standard. The test is terminated if the devices still fail the test and the values of electromagnetic interference are still over a predetermined standard.
摘要翻译：公开了一种用于提高测试屈服比的方法和装置。该方法包括以下步骤。首先，测试设备并测量电磁干扰。接下来，检查测试结果是否通过测试。然后，如果设备未通过测试，则检查电磁干扰数据是否超过预定标准。如果电磁干扰数据超过预定标准，则再次执行上述步骤。如果设备仍然测试失败并且电磁干扰值仍然超过预定标准，则测试终止。

26. 发明授权

US07772861B2 Probe card 有权
标题翻译：探针卡
公开(公告)号：US07772861B2
公开(公告)日：2010-08-10
申请号：US12259249
申请日：2008-10-27
申请人： Cheng-Chin Ni
发明人： Cheng-Chin Ni
IPC分类号： G01R31/02
CPC分类号： G01R1/07342 , G01R1/06716 , G01R1/06772
摘要： The present invention discloses a probe card for testing a wafer. The probe card comprises a printed circuit board for transmitting test signals, a fastened ring arranged at the downside of the printed circuit board, and a plurality of needles passing through the fastened ring, each needle having one end connecting to circuits of the printed circuit board, and having a tip portion at the other end connecting to a pad of the wafer, where each needle has at least one bent portion between the fastened ring and the tip portion, to absorb stress between the needle and the pad.
摘要翻译：本发明公开了一种用于测试晶片的探针卡。探针卡包括用于传输测试信号的印刷电路板，布置在印刷电路板的下侧的紧固环和穿过紧固环的多根针，每个针的一端连接到印刷电路板的电路并且在另一端具有连接到晶片的焊盘的尖端部分，其中每个针在紧固环和尖端部分之间具有至少一个弯曲部分，以吸收针和衬垫之间的应力。

27. 发明授权

US07701233B2 Heat-resistant lens kit 失效
标题翻译：耐热镜片套件
公开(公告)号：US07701233B2
公开(公告)日：2010-04-20
申请号：US11819083
申请日：2007-06-25
申请人： Tai Pi-Hui
发明人： Tai Pi-Hui
IPC分类号： G01R31/02
CPC分类号： G01R31/2874
摘要： A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole.
摘要翻译：公开了一种配置在晶片测试器的波峰塔内的耐热透镜套件。耐热透镜套件具有两个平行透镜和具有通孔的主体。主体和两个平行透镜在通孔内包围一个真空室。

28. 发明授权

US07501809B2 Electronic component handling and testing apparatus and method for electronic component handling and testing 失效
标题翻译：电子部件处理和电子部件处理和测试的测试装置和方法
公开(公告)号：US07501809B2
公开(公告)日：2009-03-10
申请号：US11652695
申请日：2007-01-12
申请人： Hsieh Chih-Hung
发明人： Hsieh Chih-Hung
IPC分类号： G01R31/28
CPC分类号： G01R31/2893
摘要： The present invention discloses an electronic testing apparatus and a continuous test method for electronic component, which includes multiple test areas, each area possesses respective pick and place module. The apparatus includes multiple shuttles located between the test area and input/output trays. Moreover, a further pick and place module is utilized, between the shuttles and the input/output trays, for picking and placing the devices under test or tested device. The method delivers different electronic component to different test area for testing by different shuttles and to perform testing continuously.
摘要翻译：本发明公开了一种电子元件的电子测试装置和连续测试方法，其包括多个测试区域，每个区域都具有相应的拾放模块。该装置包括位于测试区域和输入/输出托盘之间的多个梭子。此外，在梭子和输入/输出托盘之间，还用于拾取和放置被测器件或被测试器件的另外的拾放模块。该方法将不同的电子元件提供给不同的测试区域，用于通过不同的梭子进行测试，并连续进行测试。

29. 发明授权

US11500012B2 Semiconductor component burn-in test module and burn-in test equipment 有权
公开(公告)号：US11500012B2
公开(公告)日：2022-11-15
申请号：US17078126
申请日：2020-10-23
申请人： King Yuan Electronics Co., Ltd.
发明人： Chia-Hung Tsai , Kuo-Jung Wu , Hsing-Yueh Liang , Po-Wei Liao , Yi-Ting Wang
IPC分类号： G01R31/28
摘要： A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards. Also disclosed is a semiconductor component burn-in test equipment using at least one semiconductor component burn-in test module.

30. 发明申请

US20220229031A1 TITRATION MODULE, TEST APPARATUS AND METHOD FOR MEASURING TITRATION CONTACT ANGLES 有权
公开(公告)号：US20220229031A1
公开(公告)日：2022-07-21
申请号：US17522998
申请日：2021-11-10
申请人： King Yuan Electronics Co., Ltd.
发明人： Chieh-Wen LU , Yu-Hao CIOU , Po-Ting LAI , Kuang-Hsiang LIU
IPC分类号： G01N31/16 , G01B7/30 , G01B11/06
摘要： A titration module includes a base, at least one titration unit, a contact angle measuring module, and a computing unit. The at least one titration unit is disposed above the base for titrating a globule onto a device under test. The contact angle measurement module is disposed above the base for measuring a first height and a first radius of the globule. The computing unit can calculate a second radius according to the first height and the first radius, and can calculate a contact angle of the globule according to the first height and the second radius. Also disclosed are a test apparatus, and a method for measuring titration contact angles.

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