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    • 32. 发明授权
    • High breakdown voltage semiconductor device
    • 高击穿电压半导体器件
    • US5378920A
    • 1995-01-03
    • US85055
    • 1993-07-02
    • Akio NakagawaNorio Yasuhara
    • Akio NakagawaNorio Yasuhara
    • H01L21/336H01L21/74H01L21/762H01L27/06H01L27/092H01L27/12H01L29/06H01L29/40H01L29/739H01L29/74H01L29/745H01L29/749H01L29/78H01L29/786H01L29/861
    • H01L29/7824H01L21/74H01L21/76264H01L21/76297H01L27/0623H01L27/0922H01L27/1203H01L29/404H01L29/405H01L29/407H01L29/408H01L29/66772H01L29/7394H01L29/7436H01L29/7455H01L29/749H01L29/7835H01L29/78624H01L29/8611H01L21/76275H01L21/76286H01L29/402
    • A high breakdown voltage semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a first semiconductor region formed on the first insulating film, a second semiconductor region of a first conductivity type having an impurity concentration higher than that of the first semiconductor region and selectively formed on a surface portion of the first semiconductor region, a third semiconductor region having an impurity concentration lower than that of the second semiconductor region and formed on the surface portion of the first semiconductor region so as to be adjacent to or near the second semiconductor region and a fourth semiconductor region of a second conductivity type having an impurity concentration higher than that of the first semiconductor region and formed on the surface portion of the first semiconductor region so as to be outside the third semiconductor region. A fifth semiconductor region having an impurity concentration lower than that of the second or fourth semiconductor region is formed on a bottom portion of the first semiconductor region. When a reverse bias is applied between the second and fourth semiconductor regions, a depletion layer extends vertically in the first semiconductor region and laterally in the fifth semiconductor region. The applied voltage is divided in both the directions and a high breakdown voltage can be obtained.
    • 高耐压电压半导体器件包括半导体衬底,形成在半导体衬底上的第一绝缘膜,形成在第一绝缘膜上的第一半导体区域,具有高于第一绝缘膜的杂质浓度的第一导电类型的第二半导体区域 第一半导体区域,并且选择性地形成在第一半导体区域的表面部分上,第三半导体区域具有杂质浓度低于第二半导体区域的杂质浓度,并形成在第一半导体区域的表面部分上,以便邻近或 在第二半导体区域附近形成杂质浓度高于第一半导体区域的第二导电类型的第四半导体区域,并且形成在第一半导体区域的表面部分上,以便在第三半导体区域的外部。 在第一半导体区域的底部形成有杂质浓度低于第二或第四半导体区域的第五半导体区域。 当在第二和第四半导体区域之间施加反向偏压时,耗尽层在第一半导体区域中垂直延伸并且在第五半导体区域中横向延伸。 施加的电压在两个方向上被分割,并且可以获得高的击穿电压。