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1. 发明授权

US08987912B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08987912B2
公开(公告)日：2015-03-24
申请号：US13020235
申请日：2011-02-03
申请人： Yoshihiro Yamaguchi
发明人： Yoshihiro Yamaguchi
IPC分类号： H01L23/02 , H01L23/52 , H01L23/48 , H01L23/10 , H01L23/34 , H01L29/40 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/495 , H01L23/498 , H01L23/00
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49531 , H01L23/49811 , H01L24/01 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/73 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end electrically connected to the conductor; and a sealing resin sealing the substrate, the semiconductor chip and the electrode. The electrode is configured to be extendable and contractible in the stacking direction in which the substrate and the semiconductor chip are stacked in the state before sealing of the sealing resin. The edge of the other end of the electrode is exposed from the sealing resin. The electrode has a hollow space opened at the edge of the other end. Therefore, a semiconductor device reduced in size and a method of manufacturing this semiconductor device can be provided.
摘要翻译：半导体器件包括具有导体的衬底; 半导体芯片，其设置在所述基板上并电连接到所述导体; 管状电极，其一端电连接到导体; 以及将基板，半导体芯片和电极密封的密封树脂。电极被配置为在密封树脂密封之前的状态下层叠基板和半导体芯片的堆叠方向上可伸缩。电极另一端的边缘从密封树脂露出。电极具有在另一端的边缘处开口的中空空间。因此，可以提供尺寸减小的半导体器件和制造该半导体器件的方法。

2. 发明授权

US08976193B2 Information processing apparatus, information processing method, and computer program 有权
标题翻译：信息处理装置，信息处理方法和计算机程序
公开(公告)号：US08976193B2
公开(公告)日：2015-03-10
申请号：US11754582
申请日：2007-05-29
申请人： Hiroki Takakura , Shiro Miyagi , Yoshihiro Yamaguchi
发明人： Hiroki Takakura , Shiro Miyagi , Yoshihiro Yamaguchi
IPC分类号： G09G5/00 , G06F17/30 , G06F3/0481
CPC分类号： G06F17/30265 , G06F3/0481
摘要： An information processing apparatus that executes information display processing is disclosed. The apparatus includes: a display unit that executes information display; and a data processing unit that executes a control of the information display of the display unit and data processing based on a user input. The data processing unit displays an image browsing screen, which corresponds to image data stored in a storage unit, on the display unit and executes display of a map at the position, which corresponds to position information included in attribute information of a selected image, on the basis of a user's input of image selection information and map display request.
摘要翻译：公开了执行信息显示处理的信息处理装置。该装置包括：执行信息显示的显示单元; 以及数据处理单元，其执行对显示单元的信息显示的控制和基于用户输入的数据处理。该数据处理单元将与存储在存储单元中的图像数据相对应的图像浏览屏幕显示在显示单元上，并且在与所选择的图像的属性信息中包括的位置信息对应的位置上执行地图的显示，用户输入图像选择信息和地图显示请求的基础。

3. 发明授权

US08729421B2 Thermal cutting machine and thermal cutting method 有权
标题翻译：热切割机和热切割方法
公开(公告)号：US08729421B2
公开(公告)日：2014-05-20
申请号：US11629283
申请日：2005-06-02
申请人： Satoshi Ohnishi , Yoshihiro Yamaguchi
发明人： Satoshi Ohnishi , Yoshihiro Yamaguchi
IPC分类号： B23K9/02
CPC分类号： B23K37/0408 , B23K7/002 , B23K10/00 , B23K26/0884 , B23K26/16 , B23K26/38 , B23K26/702 , B23K37/0461 , B23K2101/18
摘要： A lattice pallet 13 having a large number of supporters for placing a plate 14 is installed to a table 12 so as to be freely fittable and removable. Bringing in of the plate 14 is performed by the method of raising the lattice pallet 13 with a crane with the plate 14 already having been loaded upon the lattice pallet 13 in a different location, transporting them over the table 12, and lowering them down onto the table 12. Directly after cutting has been completed, the lattice pallet 12 is raised and separated from the table 12 with the manufactured product and the left over material carried upon it and is taken away to a different location, and another lattice pallet 13 with another plate 14 mounted upon it is brought in with the crane upon the table 12, and the task of cutting this other plate 14 is commenced.
摘要翻译：具有用于放置板14的大量支撑器的格子托盘13被安装到桌子12上，以便可自由地装配和拆卸。通过用起重机提升格子托盘13的方法来进行板14的进入，该起重机已将板14已经装载在不同位置的格子托盘13上，将它们运送到工作台12上，并将它们下降到桌子12.切割完成之后，格子托盘12被升起并与工作台12分离，制成品并将剩下的材料运送到其上并被带走到不同的位置，另一个格子托盘13具有安装在其上的另一个板14与起重机一起被放置在工作台12上，并且开始切割另一个板14的任务。

4. 发明申请

US20130240912A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130240912A1
公开(公告)日：2013-09-19
申请号：US13988535
申请日：2011-12-05
申请人： Hiroki Shiota , Seiji Oka , Yoshihiro Yamaguchi
发明人： Hiroki Shiota , Seiji Oka , Yoshihiro Yamaguchi
IPC分类号： H01L23/495 , H01L29/16
CPC分类号： H01L23/49568 , H01L23/3121 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/072 , H01L29/1602 , H01L29/1608 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a semiconductor element; a lead frame connected to the semiconductor element; a metal base plate mounted on the lead frame via a first insulation layer; and a second insulation layer disposed on the opposite side of the metal base plate face on which the first insulation layer is disposed; wherein the first insulation layer is an insulation layer whose heat-dissipation performance is higher than that of the second insulation layer, and the second insulation layer is an insulation layer whose insulation performance is the same as that of the first insulation layer or higher than that of the first insulation layer.
摘要翻译：一种半导体器件，包括：半导体元件; 连接到所述半导体元件的引线框架; 通过第一绝缘层安装在引线框架上的金属基板; 以及第二绝缘层，其设置在设置有所述第一绝缘层的所述金属基板面的相对侧上; 其特征在于，所述第一绝缘层是绝热层，其绝热性能比所述第二绝缘层高，绝缘性能与所述第一绝缘层的绝缘性能相同，的第一绝缘层。

5. 发明授权

US08530738B2 Dye-sensitized solar cell 失效
标题翻译：染料敏化太阳能电池
公开(公告)号：US08530738B2
公开(公告)日：2013-09-10
申请号：US13254920
申请日：2010-03-04
申请人： Shuzi Hayase , Yoshihiro Yamaguchi
发明人： Shuzi Hayase , Yoshihiro Yamaguchi
IPC分类号： H01L31/0248 , H01L31/0216
CPC分类号： H01G9/2072 , H01G9/2031 , H01G9/2059 , H01L51/0064 , H01M14/005 , Y02E10/542 , Y02P70/521
摘要： There is provided a tandem-type dye-sensitized solar cell having a novel structure whereby optical absorption efficiency is improved and which can be manufactured at low cost.A dye-sensitized solar cell 10 comprises an anode substrate 12, a first dye-carrying porous oxide semiconductor layer 14, an electrolytic solution layer 16a, a porous support layer 18, a second dye-carrying porous oxide semiconductor layer 20, an electrolytic solution layer 16b, and a cathode substrate 22, arranged in order from an optical incidence side. The porous support layer 18 supports an iodine redox catalyst layer 19. Electrons derived by a conductor from a conductor layer 12b are introduced to the cathode substrate 22, thereby configuring, for example, a battery circuit for lighting purposes.
摘要翻译：提供了具有新型结构的串联型染料敏化太阳能电池，由此光学吸收效率提高并且可以以低成本制造。染料敏化太阳能电池10包括阳极基底12，第一染料负载多孔氧化物半导体层14，电解液层16a，多孔载体层18，第二染料负载多孔氧化物半导体层20，电解溶液层16b和阴极基板22，从光入射侧依次配置。多孔支撑层18支撑碘氧化还原催化剂层19.由导体层12b导体产生的电子引入阴极基板22，从而构成例如用于照明目的的电池电路。

6. 发明授权

US08439343B2 Image forming apparatus with cassette configured to store various sizes of sheets 失效
标题翻译：具有盒的图像形成装置，其被配置为存储各种尺寸的片材
公开(公告)号：US08439343B2
公开(公告)日：2013-05-14
申请号：US12857593
申请日：2010-08-17
申请人： Yoshihiro Yamaguchi
发明人： Yoshihiro Yamaguchi
IPC分类号： B65H3/44
CPC分类号： B65H3/44 , B65H1/14 , B65H1/266 , B65H5/26 , B65H7/02 , B65H2402/441 , B65H2405/114 , B65H2405/3311 , B65H2511/212 , B65H2511/414 , B65H2511/514 , B65H2801/06 , B65H2220/03 , B65H2220/02 , B65H2220/01 , B65H2220/11
摘要： An image forming apparatus for forming an image on a sheet including: a housing; a cassette detachably accommodated in the housing and configured to store the sheet; a feeding unit configured to feed the sheet; and an image forming unit configured to form the image on the sheet fed by the feeding unit, wherein the cassette includes: a first wall along the trailing edge, a second wall along the leading edge, a first bottom plate extending from the first wall toward the second wall, a second bottom plate extending from the second wall toward the first wall, and a connecting member configured to set a first state where the first and second bottom plates are connected and a second state where the first and second bottom plates are disconnected, and the first and second bottom plates in the second state are independently withdrawable from the housing.
摘要翻译：一种用于在片材上形成图像的图像形成装置，包括：壳体; 盒，其可拆卸地容纳在所述壳体中并且被配置为存储所述片材; 进给单元，其构造成供给所述片材; 以及图像形成单元，被配置为在由所述馈送单元馈送的片材上形成图像，其中所述盒包括：沿着所述后缘的第一壁，沿着所述前缘的第二壁，从所述第一壁朝向所述第二壁，从所述第二壁朝向所述第一壁延伸的第二底板，以及连接构件，其被配置为设定所述第一和第二底板连接的第一状态以及所述第一和第二底板断开的第二状态并且处于第二状态的第一和第二底板可独立地从壳体抽出。

7. 发明申请

US20120313252A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120313252A1
公开(公告)日：2012-12-13
申请号：US13405890
申请日：2012-02-27
申请人： Tetsuya UEDA , Yoshihiro YAMAGUCHI
发明人： Tetsuya UEDA , Yoshihiro YAMAGUCHI
IPC分类号： H01L23/48
CPC分类号： H01L23/4334 , H01L23/3121 , H01L23/3735 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device includes a base plate having one main surface joined to an insulating substrate on which a semiconductor chip and the like are mounted and a transfer mold resin which is so provided as to cover the one main surface of the base plate, the insulating substrate, the semiconductor chip, and the like and expose the other main surface of the base plate. The coefficient of linear expansion of the base plate is lower than that of copper and the coefficient of linear expansion of the transfer mold resin is not higher than 16 ppm/° C. The transfer mold resin has such scooped shapes as to expose opposed short-side centers and the vicinity of the base plate, respectively. The base plate has mounting holes in portions exposed by the scooped shapes of the transfer mold resin.
摘要翻译：半导体器件包括：基板，其具有连接到其上安装有半导体芯片等的绝缘基板的一个主表面和设置成覆盖基板的一个主表面的转移模制树脂，绝缘基板，半导体芯片等，露出基板的另一个主表面。基板的线膨胀系数低于铜，传递模塑树脂的线膨胀系数不高于16ppm /℃。转印模具树脂具有这样的舀出形状，侧面中心和基板附近。基板具有由转移模塑树脂的舀出形状露出的部分的安装孔。

8. 发明授权

US08281714B2 Fume disposal process and fume disposal system 失效
标题翻译：烟气处理过程和烟雾处理系统
公开(公告)号：US08281714B2
公开(公告)日：2012-10-09
申请号：US12083176
申请日：2006-08-28
申请人： Yoshihiro Yamaguchi , Satoshi Ohnishi , Takahiro Hata , Yukihiro Ishikuri
发明人： Yoshihiro Yamaguchi , Satoshi Ohnishi , Takahiro Hata , Yukihiro Ishikuri
IPC分类号： B22F3/02 , B22F3/03 , B30B11/00 , B30B11/02 , B30B15/30
CPC分类号： B01D46/48 , B08B15/00 , B23K37/006 , B30B9/327
摘要： For collecting fine particles from fume generated in the process of thermal cutting or welding of a metal material and solidifying them, a fume disposal system comprises a fume introducing chamber 25 which is connected to a cutting machine body through a suction duct 2 and into which suctioned fume is introduced; a bug filter 24 for separating and collecting fine particles from the fume introduced into the fume introducing chamber 25; a hopper 22 for storing the separated, collected fine particles; a screw conveyor for conveying the fine particles stored in the hopper 22 to a molding chamber; and a pressurizing device 38 for pressurizing the fine particles fed into the molding chamber to reduce the volume thereof.
摘要翻译：为了从在金属材料的热切割或焊接过程中产生的烟雾中收集细颗粒并将其固化，烟气处理系统包括烟气引入室25，烟气引入室25通过抽吸管道2连接到切割机主体并被吸入引入烟雾用于从引入烟气引入室25的烟雾中分离和收集细颗粒的臭味过滤器24; 用于存储分离的收集的细颗粒的料斗22; 用于将存储在料斗22中的细颗粒输送到模制室的螺旋输送机; 以及加压装置38，用于对进入模制室的细颗粒进行加压以减小其体积。

9. 发明申请

US20110266686A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110266686A1
公开(公告)日：2011-11-03
申请号：US13020235
申请日：2011-02-03
申请人： Yoshihiro YAMAGUCHI
发明人： Yoshihiro YAMAGUCHI
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49531 , H01L23/49811 , H01L24/01 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/73 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end electrically connected to the conductor; and a sealing resin sealing the substrate, the semiconductor chip and the electrode. The electrode is configured to be extendable and contractible in the stacking direction in which the substrate and the semiconductor chip are stacked in the state before sealing of the sealing resin. The edge of the other end of the electrode is exposed from the sealing resin. The electrode has a hollow space opened at the edge of the other end. Therefore, a semiconductor device reduced in size and a method of manufacturing this semiconductor device can be provided.
摘要翻译：半导体器件包括具有导体的衬底; 半导体芯片，其设置在所述基板上并电连接到所述导体; 管状电极，其一端电连接到导体; 以及将基板，半导体芯片和电极密封的密封树脂。电极被配置为在密封树脂密封之前的状态下堆叠衬底和半导体芯片的层叠方向上可伸缩。电极另一端的边缘从密封树脂露出。电极具有在另一端的边缘处开口的中空空间。因此，可以提供尺寸减小的半导体器件和制造该半导体器件的方法。

10. 发明申请

US20110134257A1 SYSTEM, APPARATUS, METHOD, PROGRAM AND RECORDING MEDIUM FOR PROCESSING IMAGE 有权
标题翻译：用于处理图像的系统，装置，方法，程序和记录介质
公开(公告)号：US20110134257A1
公开(公告)日：2011-06-09
申请号：US12977835
申请日：2010-12-23
申请人： Tamaki Kojima , Yoshihiro Yamaguchi , Mikio Sakemoto , Katsuhiro Takematsu
发明人： Tamaki Kojima , Yoshihiro Yamaguchi , Mikio Sakemoto , Katsuhiro Takematsu
IPC分类号： H04N5/225
CPC分类号： G06F17/30256 , G06F17/30017 , G06F17/30247 , G06F17/3028 , G06K9/00268 , G06K9/00288 , G06K9/46 , G06K9/4647 , G06K9/4652 , G06K9/481 , G06K9/6212 , G06T7/70 , G06T2207/10004 , G06T2207/10024 , G06T2207/30201 , G06T2207/30242 , H04N7/183
摘要： An image processing system may include an imaging device for capturing an image and an image processing apparatus for processing the image. The imaging device may include an imaging unit for capturing the image, a first recording unit for recording information relating to the image, the information being associated with the image, and a first transmission control unit for controlling transmission of the image to the image processing apparatus. The image processing apparatus may include a reception control unit for controlling reception of the image transmitted from the imaging device, a feature extracting unit for extracting a feature of the received image, a second recording unit for recording the feature, extracted from the image, the feature being associated with the image, and a second transmission control unit for controlling transmission of the feature to the imaging device.
摘要翻译：图像处理系统可以包括用于捕获图像的成像装置和用于处理图像的图像处理装置。成像装置可以包括用于捕获图像的成像单元，用于记录与图像有关的信息的第一记录单元，与图像相关联的信息，以及用于控制图像传送到图像处理装置的第一传输控制单元。图像处理装置可以包括用于控制从成像装置发送的图像的接收的接收控制单元，用于提取接收图像的特征的特征提取单元，用于记录从图像提取的特征的第二记录单元，特征与图像相关联，以及第二传输控制单元，用于控制特征到成像装置的传输。

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