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    • 39. 发明授权
    • Vertical insulated gate semiconductor device having high current density
and high reliability
    • 具有高电流密度和高可靠性的垂直绝缘栅半导体器件
    • US5670811A
    • 1997-09-23
    • US430289
    • 1995-04-28
    • Mutsuhiro MoriTomoyuki TanakaYasumichi YasudaYasunori Nakano
    • Mutsuhiro MoriTomoyuki TanakaYasumichi YasudaYasunori Nakano
    • H01L21/225H01L21/331H01L21/336H01L29/739H01L29/78H01L29/76H01L29/94H01L31/062
    • H01L29/66333H01L21/2257H01L29/66712H01L29/7395H01L29/7802
    • The present invention is directed to a semiconductor device which can achieve high current density and which has a high reliability. In the insulated gate semiconductor device according to the present invention, a plurality of insulating gates are provided, with each two adjacent insulating gates being spaced from each other, the insulating gates being provided on a second semiconductor region of a first conductivity type. A first semiconductor region, of the same or different conductivity type from that of the second semiconductor region, extends from a surface of the second semiconductor region opposed to the surface thereof having the insulating gates thereon. A plurality of third semiconductor regions are provided in the second semiconductor region, between the insulating gates and aligned therewith, and two fourth semiconductor regions are provided extending into each of the third semiconductor regions, aligned with the sides of adjacent insulating gates. Electrodes are respectively provided in contact with the first semiconductor region and in contact with the third and fourth semiconductor regions, the electrode in contact with the third and fourth semiconductor regions contacting such regions in the space between adjacent insulating gates. By utilizing such aligned third and fourth semiconductor regions, an insulated gate semiconductor device which operates at high current densities can be fabricated at high accuracy, and such device will be less influenced by parasitic bipolar transistor effects.
    • 本发明涉及能够实现高电流密度并且具有高可靠性的半导体器件。 在根据本发明的绝缘栅半导体器件中,设置有多个绝缘栅极,每个两个相邻的绝缘栅极彼此间隔开,绝缘栅极设置在第一导电类型的第二半导体区域上。 与第二半导体区域相同或不同的导电类型的第一半导体区域从与其上具有绝缘栅极的表面相对的第二半导体区域的表面延伸。 多个第三半导体区域设置在第二半导体区域中,在绝缘栅极之间并与其对准,并且提供两个第四半导体区域,其延伸到每个第三半导体区域中,与相邻绝缘栅极的侧面对准。 电极分别设置成与第一半导体区域接触并且与第三和第四半导体区域接触,与第三和第四半导体区域接触的电极与相邻绝缘栅极之间的空间中的这些区域接触。 通过利用这种对准的第三和第四半导体区域,可以以高精度制造以高电流密度工作的绝缘栅极半导体器件,并且这种器件将受寄生双极晶体管效应的影响较小。
    • 40. 发明授权
    • Compound semiconductor device and electric power converting apparatus
using such device
    • 使用这种装置的复合半导体器件和电力转换装置
    • US5357120A
    • 1994-10-18
    • US912989
    • 1992-07-14
    • Mutsuhiro Mori
    • Mutsuhiro Mori
    • H01L27/06H01L29/745H01L29/749H02H7/122H01L29/10H01L29/74
    • H01L29/749H01L27/0623H01L29/7455
    • A compound semiconductor device is provided which includes a thyristor region constructed by four continuous layers of p-n-p-n and an MOSFET region which is formed in the intermediate n layer of the thyristor region so as to be away from the intermediate p layer. The MOSFET is constructed by a p well layer, a source layer, and a drain layer. One main electrode of the device is in ohmic contact with the outside p layer of the thyristor region. While the other main electrode is in ohmic contact with the source layer and well layer of the MOSFET region. An arrangement is provided for electrically connecting the outside n layer of the thyristor region and the drain layer of the MOSFET region. Also, a first insulating gate is formed on the well layer between the source layer and the drain layer of the MOSFET region and a second insulating gate is formed on the intermediate p layer of the thyristor region; with the first and second insulating gates being electrically connected.
    • 提供了一种化合物半导体器件,其包括由四个连续的p-n-p-n层构成的晶闸管区域和形成在晶闸管区域的中间n层中以远离中间p层的MOSFET区域。 MOSFET由p阱层,源极层和漏极层构成。 器件的一个主电极与晶闸管区域的外部p层欧姆接触。 而另一个主电极与MOSFET区域的源极层和阱层欧姆接触。 提供了用于电连接晶闸管区域的外部n层和MOSFET区域的漏极层的布置。 此外,在MOSFET区域的源极层和漏极层之间的阱层上形成第一绝缘栅极,在晶闸管区域的中间p层上形成第二绝缘栅极; 第一绝缘栅极和第二绝缘栅极电连接。