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41. 发明申请

US20140295623A1 METHOD OF PACKAGING A CHIP AND A SUBSTRATE 审中-公开
标题翻译：包装芯片和基板的方法
公开(公告)号：US20140295623A1
公开(公告)日：2014-10-02
申请号：US13853255
申请日：2013-03-29
申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.
发明人： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
IPC分类号： H01L21/56
CPC分类号： H01L21/4846 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3121 , H01L23/49811 , H01L23/49816 , H01L23/562 , H01L2221/68345 , H01L2224/73204
摘要： Disclosed is a method of packaging a chip and a substrate, including the steps of forming a substrate with a thickness ranging from 70 to 150 μm, which comprises a dielectric layer, a circuit metal layer stacked on the dielectric layer and bonding pads higher than the dielectric layer by 10 to 15 μm; forming a stabilizing structure around the substrate to provide a receiving space; disposing the chip on the receiving space and bonding the pins of the chip with the bonding pads; and filling up the receiving space under the chip with a filling material to a total thickness ranging from 300 to 850 μm. Without the plastic molding process, the present invention reduces the cost and the total thickness, and further prevents the substrate from warping by use of the stabilizing fixing structure.
摘要翻译：公开了一种封装芯片和基板的方法，包括以下步骤：形成厚度范围为70-150μm的基板，该基板包括介电层，堆叠在电介质层上的电路金属层和高于介电层10〜15μm; 在所述基板周围形成稳定结构以提供接收空间; 将芯片放置在接收空间上，并将芯片的引脚与焊盘接合; 并用填充材料填充芯片下方的接收空间，总厚度为300至850μm。没有塑料成型工艺，本发明降低了成本和总厚度，并且通过使用稳定固定结构进一步防止了基板翘曲。

42. 发明授权

US08754328B2 Laminate circuit board with a multi-layer circuit structure 有权
标题翻译：层压电路板具有多层电路结构
公开(公告)号：US08754328B2
公开(公告)日：2014-06-17
申请号：US13663141
申请日：2012-10-29
申请人： Kinsus Interconnect Technology Corp.
发明人： Jun-Chung Hsu , Chi-Ming Lin , Tso-Hung Yeh , Ya-Hsiang Chen
IPC分类号： H02G15/00 , H05K1/11
CPC分类号： H05K3/28 , H05K3/243 , H05K3/4644 , H05K2201/0347
摘要： A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface covers the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.
摘要翻译：公开了一种具有多层电路结构的叠层电路板，其包括基板，第一电路金属层，第二电路金属层，第一纳米镀层，第二纳米镀层和覆盖层。第一电路金属层嵌入衬底中或形成在衬底的平滑的至少一个表面上。具有光滑表面的第一纳米镀层覆盖第一电路金属层。第二纳米镀层形成在基板的另一个表面上，并填满覆盖层中的开口以电连接第一电路金属层。通过纳米电镀层和覆盖层/基板之间的化学键合来改善连接粘附。因此，电路金属层不需要粗糙化，电路密度增加。

43. 发明授权

US08377815B2 Manufacturing method of a semiconductor load board 有权
标题翻译：半导体负载板的制造方法
公开(公告)号：US08377815B2
公开(公告)日：2013-02-19
申请号：US13043463
申请日：2011-03-09
申请人： Chien-Wei Chang , Ting-Hao Lin , Ya-Hsiang Chen
发明人： Chien-Wei Chang , Ting-Hao Lin , Ya-Hsiang Chen
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L21/4853 , H01L23/49811 , H01L24/11 , H01L2224/1147 , H01L2224/11903 , H01L2224/13022 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/13611 , H01L2224/13655 , H01L2924/01029 , H01L2924/12042 , H01L2924/00014 , H01L2924/014 , H01L2924/01079 , H01L2924/00
摘要： A manufacturing method of a semiconductor load board is disclosed. The manufacturing method includes a first conductive layer forming step, a first patterning step, a dielectric layer forming step, a drilling step, a second conductive layer forming step, a second patterning step or a two-times patterning step, and a solder connecting step. In a second patterning step or a two-times patterning step, a solder pad is formed in the opening of the dielectric layer, wherein each solder pad has a height higher than the height of the dielectric, and the width of each solder pad is equal to or smaller than the maximum width of the opening, such that wider intervals are provided in the same area and the problems of short circuit failure and electrical interference can be reduced.
摘要翻译：公开了一种半导体负载板的制造方法。该制造方法包括第一导电层形成步骤，第一图案化步骤，介电层形成步骤，钻孔步骤，第二导电层形成步骤，第二图案化步骤或两次图案化步骤，以及焊料连接步骤。在第二图案化步骤或二次图案化步骤中，在电介质层的开口中形成焊料焊盘，其中每个焊盘的高度高于电介质的高度，并且每个焊盘的宽度相等达到或小于开口的最大宽度，使得在相同的区域中设置更宽的间隔，并且可以减少短路故障和电气干扰的问题。

44. 发明授权

US08315063B2 Solder pad structure with high bondability to solder ball 有权
标题翻译：焊锡焊接结构，焊接性好
公开(公告)号：US08315063B2
公开(公告)日：2012-11-20
申请号：US12547495
申请日：2009-08-26
申请人： Jun-Chung Hsu
发明人： Jun-Chung Hsu
IPC分类号： H05K7/00
CPC分类号： H05K1/111 , H01L2224/05557 , H05K3/062 , H05K3/3452 , H05K3/4007 , H05K2201/0338 , H05K2201/0367 , H05K2201/0373 , H05K2201/09745 , H05K2201/099 , H05K2203/1184 , Y02P70/611 , Y10T29/4913 , Y10T29/49156
摘要： A solder pad structure with a high bondability to a solder ball is provided. The present invention provides a larger contact area with the solder ball so as to increase the bondability according to the principle that the bondability is positive proportional with the contact area therebetween. The solder pad structure includes a circuit board having a solder pad opening defined by a solder resist layer surrounding a circuit layer. The circuit layer within the solder pad opening is defined as a solder pad. In such a way, after filling the solder ball into the solder pad opening, besides walls of the solder pad opening, there is an extra contact area provided by a geometric shape of the solder pad for further improving the bondability of the solder pad and the solder ball.
摘要翻译：提供了与焊球具有高粘合性的焊盘结构。本发明提供了一种与焊球相比较大的接触面积，以便根据粘合性与它们之间的接触面积成正比的原理提高粘接性。焊盘结构包括具有由围绕电路层的阻焊层限定的焊盘开口的电路板。焊盘开口内的电路层被定义为焊盘。以这种方式，在将焊球填充到焊盘开口中之后，除了焊盘开口的壁之外，还存在由焊料焊盘的几何形状提供的额外的接触面积，用于进一步提高焊盘的焊接性和焊球

45. 发明授权

US08312624B1 Method for manufacturing a heat dissipation structure of a printed circuit board 有权
标题翻译：印刷电路板的散热结构的制造方法
公开(公告)号：US08312624B1
公开(公告)日：2012-11-20
申请号：US13304340
申请日：2011-11-24
申请人： Chien-Wei Chang , Ting-Hao Lin , Ya-Hsiang Chen , De-Hao Lu
发明人： Chien-Wei Chang , Ting-Hao Lin , Ya-Hsiang Chen , De-Hao Lu
IPC分类号： H05K3/02
CPC分类号： H05K3/427 , H05K1/0206 , H05K3/421 , H05K2203/025 , H05K2203/0733 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method for manufacturing a heat dissipation structure of a printed circuit board includes: forming a barrier layer on the dimple in the first copper plating layer; forming a nickel plating layer; removing the nickel plating layer and the barrier layer on the dimple; forming a second copper plating layer to make the total height of the first copper plating layer and the second copper plating layer in the second opening higher than that of the first copper plating layer in the first opening; filling the dimple in the second copper plating layer with an etching-resistant material; removing the second copper plating layer; removing the nickel plating layer and the etching-resistant material to make the second copper plating layer in the second opening being at the same height as the first copper plating layer in the first opening; and forming the heat dissipation structure by photolithography.
摘要翻译：制造印刷电路板的散热结构的方法包括：在第一镀铜层的凹坑上形成阻挡层; 形成镀镍层; 去除凹坑上的镀镍层和阻挡层; 形成第二镀铜层，使第二开口中的第一镀铜层和第二镀铜层的总高度高于第一开口中的第一镀铜层的总高度; 用耐腐蚀材料填充第二镀铜层中的凹坑; 去除所述第二镀铜层; 去除镀镍层和耐腐蚀材料，使得第二开口中的第二镀铜层处于与第一开口中的第一铜镀层相同的高度; 并通过光刻法形成散热结构。

46. 发明授权

US08186054B2 Method of fabricating board having high density core layer and structure thereof 有权
标题翻译：具有高密度芯层的板的制造方法及其结构
公开(公告)号：US08186054B2
公开(公告)日：2012-05-29
申请号：US12725460
申请日：2010-03-17
申请人： Chien-Wei Chang , Ting-Hao Lin , Jen-Fang Chang , Yu-Te Lu , Chia-Chi Lo
发明人： Chien-Wei Chang , Ting-Hao Lin , Jen-Fang Chang , Yu-Te Lu , Chia-Chi Lo
IPC分类号： H01K3/10
CPC分类号： H05K3/4602 , H05K3/108 , H05K3/427 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165
摘要： Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product.
摘要翻译：制造具有电镀通孔（PTH）芯层衬底和层叠多层盲孔的板的结构和方法。可以实现比常规方法更多的盲孔堆叠层。具有高密度芯层的板的制造方法包括以下：在制造PTH之后，填充在芯层的PTH内部的填充材料被部分地去除，直到PTH已经通过蚀刻达到适当的平坦凹陷; 然后进行图像转印和图案电镀，以在芯层基板正在形成电路层时填充并使凹陷部分达到所需厚度以形成铜焊盘（过镀层）; 最后使用无电镀铜和图案电镀制成产品。

47. 发明授权

US07662662B2 Method for manufacturing carrier substrate 有权
标题翻译：制造载体基板的方法
公开(公告)号：US07662662B2
公开(公告)日：2010-02-16
申请号：US11685751
申请日：2007-03-13
申请人： Jun-Chung Hsu , Bing-Kuen Lin , Chao-Lung Wang
发明人： Jun-Chung Hsu , Bing-Kuen Lin , Chao-Lung Wang
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H05K3/421 , H05K1/116 , H05K3/108 , H05K3/426 , H05K2201/09545 , H05K2201/09563 , Y10T29/49162
摘要： A carrier substrate and a method for manufacturing the carrier substrate are disclosed herein. The method includes the steps of: providing a core substrate; forming a build-up material layer on the core substrate; forming a via in the build-up material layer; forming a patterned photoresist layer on the build-up material layer covering a portion of the via and exposing an opening from uncovered portion of the via, and a wiring slot connected to the opening; and forming a metal-electroplated layer on the via and the wiring slot. In forming a trace according to the present invention, the metal-electroplated layer is formed as the trace and directly connected to the via, striding or not striding over the via. Additionally, in the carrier substrate structure, there is no need an annular ring to connect the trace to the via, and thus the wiring space is increased.
摘要翻译：本文公开了载体基板和用于制造载体基板的方法。该方法包括以下步骤：提供芯基板; 在所述芯基板上形成积层材料层; 在积层材料层中形成通孔; 在所述积层材料层上形成图案化的光致抗蚀剂层，所述图案化的光致抗蚀剂层覆盖所述通孔的一部分，并且从所述通孔的未覆盖部分露出开口，以及连接到所述开口的布线槽; 以及在通孔和布线槽上形成金属电镀层。在形成根据本发明的迹线的情况下，金属电镀层形成为迹线，并且直接连接到通孔，跨越通道或跨过通孔。此外，在载体基板结构中，不需要环形环来将迹线连接到通孔，因此布线空间增加。

48. 发明授权

US07488675B2 Method for fabricating IC board without ring structure 有权
标题翻译：制造没有环形结构的IC板的方法
公开(公告)号：US07488675B2
公开(公告)日：2009-02-10
申请号：US11684583
申请日：2007-03-09
申请人： Ting-Hao Lin
发明人： Ting-Hao Lin
IPC分类号： H01L21/44
CPC分类号： H05K1/116 , H05K3/064 , H05K3/427 , H05K2201/09545 , H05K2201/09563 , H05K2201/09736 , Y10T29/41 , Y10T29/49155 , Y10T29/49165
摘要： A method for fabricating an IC board without a ring structure is provided. In the method, after the completion of the core board (including the core through hole), the second pattern photoresist layer is used to mask over the first deposited metal layer, and a portion of the second deposited metal layer (this portion of the second deposited metal layer is to electrically couple to the conductive circuit of the core through hole). Later, the second deposited metal layer, the first deposited metal layer, the metal layer, and the substrate at the innermost layer which are not masked by the second pattern photoresist layer are removed. As a result, the substrate is exposed to form the ringless structure, and to couple a conductive line to the core board through hole.
摘要翻译：提供一种制造没有环形结构的IC板的方法。在该方法中，在芯板（包括芯通孔）完成之后，第二图案光致抗蚀剂层用于掩蔽第一沉积金属层，并且第二沉积金属层的一部分（第二次沉积的金属层电连接到芯通孔的导电电路）。然后，去除未被第二图案光刻胶层掩蔽的第二沉积金属层，第一沉积金属层，金属层和最内层的基板。结果，基板被暴露以形成无环结构，并且将导电线耦合到芯板通孔。

49. 发明授权

US10720694B2 Antenna carrier plate structure 有权
公开(公告)号：US10720694B2
公开(公告)日：2020-07-21
申请号：US16175807
申请日：2018-10-30
申请人： Kinsus Interconnect Technology Corp.
发明人： Ting-Hao Lin , Yung-Lin Chia , Chiao-Cheng Chang
IPC分类号： H05K13/00 , H01Q1/22 , H05K1/11 , H05K1/14 , H01Q1/52 , H05K1/18 , H01Q5/307
摘要： An antenna carrier plate structure has a first circuit board and a second circuit board. The first circuit board has a first substrate and a conductive connector disposed in the first substrate. The conductive connector has two opposite connecting ends respectively protruding from two opposite surfaces of the first substrate. The second circuit board has a second substrate formed with a through hole, and a connecting plug is disposed in the through hole. One end of the connecting plug is formed with an engaging concave portion for engaging one end of the conductive connector of the first substrate. Therefore, each circuit board can be firmly fixed and electrically connected by engaging to form a multi-layer circuit board module, thereby avoiding joint tolerances during soldering and ensuring a correct connection of the joints.

50. 发明授权

US10532551B2 Foil peeling apparatus 有权
公开(公告)号：US10532551B2
公开(公告)日：2020-01-14
申请号：US16199515
申请日：2018-11-26
申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.
发明人： Shang-Chi Wang , Yun-Han Yeh , Cyuan-Bang Wu
IPC分类号： B32B43/00 , B32B38/10
摘要： A foil peeling apparatus adapted to a substrate having a foil thereon includes a foil peeling member, a connector and a controller. The foil peeling member has a foil peeling surface. The controller controls the connector to drive the peeling member to move along a path. The foil peeling surface of the peeling member in contact with, with an initial angle, the substrate, feeds toward the substrate for a first displacement, and then moves upwards and toward the substrate when the first feeding angle is decreased.

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