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    • 41. 发明授权
    • Image sensor pixel cell with switched deep trench isolation structure
    • 具有开关深沟槽隔离结构的图像传感器像素单元
    • US09496304B2
    • 2016-11-15
    • US14704493
    • 2015-05-05
    • OMNIVISION TECHNOLOGIES, INC.
    • Sing-Chung HuRongsheng YangGang ChenHoward E. RhodesSohei ManabeDyson H. Tai
    • H01L29/66H01L27/146H04N5/378
    • H01L27/1463H01L27/14601H01L27/14607H01L27/14612H01L27/1464H01L27/14643H04N5/378
    • A pixel cell includes a photodiode disposed in an epitaxial layer in a first region of semiconductor material to accumulate image charge. A floating diffusion is disposed in a well region disposed in the epitaxial layer in the first region. A transfer transistor is coupled to selectively transfer the image charge from the photodiode to the floating diffusion. A deep trench isolation (DTI) structure disposed in the semiconductor material. The DTI structure isolates the first region of the semiconductor material on one side of the DTI structure from a second region of the semiconductor material on an other side of the DTI structure. The DTI structure includes a doped semiconductor material disposed inside the DTI structure that is selectively coupled to a readout pulse voltage in response to the transfer transistor selectively transferring the image charge from the photodiode to the floating diffusion.
    • 像素单元包括设置在半导体材料的第一区域中的外延层中以累积图像电荷的光电二极管。 浮置扩散部设置在设置在第一区域的外延层中的阱区域中。 耦合转移晶体管以选择性地将图像电荷从光电二极管转移到浮动扩散。 设置在半导体材料中的深沟槽隔离(DTI)结构。 DTI结构将DTI结构的一侧上的半导体材料的第一区域与DTI结构的另一侧上的半导体材料的第二区域隔离。 DTI结构包括设置在DTI结构内部的掺杂半导体材料,其被选择性地耦合到读出脉冲电压,响应于传输晶体管选择性地将图像电荷从光电二极管转移到浮动扩散。
    • 42. 发明申请
    • IMAGE SENSOR PIXEL FOR HIGH DYNAMIC RANGE IMAGE SENSOR
    • 高动态范围图像传感器的图像传感器像素
    • US20160181296A1
    • 2016-06-23
    • US15059182
    • 2016-03-02
    • OMNIVISION TECHNOLOGIES, INC.
    • Jeong-Ho LyuSohei Manabe
    • H01L27/146
    • H01L27/14605H01L27/14607H01L27/1461H01L27/14612H01L27/14627H01L27/14641H01L27/14643H01L27/14645
    • An image sensor pixel includes a first photodiode and a second photodiode disposed in a semiconductor material. The first photodiode has a first doped region, a first lightly doped region, and a first highly doped region. The second photodiode has a second full well capacity substantially equal to a first full well capacity of the first photodiode, and includes a second doped region, a second lightly doped region, and a second highly doped region. The image sensor pixel also includes a first microlens optically coupled to direct a first amount of image light to the first photodiode, and a second microlens optically coupled to direct a second amount of image light to the second photodiode. The first amount of image light is larger than the second amount of image light.
    • 图像传感器像素包括设置在半导体材料中的第一光电二极管和第二光电二极管。 第一光电二极管具有第一掺杂区域,第一轻掺杂区域和第一高掺杂区域。 第二光电二极管具有基本上等于第一光电二极管的第一全阱容量的第二全阱容量,并且包括第二掺杂区,第二轻掺杂区和第二高掺杂区。 图像传感器像素还包括光学耦合以将第一量的图像光引导到第一光电二极管的第一微透镜,以及光学耦合以将第二量的图像光引导到第二光电二极管的第二微透镜。 第一量的图像光大于第二量的图像光。
    • 43. 发明授权
    • Negative biased substrate for pixels in stacked image sensors
    • 堆叠图像传感器中像素的负偏置衬底
    • US09344658B2
    • 2016-05-17
    • US14448154
    • 2014-07-31
    • OMNIVISION TECHNOLOGIES, INC.
    • Tiejun DaiRui WangDyson H. TaiSohei Manabe
    • H01L27/00H04N5/378H04N5/376H01L27/146
    • H04N5/378H01L27/14612H01L27/14634H01L27/14636H04N5/376
    • A pixel cell includes a photodiode disposed within a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode. A transfer transistor is disposed within the first semiconductor chip and coupled to the photodiode to transfer the image charge from the photodiode. A bias voltage generation circuit disposed within a second semiconductor chip for generating a bias voltage. The bias voltage generation circuit is coupled to the first semiconductor chip to bias the photodiode with the bias voltage. The bias voltage is negative with respect to a ground voltage of the second semiconductor chip. A floating diffusion is disposed within the second semiconductor chip. The transfer transistor is coupled to transfer the image charge from the photodiode on the first semiconductor chip to the floating diffusion on the second semiconductor chip.
    • 像素单元包括设置在第一半导体芯片内的光电二极管,用于响应入射在光电二极管上的光累积图像电荷。 传输晶体管设置在第一半导体芯片内并耦合到光电二极管以从光电二极管传输图像电荷。 偏置电压产生电路,设置在第二半导体芯片内,用于产生偏置电压。 偏置电压产生电路耦合到第一半导体芯片以偏置偏压的光电二极管。 偏置电压相对于第二半导体芯片的接地电压为负。 浮置扩散部设置在第二半导体芯片内。 传输晶体管被耦合以将图像电荷从第一半导体芯片上的光电二极管转移到第二半导体芯片上的浮动扩散。