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    • 51. 发明授权
    • Navigation system allowing to remove selected items from route for recalculating new route to destination
    • 导航系统允许从路线中删除所选项目,以重新计算新路线到目的地
    • US07099773B2
    • 2006-08-29
    • US10704397
    • 2003-11-06
    • Jian-Liang Linn
    • Jian-Liang Linn
    • G01C21/30
    • G01C21/28G01C21/3415G01C21/3461G01C21/3484G01C21/3492G01C21/3682
    • A method for navigation system modifies a route to the destination by allowing a user to select a type of items or conditions to be avoided from the route. The method includes the steps of displaying a set of data indicating items that a user will encounter when the user follows the calculated route, prompting the user to select a type of the item to be avoided in a new route to the destination, and recalculating the new route according to the user's selection and guiding the user to the destination through the new route. The navigation system displays the set of items which is classified into distance ranges each representing a range of distance from a current user position where each item is represented by a corresponding icon.
    • 导航系统的方法通过允许用户从路线中选择要避免的项目或条件的类型来修改到目的地的路线。 该方法包括以下步骤:当用户遵循计算出的路线时,显示用户将遇到的项目的一组数据,提示用户在到目的地的新路线中选择要避免的项目的类型,并重新计算 根据用户选择的新路由,并通过新路由将用户引导到目的地。 导航系统显示被分类为距离范围的项目组,每个距离范围表示与当前用户位置的距离的距离,其中每个项目由相应的图标表示。
    • 52. 发明授权
    • Method for design validation of complex IC
    • 复杂IC设计验证方法
    • US07089517B2
    • 2006-08-08
    • US09941396
    • 2001-08-28
    • Hiroaki YamotoRochit Rajsuman
    • Hiroaki YamotoRochit Rajsuman
    • G06F17/50
    • G01R31/318314G06F11/261G06F17/5022
    • A method for design validation of complex IC with use of a combination of electronic design automation (EDA) tools and a design test station at high speed and low cost. The EDA tools and device simulator are linked to the event based test system to execute the original design simulation vectors and testbench and make modifications in the testbench and event based test vectors until satisfactory results are obtained. The event based test vectors are test vectors in an event format in which an event is any change in a signal which is described by its timing and the event based test system is a test system for testing an IC by utilizing the event based test vectors. Because EDA tools are linked with the event based test system, these modifications are captured to generate a final testbench that provides satisfactory results.
    • 利用电子设计自动化(EDA)工具和设计测试站的组合,以高速,低成本的方式对复杂IC进行设计验证。 EDA工具和设备模拟器链接到基于事件的测试系统,以执行原始设计模拟向量和测试平台,并在测试平台和基于事件的测试向量中进行修改,直到获得满意的结果。 基于事件的测试向量是事件格式中的测试向量,其中事件是由其定时描述的信号中的任何变化,并且基于事件的测试系统是通过利用基于事件的测试向量来测试IC的测试系统。 由于EDA工具与基于事件的测试系统相关联,因此捕获这些修改以生成最终的测试平台,从而提供令人满意的结果。
    • 53. 发明授权
    • Semiconductor test apparatus for testing semiconductor device that produces output data by its internal clock timing
    • 用于测试通过其内部时钟时序产生输出数据的半导体器件的半导体测试装置
    • US07078889B2
    • 2006-07-18
    • US10507042
    • 2003-12-26
    • Hideyuki Oshima
    • Hideyuki Oshima
    • G01R31/26
    • G01R31/31922
    • A recovery clock synchronized with an internal clock faster than a system clock is obtained with an edge timing of the system clock output from a DUT. The present invention includes: a time interpolator 20 which includes flip-flops (FF 21) which receive system clocks of the DUT 1, a delay circuit 22 which outputs time-series level data, from the FF 21, and an encoder 28 which receives the time-series level data output and encodes it into positional data indicative of an edge timing; a digital filter 40 which includes a plurality of registers 41 which sequentially store the positional data and output the positional data as a recovery clock; and a data side selector 30 which selects output data of the DUT 1 base on the recovery clock.
    • 在系统时钟从DUT的输出的边沿定时获得与系统时钟相比内部时钟同步的恢复时钟。 本发明包括:时间插补器20,其包括接收DUT1的系统时钟的触发器(FF21),从FF21输出时间序列电平数据的延迟电路22和接收 时间序列电平数据输出并将其编码成表示边缘定时的位置数据; 数字滤波器40,其包括多个寄存器41,其顺序地存储位置数据并输出位置数据作为恢复时钟; 以及数据侧选择器30,其基于恢复时钟选择DUT 1的输出数据。
    • 54. 发明授权
    • Electron beam exposure apparatus and electron beam processing apparatus
    • 电子束曝光装置和电子束处理装置
    • US07041988B2
    • 2006-05-09
    • US10431782
    • 2003-05-08
    • Shinichi HamaguchiSusumu GotoOsamu KamimuraYasunari Sohda
    • Shinichi HamaguchiSusumu GotoOsamu KamimuraYasunari Sohda
    • G21G5/00G21K5/10
    • B82Y10/00B82Y40/00G21K1/093H01J37/153H01J37/3177H01J2237/1536
    • An electron beam exposure apparatus for exposing wafer with an electron beam, includes: a first electromagnetic lens system for making the electron beam incident substantially perpendicularly on a first plane be incident on a second plane substantially perpendicularly; a second electromagnetic lens system for making the electron beam that was substantially perpendicularly incident on the second plane be incident on the wafer substantially perpendicularly; a rotation correction lens provided within the first electromagnetic lens system for correcting rotation of the electron beam caused by at least the first electromagnetic lens system; a deflection system for deflecting the electron beam to a position on the wafer; and a deflection-correction optical system provided within the second electromagnetic lens system for correcting deflection aberration caused by the deflection system.
    • 一种用电子束曝光晶片的电子束曝光装置,包括:用于使基本上垂直于第一平面的电子束入射到第二平面上的第一电磁透镜系统基本垂直入射; 用于使基本上垂直入射在第二平面上的电子束的第二电磁透镜系统基本上垂直入射在晶片上; 旋转校正透镜,设置在第一电磁透镜系统内,用于校正由至少第一电磁透镜系统引起的电子束的旋转; 用于将电子束偏转到晶片上的位置的偏转系统; 以及设置在第二电磁透镜系统内用于校正由偏转系统引起的偏转像差的偏转校正光学系统。
    • 57. 发明授权
    • Three-dimensional measuring instrument, filter striped plate, and illuminating means
    • 三维测量仪器,过滤条纹板和照明装置
    • US07019848B2
    • 2006-03-28
    • US10503150
    • 2003-01-20
    • Takahiro Mamiya
    • Takahiro Mamiya
    • G01B11/24G01V8/00G06K9/00
    • G01B11/245G01B11/24G01B11/25H05K3/3484
    • For measuring the three-dimensional shape of an object of measurement using a phase shift method, a three-dimensional measuring instrument is provided which is capable of shortening the measurement time. A printed state inspection device 1 includes a table for placing a printed circuit board K printed with cream solder H, an illumination device 3 for illuminating three sine wave light component patterns with different phases on the surface of printed circuit board K, a CCD camera 4 for picking-up images of the illuminated part of the printed circuit board K, a white light illumination unit L for illuminating a white light on the surface of printed circuit board K, and a laser pointer for measuring the standard height. A control device 7 determines the existing area of the cream solder H from the image data obtained by the illumination of the white light, and calculates the height of the cream solder H from the image data obtained by the illumination device 3 by using a phase shift method.
    • 为了使用相移法测量测量对象的三维形状,提供了能够缩短测量时间的三维测量仪器。 印刷状态检查装置1包括用于放置印刷有膏状焊料H的印刷电路板K的台,用于在印刷电路板K的表面上照射具有不同相位的三个正弦波光成分图案的照明装置3,CCD照相机4 用于拍摄印刷电路板K的照明部分的图像,用于照射印刷电路板K的表面上的白光的白光照明单元L和用于测量标准高度的激光指示器。 控制装置7根据通过照明白光获得的图像数据来确定膏状焊料H的现有面积,并且通过使用相移来计算由照明装置3获得的图像数据中的膏状焊料H的高度 方法。