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    • 53. 发明申请
    • Head slider and information storage apparatus
    • 磁头滑块和信息存储设备
    • US20070008650A1
    • 2007-01-11
    • US11284405
    • 2005-11-22
    • Kenzo NakamuraTakeshi OhweToru Watanabe
    • Kenzo NakamuraTakeshi OhweToru Watanabe
    • G11B5/60
    • G11B5/4826
    • The present invention provides a high-safety head slider and an information storage apparatus having high operational reliability. The present invention provides a head slider equipped with a head that accesses a movable information storage medium on which information is recorded and that implements at least information reproduction, and situated close to the information storage medium. The head slider includes: a floating force generating section, opposing the information storage medium, that generates floating force upward from the information storage medium, through movement of the information storage medium; and a base section, equipped with the head, that, through floating force generated by the floating force generating section, floats from the information storage medium, the thickness in the floating direction of the base section varying along the direction of movement of the information storage medium.
    • 本发明提供一种具有高操作可靠性的高安全头滑块和信息存储装置。 本发明提供了一种头部滑块,其具有头部,该头部访问记录有信息的可移动信息存储介质,并且至少实现信息再现,并位于信息存储介质附近。 磁头滑块包括:浮动力产生部分,与信息存储介质相对,通过信息存储介质的移动从信息存储介质向上产生浮力; 以及配备有头的基部,通过由浮力产生部产生的浮力从信息存储介质浮动,基部的浮动方向的厚度沿着信息存储器的移动方向而变化 中。
    • 57. 发明授权
    • Magnetic head suspension assembly with adhesion limiting structure
    • 具有附着力限制结构的磁头悬挂组件
    • US06801398B1
    • 2004-10-05
    • US08901940
    • 1997-07-29
    • Takeshi OhweToru WatanabeRyosuke KoishiSeizi Yoneoka
    • Takeshi OhweToru WatanabeRyosuke KoishiSeizi Yoneoka
    • G11B548
    • G11B5/4853
    • A magnetic head assembly equipped with a slider and a gimbal spring to which the slider is secured with an adhesive agent. According to one aspect, at least one slit is formed in the gimbal spring opposing the adhesion surface of the slider, so that expansion and contraction of the gimbal spring caused by a change in the temperature is hardly transferred to the slider. According to a second aspect, the Young's modulus after hardening of the adhesive agent applied onto thee adhesion surface of the slider is selected to be smaller than about {fraction (1/13000)} of the Young's modulus of the slider material or of the gimbal spring material. According to the first aspect, therefore, the area of the gimbal spring on which the adhesive agent is applied is limited by the slit. According to the second aspect, the Young's modulus of the adhesive agent after hardening is so small that the warping amount of the slider caused by a change in the temperature lies within a predetermined range. The warping amount of the slider in the magnetic head assembly is hence suppressed to lie within an allowable range despite a change in the temperature, and floating performance of thee slider is stabilized.
    • 具有滑块和万向弹簧的磁头组件,滑块用粘合剂固定到该磁头组件上。 根据一个方面,在与向滑块的粘合表面相对的万向弹簧中形成至少一个狭缝,使得由温度变化引起的万向弹簧的膨胀和收缩几乎不传递到滑块。 根据第二方面,施加到滑块的粘合表面上的粘合剂硬化后的杨氏模量被选择为小于约{分数(滑块材料或万向弹簧材料的杨氏模量的1/13000) 根据第一方面,因此,施加了粘合剂的万向弹簧的面积受到狭缝的限制,根据第二方面,硬化后的粘合剂的杨氏模量小到翘曲量 由于温度变化引起的滑动件在预定范围内,因此即使温度变化,磁头组件中的滑块的翘曲量也被抑制在容许范围内,而滑块的浮动性能为 稳定
    • 58. 发明授权
    • Semiconductor device with a dual damascene type via contact structure and method for the manufacture of same
    • 具有双镶嵌型通孔接触结构的半导体器件及其制造方法
    • US06433428B1
    • 2002-08-13
    • US09086958
    • 1998-05-29
    • Toru WatanabeKatsuya Okumura
    • Toru WatanabeKatsuya Okumura
    • H01L2348
    • H01L21/76847H01L21/76805H01L21/76807H01L21/76877H01L21/76882H01L23/53214H01L23/53257H01L2924/0002H01L2924/00
    • The via contact structure is rendered into a dual damascene type via contact structure having a wide groove and a via contact hole lying below the wide groove, and the interior of the lower via contact hole is filled up with a filling material composed of tungsten, while, the interior of the upper groove is filled up with aluminum. Since the interior of the lower via contact hole is thus filled up with a filling material comprising tungsten, aluminum which has a low reflowability may be used only in the upper groove. As for the filling material for filling up the wide groove, the wide groove can be filled up sufficiently well even with aluminum which is not high in reflowability. By combining the filling of the via contact hole with tungsten and the filling of the groove with aluminum as mentioned above, a via contact filling with a high aspect ratio can be realized. Further, the problem or drawback that, at the time of forming the second metal wiring layer, the first metal wiring layer may be melted due to the high-temperature heat treatment performed for depositing the metal material is eliminated, and thus, it becomes possible to realize a dual damascene type via contact structure which can be applied to a multi-layer wiring structure.
    • 通孔接触结构被制成具有宽槽的通孔接触结构和位于宽槽下方的通孔接触孔的双镶嵌型通孔接触结构,并且下通孔接触孔的内部填充有由钨构成的填充材料,同时 ,上槽的内部填充有铝。 由于下通孔接触孔的内部填充有包含钨的填充材料,所以具有低回流性的铝可以仅在上槽中使用。 对于用于填充宽槽的填充材料,即使使用不可回流的铝的情况下,也可以充分地填充宽槽。 通过将通孔接触孔的填充与钨结合,并且如上所述用铝填充槽,可以实现填充高纵横比的通孔接头。 此外,在形成第二金属布线层时,第一金属布线层由于进行用于沉积金属材料的高温热处理而可能熔化的问题和缺陷被消除,因此, 实现可以应用于多层布线结构的双镶嵌型通孔接触结构。
    • 59. 发明授权
    • Ceramic electronic component
    • 陶瓷电子元件
    • US06381117B1
    • 2002-04-30
    • US09656724
    • 2000-09-07
    • Takuji NakagawaYoshikazu TakagiYasunobu YonedaToru Watanabe
    • Takuji NakagawaYoshikazu TakagiYasunobu YonedaToru Watanabe
    • H01G4228
    • H01G4/232H01G2/065H01G2/14H01G4/005H05K3/3442H05K2201/10636H05K2201/10909Y02P70/611Y02P70/613
    • A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 &mgr;m.
    • 陶瓷电子部件包括具有彼此相对的两个端面和连接两个端面的侧面和形成在部件主体上的端子电极的至少一个部件主体。 每个端子电极从每个端面延伸到组件主体的每个侧面的边缘部分。 每个端子电极包括形成在组件主体的至少每个端面上的金属层,用于覆盖组件主体的至少一部分侧面的导电树脂层和覆盖组件主体的外表面的金属镀膜 端子电极。 导电树脂层从包括金属层的边缘的金属层延伸到侧面的部分,并且包括含有金属粉末和树脂的导电树脂。 侧面上方的导电树脂层的厚度为至少约10μm。