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    • 56. 发明授权
    • Hybrid non-volatile memory cells for shared bit line
    • 用于共享位线的混合非易失性存储单元
    • US09349452B2
    • 2016-05-24
    • US13788183
    • 2013-03-07
    • SANDISK TECHNOLOGIES INC.
    • Mohan V. DungaMasaaki Higashitani
    • G11C16/04H01L29/66H01L29/788G11C7/18G11C16/24H01L27/115
    • G11C16/0425G11C7/18G11C16/0483G11C16/24H01L27/11524H01L27/1157H01L29/66825H01L29/788
    • A non-volatile storage system includes a plurality of groups of connected non-volatile storage elements. Each group comprises multiple connected data non-volatile storage elements and multiple select gates on a common side of the data non-volatile storage elements. The multiple select gates comprise a first select gate and a second select gate. The first select gate has a first threshold voltage for a first subset of the groups and a second threshold voltage for a second subset of the groups due to active area implantation for the second subset of groups that causes the second threshold voltage to be lower than the first threshold voltage. The second select gate of each group has a programmable threshold voltage. Each of the plurality of bit lines are connected to multiple groups of connected non-volatile storage elements.
    • 非易失性存储系统包括多组连接的非易失性存储元件。 每个组包括数据非易失性存储元件的公共侧上的多个连接的数据非易失性存储元件和多个选择栅极。 多个选择栅极包括第一选择栅极和第二选择栅极。 第一选择栅极具有用于组的第一子集的第一阈值电压和由于第二子集的有源区域注入导致第二阈值电压低于第二阈值电压的第二子集的第二阈值电压。 第一阈值电压。 每组的第二选择栅极具有可编程阈值电压。 多个位线中的每一个连接到多组连接的非易失性存储元件。
    • 57. 发明授权
    • Dynamic drive strength optimization
    • 动态驱动强度优化
    • US09343165B2
    • 2016-05-17
    • US13778894
    • 2013-02-27
    • Dmitry VaysmanArkady Katz
    • Dmitry VaysmanArkady Katz
    • G11C16/30G06F13/40
    • G11C16/30G06F13/4086Y02D10/14Y02D10/151
    • A system for optimizing drive strength may be utilized for identifying the maximum data transfer rate for different devices and different device configurations. The drive strength may be optimized for input/output (I/O) devices by measuring voltage drops on I/O power supply using different test patterns. The maximum drive strength is identified that satisfies a limit or threshold for the allowed voltage drop level. The test pattern may include a simultaneous toggling of each I/O device. A slew rate for the device may be utilized along with the drive strength for identifying the maximum data transfer rate.
    • 用于优化驱动强度的系统可用于识别不同设备和不同设备配置的最大数据传输速率。 可以通过使用不同的测试模式测量I / O电源上的电压降,为输入/输出(I / O)器件优化驱动强度。 识别满足允许的电压降电平的极限或阈值的最大驱动强度。 测试模式可以包括同时切换每个I / O设备。 可以利用该装置的转换速率以及用于识别最大数据传送速率的驱动强度。
    • 59. 发明授权
    • Avoiding unintentional program or erase of a select gate transistor
    • 避免无意的编程或擦除选择栅晶体管
    • US09343159B2
    • 2016-05-17
    • US14465244
    • 2014-08-21
    • SanDisk Technologies Inc.
    • Yingda DongLiang Pang
    • G11C16/16G11C16/14G11C16/04G11C11/56G11C16/34
    • G11C16/14G11C11/5635G11C16/0483G11C16/3418G11C16/3445
    • Techniques are provided for preventing inadvertent program or erase of select gate transistors and dummy memory cells during an erase operation involving data-storing memory cells in a three-dimensional memory device. The erase operation charges up a channel of a NAND string using gate-induced drain leakage from the select gate transistors. An erase voltage waveform and a select gate waveform are ramped up to intermediate levels which allow some charging of the channel to occur. The intermediate level of the select gate waveform is low enough to avoid inadvertent programming of the select gate transistors. Subsequently, the erase voltage waveform and the select gate waveform are ramped up to peak levels which allow additional charging of the channel to occur. The peak levels are set to avoid inadvertent erasing of the select gate transistors.
    • 提供技术用于在涉及在三维存储器件中存储存储单元的数据存储单元的擦除操作期间防止选择栅极晶体管和虚设存储单元的意外编程或擦除。 擦除操作使用来自选择栅极晶体管的栅极引起的漏极泄漏来对NAND串的通道充电。 擦除电压波形和选择栅极波形斜坡上升到允许通道发生一些充电的中间电平。 选择栅极波形的中间电平足够低以避免选择栅极晶体管的无意编程。 随后,擦除电压波形和选择栅极波形斜坡上升到峰值电平,这允许发生信道的附加充电。 设置峰值电平以避免选择栅极晶体管的无意擦除。
    • 60. 发明授权
    • Balancing programming speeds of memory cells in a 3D stacked memory
    • 平衡3D堆叠存储器中存储单元的编程速度
    • US09343156B1
    • 2016-05-17
    • US14750250
    • 2015-06-25
    • SanDisk Technologies Inc.
    • Man L MuiYongke SunYingda Dong
    • G11C11/34G11C16/10G11C16/34
    • G11C16/10G11C11/5628G11C16/3459G11C29/021G11C29/028G11C29/50012G11C2211/5621
    • Programming techniques for a three-dimensional stacked memory device provide compensation for different intrinsic programming speeds of different groups of memory cells based on the groups' locations relative to the edge of a word line layer. A larger distance from the edge is associated with a faster programming speed. In one approach, the programming speeds are equalized by elevating a bit line voltage for the faster programming memory cells. Offset verify voltages which trigger a slow programming mode by elevating the bit line voltage can also be set based on the group locations. A programming speed can be measured during programming for a row or other group of cells to set the bit line voltage and/or the offset verify voltages. The compensation for the faster programming memory cells can also be based on their speed relative to the slower programming memory cells.
    • 用于三维堆叠存储器件的编程技术基于相对于字线层的边缘的组的位置来为不同组的存储器单元的不同固有编程速度提供补偿。 距离边缘更大的距离与更快的编程速度相关联。 在一种方法中,通过提高用于更快编程存储器单元的位线电压来使编程速度相等。 也可以基于组位置来设置通过升高位线电压而触发缓慢编程模式的偏移验证电压。 可以在针对一行或另一组单元的编程期间测量编程速度,以设置位线电压和/或偏移验证电压。 更快编程存储单元的补偿也可以基于它们相对于较慢编程存储器单元的速度。