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    • 4. 发明申请
    • Non-Volatile Memory With Two Phased Programming
    • 具有两个相位编程的非易失性存储器
    • US20160314843A1
    • 2016-10-27
    • US14841182
    • 2015-08-31
    • SanDisk Technologies Inc.
    • Huai-Yuan TsengDeepanshu Dutta
    • G11C16/10G11C16/26G11C16/32G11C11/56G11C16/34
    • G11C16/10G11C11/5628G11C11/5642G11C11/5671G11C16/26G11C16/32G11C16/3459G11C16/3468G11C2211/5621
    • Programming non-volatile memory includes applying a series of programming pulses to the memory cells as part of a coarse/fine programming process. Between programming pulses, memory cells in the coarse phase are verified for a coarse phase verify level for a target data state and memory cells in the fine phase are verified for a fine phase verify level for the target data state, both in response to a single reference voltage applied on a common word line. For a memory cell in the coarse phase that has been verified to have reached the coarse phase verify level, the memory cell will be temporarily inhibited from programming for a next programming pulse and switched to the fine phase. For a memory cell in the fine phase that has been verified to have reached the fine phase verify level, the memory cell will be inhibited from further programming
    • 编程非易失性存储器包括将一系列编程脉冲作为粗/精编程过程的一部分应用于存储器单元。 在编程脉冲之间,针对目标数据状态的粗略相位验证电平验证粗略相位中的存储器单元,并针对目标数据状态验证精细相位中的存储单元是否存在用于目标数据状态的精细相位验证电平,响应于单个 参考电压施加在公共字线上。 对于已经被验证已经达到粗略相位验证电平的粗略相位的存储单元,存储器单元将暂时禁止编程用于下一个编程脉冲并切换到精细相位。 对于已经验证已达到精细相位验证电平的精细相位的存储单元,存储器单元将被禁止进一步编程
    • 5. 发明授权
    • Controlling dummy word line bias during erase in non-volatile memory
    • 在非易失性存储器中擦除期间控制虚拟字线偏置
    • US09443597B2
    • 2016-09-13
    • US14669267
    • 2015-03-26
    • SanDisk Technologies Inc.
    • Deepanshu DuttaMohan DungaMasaaki Higashitani
    • G11C16/16G11C16/14G11C7/10G11C11/56G11C16/04
    • G11C16/14G11C7/1006G11C11/5635G11C16/0483G11C16/16
    • A technique for erasing non-volatile memory such as a NAND string which includes non-user data or dummy storage elements. The voltages of the non-user data storage elements are capacitively coupled higher by controlled increases in an erase voltage which is applied to a substrate. The voltages are floated by rendering a pass gate transistor in a non-conductive state, where the pass gate transistor is between a voltage driver and a non-user data storage element. Voltages of select gate transistors can also be capacitively coupled higher. The substrate voltage can be increased in steps and/or as a continuous ramp. In one approach, outer dummy storage elements are floated while inner dummy storage elements are driven. In another approach, both outer and inner dummy storage elements are floated. Write-erase endurance of the storage elements is increased due to reduced charge trapping between the select gates and the dummy storage elements.
    • 一种用于擦除诸如包括非用户数据或虚拟存储元件的NAND串的非易失性存储器的技术。 非用户数据存储元件的电压通过施加到衬底的擦除电压的受控增加而被电容性耦合。 通过使通路栅极晶体管处于非导通状态来浮置电压,其中通过栅极晶体管位于电压驱动器和非用户数据存储元件之间。 选择栅极晶体管的电压也可以电容耦合得更高。 衬底电压可以逐步增加和/或作为连续斜坡增加。 在一种方法中,外部虚拟存储元件浮动,同时内部虚拟存储元件被驱动。 在另一种方法中,外部和内部虚拟存储元件都浮起来。 由于选择栅极和虚拟存储元件之间的电荷捕获减少,存储元件的写擦除耐久性增加。
    • 7. 发明申请
    • ERROR DETECTION METHOD
    • 错误检测方法
    • US20160118136A1
    • 2016-04-28
    • US14525813
    • 2014-10-28
    • SANDISK TECHNOLOGIES INC.
    • Huai-Yuan TsengDeepanshu Dutta
    • G11C16/34G11C11/56
    • G11C16/3495G11C11/5628G11C11/5635G11C13/0004G11C13/0035G11C13/0064G11C13/0069G11C16/0483G11C16/3422G11C16/349G11C29/52G11C2211/5621G11C2211/5644
    • Methods for detecting and correcting defects in a memory array during a memory operation are described. The memory operation may comprise a programming operation or an erase operation. In some cases, a Control Gate Short to Substrate (CGSS) defect, in which a control gate of a NAND memory has been shorted to the substrate, may have a defect signature in which a word line shows a deviation in the number of programming loop counts associated with programming data into memory cells connected to the word line. The deviation in the number of programming loop counts may be detected by comparing a baseline programming loop count (e.g., derived from programming a set of one or more word lines prior to programming the word line with the CGSS defect) with a programming loop count associated with programming the word line with the CGSS defect.
    • 描述了在存储器操作期间检测和校正存储器阵列中的缺陷的方法。 存储器操作可以包括编程操作或擦除操作。 在某些情况下,NAND存储器的控制栅极已经短路到衬底的控制栅极到基板(CGSS)缺陷可能具有缺陷签名,其中字线表示编程环路数量的偏差 与将数据编程连接到与字线连接的存储器单元中的计数。 可以通过比较基准编程循环计数(例如,从在编程字线与CGSS缺陷编程之前编程一组或多个字线的集合)与相关联的编程循环计数相比较来检测编程循环计数数量的偏差 用CGSS缺陷对字线进行编程。
    • 8. 发明申请
    • Controlling Dummy Word Line Bias During Erase In Non-Volatile Memory
    • 在非易失性存储器中擦除期间控制虚拟字线偏置
    • US20150200014A1
    • 2015-07-16
    • US14669267
    • 2015-03-26
    • SanDisk Technologies Inc.
    • Deepanshu DuttaMohan DungaMasaaki Higashitani
    • G11C16/14G11C16/04
    • G11C16/14G11C7/1006G11C11/5635G11C16/0483G11C16/16
    • A technique for erasing non-volatile memory such as a NAND string which includes non-user data or dummy storage elements. The voltages of the non-user data storage elements are capacitively coupled higher by controlled increases in an erase voltage which is applied to a substrate. The voltages are floated by rendering a pass gate transistor in a non-conductive state, where the pass gate transistor is between a voltage driver and a non-user data storage element. Voltages of select gate transistors can also be capacitively coupled higher. The substrate voltage can be increased in steps and/or as a continuous ramp. In one approach, outer dummy storage elements are floated while inner dummy storage elements are driven. In another approach, both outer and inner dummy storage elements are floated. Write-erase endurance of the storage elements is increased due to reduced charge trapping between the select gates and the dummy storage elements.
    • 一种用于擦除诸如包括非用户数据或虚拟存储元件的NAND串的非易失性存储器的技术。 非用户数据存储元件的电压通过施加到衬底的擦除电压的受控增加而被电容性耦合。 通过使通路栅极晶体管处于非导通状态来浮置电压,其中通过栅极晶体管位于电压驱动器和非用户数据存储元件之间。 选择栅极晶体管的电压也可以电容耦合得更高。 衬底电压可以逐步增加和/或作为连续斜坡增加。 在一种方法中,外部虚拟存储元件浮动,同时内部虚拟存储元件被驱动。 在另一种方法中,外部和内部虚拟存储元件都浮起来。 由于选择栅极和虚拟存储元件之间的电荷捕获减少,存储元件的写擦除耐久性增加。
    • 10. 发明申请
    • Dynamic Bit Line Bias For Programming Non-Volatile Memory
    • 用于编程非易失性存储器的动态位线偏置
    • US20150092496A1
    • 2015-04-02
    • US14561841
    • 2014-12-05
    • SANDISK TECHNOLOGIES INC.
    • Deepanshu DuttaKen OowadaMasaaki HigashitaniMan L. Mui
    • G11C16/10G11C16/34
    • G11C16/10G11C7/12G11C11/5628G11C16/12G11C16/24G11C16/3459
    • A program operation for a set of non-volatile storage elements. A count is maintained of a number of program pulses which are applied to an individual storage element in a slow programming mode, and an associated bit line voltage is adjusted based on the count. Different bit line voltages can be used, having a common step size or different steps sizes. As a result, the change in threshold voltage of the storage element within the slow programming mode, with each program pulse can be made uniform, resulting in improved programming accuracy. Latches maintain the count of program pulses experienced by the associated storage element, while in the slow programming mode. The storage element is in a fast programming mode when its threshold voltage is below a lower verify level, and in the slow programming mode when its threshold voltage is between the lower verify level and a higher verify level.
    • 用于一组非易失性存储元件的程序操作。 维持以慢编程模式施加到单个存储元件的多个编程脉冲的计数,并且基于计数调整相关联的位线电压。 可以使用不同的位线电压,具有公共的步长或不同的步长。 结果,缓慢编程模式下的存储元件的阈值电压的变化可以使每个编程脉冲均匀,从而提高编程精度。 在缓慢编程模式下,锁存器保持相关存储元件所经历的程序脉冲计数。 当其阈值电压低于较低验证电平时,存储元件处于快速编程模式,而当其阈值电压处于较低验证电平和较高验证电平之间时,存储元件处于慢速编程模式。