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51. 发明申请

US20160316563A1 METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAP 有权
标题翻译：用于在印刷电路板和印刷电路板上填充导电盖的方法，其具有锚定导电盖
公开(公告)号：US20160316563A1
公开(公告)日：2016-10-27
申请号：US14694756
申请日：2015-04-23
申请人： Viasystems Technologies Corp., L.L.C.
发明人： Rajwant Sidhu , Ruben Zepeda
IPC分类号： H05K1/11 , H05K3/06 , H05K3/00 , H05K3/04 , H05K3/42
CPC分类号： H05K3/0094 , H05K1/113 , H05K3/064 , H05K3/422 , H05K3/423 , H05K2201/09481 , H05K2201/09563 , H05K2203/095
摘要： The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.
摘要翻译：本发明涉及在PCB中的填充通孔中形成锚定盖。盖通过在填充的通孔中形成锚定开口而形成，将铜沉积到锚定开口中以形成锚定部分，随后在填充的通孔和锚定部分上沉积盖部分，使得锚定盖被锚固到通过锚定部分填充。在另一个实施例中，锚定部分和盖部分可以在一个步骤中沉积。

52. 发明授权

US09326710B1 Contact lenses having sensors with adjustable sensitivity 有权
标题翻译：隐形眼镜具有灵敏度可调的传感器
公开(公告)号：US09326710B1
公开(公告)日：2016-05-03
申请号：US13623155
申请日：2012-09-20
申请人： Verily Life Sciences LLC
发明人： Zenghe Liu , Brian Otis
IPC分类号： A61B5/02 , A61B5/145 , A61B5/00 , A61B3/10 , H05K3/46 , A61B5/1473 , H05K1/18 , H05K3/04
CPC分类号： A61B5/14532 , A61B3/10 , A61B3/101 , A61B5/14546 , A61B5/1468 , A61B5/1473 , A61B5/6813 , A61B5/6821 , A61B2560/0223 , H05K1/186 , H05K3/048 , H05K3/4682
摘要： Apparatus and methods employing contact lenses having electrochemical sensors that have adjustable analyte-sensing sensitivity are provided. In some aspects, level of the analyte or biological substance is detected and a number of sub-electrodes of the sensor are turned on or off based on the level of the analyte or biological substance. The sensitivity of the sensor is adjusted based on the number of sub-electrodes that are turned on or off. In some aspects, the current level from the sensor is employed in determining the number of sub-electrodes to turn on or off. In one aspect, a contact lens includes: a substrate; a power component; a circuit and an adjustment circuit. The circuit can include a potentiostat; and a sensor electrically coupled to the potentiostat, and configured to sense a level of an analyte. The sensitivity of the sensor can be adjustable by the adjustment circuit.
摘要翻译：提供了使用具有可调节的分析物感测灵敏度的具有电化学传感器的隐形眼镜的装置和方法。在一些方面，检测分析物或生物物质的水平，并且基于分析物或生物物质的水平来打开或关闭传感器的多个子电极。基于打开或关闭的子电极的数量来调节传感器的灵敏度。在一些方面，来自传感器的电流水平用于确定要打开或关闭的子电极的数量。一方面，隐形眼镜包括：基底; 电源组件; 电路和调整电路。电路可以包括恒电位仪; 以及电耦合到所述恒电位仪并且被配置为感测分析物的水平的传感器。传感器的灵敏度可以通过调节电路调节。

53. 发明授权

US09307650B2 Method for manufacturing a foil-like electrical connector for connecting solar cells 有权
标题翻译：制造用于连接太阳能电池的箔状电连接器的方法
公开(公告)号：US09307650B2
公开(公告)日：2016-04-05
申请号：US13381263
申请日：2010-05-19
申请人： Hans-Joachim Krokoszinski , Martin Zippel
发明人： Hans-Joachim Krokoszinski , Martin Zippel
IPC分类号： H05K3/36 , H05K3/04 , B32B37/02 , H01L31/05 , B32B38/18 , B32B38/04 , H05K3/20 , H05K3/28 , H05K3/34
CPC分类号： H05K3/041 , B32B37/02 , B32B38/1841 , B32B2038/047 , B32B2457/12 , H01L31/0516 , H05K3/202 , H05K3/281 , H05K3/341 , H05K2201/0394 , H05K2201/0397 , H05K2203/1545 , Y02E10/50 , Y10T29/49117 , Y10T29/4921
摘要： In a method for manufacturing a foil-like electrical connector for connecting solar cells to form modules, an insulating carrier film sheet is initially provided in a width which essentially corresponds to the width of the solar cells to be connected. Furthermore, a conductive foil sheet having a width that is matched to the carrier film is provided. In addition, comb structures as subsequent electrical connection fingers are formed. The conductive foil sheet is positioned on the carrier film with the aid of pin-shaped extensions of a transport belt or a transport roller. The carrier film is subsequently joined to the conductive foil sheet, preferably via an adhesive bond. In the next step, an insulating cover film is applied, in particular laminated.
摘要翻译：在用于制造用于连接太阳能电池以形成模块的箔状电连接器的方法中，绝缘载体膜片片最初设置为基本上对应于待连接的太阳能电池的宽度的宽度。此外，提供具有与载体膜匹配的宽度的导电箔片。此外，形成作为随后的电连接指的梳结构。导电箔片借助于输送带或输送辊的销状延伸部位于载体膜上。载体膜随后通过粘结剂结合在导电箔片上。在下一步中，涂覆绝缘覆盖膜，特别是层压。

54. 发明授权

US09301407B2 Method of manufacturing substrate having cavity 有权
标题翻译：制造具有空腔的基板的方法
公开(公告)号：US09301407B2
公开(公告)日：2016-03-29
申请号：US14316382
申请日：2014-06-26
申请人： TAIYO YUDEN CO., LTD.
发明人： Masashi Miyazaki , Yuichi Sugiyama , Tatsuro Sawatari , Hideki Yokota , Yutaka Hata
IPC分类号： B05D5/12 , H05K3/46 , H05K3/44 , B05D3/12 , H05K3/00 , H05K3/04 , H05K3/30 , H05K3/42 , H05K3/06 , H05K1/18
CPC分类号： H05K3/4697 , B05D3/12 , B05D5/12 , H05K1/185 , H05K3/0044 , H05K3/007 , H05K3/0094 , H05K3/04 , H05K3/06 , H05K3/30 , H05K3/42 , H05K3/445 , H05K3/4608 , H05K3/4647 , H05K2201/10204
摘要： The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.
摘要翻译：制造基板的方法包括：在基层中形成贯通孔; 将金属虚设部件插入穿透孔中; 形成由合成树脂制成的绝缘部分，以填充所述穿透孔和所述虚拟部件之间的环形间隙; 在所述基底层的底面上形成覆盖所述虚拟部的底面的由合成树脂制成的下绝缘层，以与所述绝缘部连续; 在所述基底层的顶表面上形成覆盖所述虚拟部分的上表面的由合成树脂制成的上绝缘层，以与所述绝缘部分连续; 通过在上绝缘层中布线来形成暴露孔以暴露虚拟部分的顶表面; 并且通过蚀刻去除暴露在暴露孔中的虚拟部分来形成空腔。

55. 发明授权

US09265161B2 Method of manufacturing an embedded printed circuit board 有权
标题翻译：嵌入式印刷电路板的制造方法
公开(公告)号：US09265161B2
公开(公告)日：2016-02-16
申请号：US12956545
申请日：2010-11-30
申请人： Chi Hee Ahn , Sang Myung Lee , Yeong Uk Seo , Jin Su Kim , Sung Woon Yoon , Myoung Hwa Nam
发明人： Chi Hee Ahn , Sang Myung Lee , Yeong Uk Seo , Jin Su Kim , Sung Woon Yoon , Myoung Hwa Nam
IPC分类号： H05K3/02 , H05K3/10 , H05K3/46 , H05K3/18 , H05K3/00 , H05K3/04
CPC分类号： H05K3/465 , H05K3/0032 , H05K3/045 , H05K3/107 , H05K3/184 , H05K3/4661 , H05K2203/054 , Y10T29/49124 , Y10T29/49155
摘要： An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.
摘要翻译：提供嵌入式PCB，使用嵌入式PCB的多层PCB及其制造方法。制造嵌入式PCB的方法包括：使用激光使绝缘层图案化的第一步骤，使得绝缘层的一部分被选择性地蚀刻以形成电路图案区域;以及第二步骤，图案区域与电镀材料形成电路图案。因此，制造嵌入式PCB的方法可以使用激光器同时或顺序地蚀刻光致抗蚀剂层和绝缘层，以形成电路图案，从而获得微图案并简化制造工艺，并实现多层结构的对准精度使用嵌入式PCB的PCB层，从而提高产品的可靠性和产量。

56. 发明授权

US09215812B2 Support body, method of manufacturing support body, method of manufacturing wiring board, method of manufacturing electronic component, and wiring structure 有权
标题翻译：支撑体，制造支撑体的方法，制造布线板的方法，制造电子部件的方法和布线结构
公开(公告)号：US09215812B2
公开(公告)日：2015-12-15
申请号：US13945266
申请日：2013-07-18
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Kazuhiro Kobayashi
IPC分类号： H05K1/03 , H05K3/04 , H05K3/00 , H05K3/46 , H01L23/498 , H01L21/48
CPC分类号： H05K3/04 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K3/0097 , H05K3/4682 , H05K2203/122 , H05K2203/1383 , Y10T428/239 , H01L2924/00012
摘要： A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.
摘要翻译：制造支撑体的方法包括：（a）制备支撑基底; （b）制备其上设置有剥离层的金属箔; （c）在所述支撑基板的除了所述支撑基板的外周部分的一定区域内的所述支撑基板上设置粘合调整层，其中所述粘合调整层被配置为调整所述剥离层和所述支撑基板之间的接触面积 ; 和（d）在支撑基板上设置金属箔，使得设置在金属箔上的剥离层经由粘合调节层面向支撑基板。在步骤（d）中，粘合调节层粘附到支撑基板上，并且剥离层粘附到支撑基板的外周部分，并且与粘合调节层接触，但不粘附到粘合调节层。

57. 发明授权

US09161712B2 Systems and methods for encapsulating electronics in a mountable device 有权
公开(公告)号：US09161712B2
公开(公告)日：2015-10-20
申请号：US13850753
申请日：2013-03-26
申请人： Google Inc.
发明人： James Etzkorn
IPC分类号： A61B5/05 , A61B5/145 , A61B3/10 , A61B5/1473 , A61B5/00 , H05K3/46 , H05K1/18 , H05K3/04
CPC分类号： A61B5/14546 , A61B3/10 , A61B3/101 , A61B5/0002 , A61B5/14532 , A61B5/1473 , A61B5/1477 , A61B5/6813 , A61B5/6821 , A61B2560/0214 , A61B2562/12 , G02C7/04 , H05K1/186 , H05K3/048 , H05K3/4682 , Y10T29/49002 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147
摘要： A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.

58. 发明授权

US09161704B2 Insulated implantable electrical curcuit 有权
标题翻译：绝缘可植入电路
公开(公告)号：US09161704B2
公开(公告)日：2015-10-20
申请号：US14625364
申请日：2015-02-18
申请人： Second Sight Medical Products, Inc.
发明人： Robert J Greenburg , Jordan M Neysmith , Neil H Talbot , Jerry Ok
IPC分类号： A61N1/05 , A61B5/04 , C23C16/56 , C23C16/01 , H05K3/04 , H05K3/06
CPC分类号： A61B5/04001 , A61B2562/125 , A61N1/0529 , A61N1/0543 , A61N1/0551 , A61N1/0553 , C23C16/01 , C23C16/56 , H05K1/032 , H05K3/007 , H05K3/048 , H05K3/06 , H05K3/28 , H05K3/4676 , H05K2201/0179 , H05K2203/016 , H05K2203/0502 , H05K2203/176 , Y10T29/49124 , Y10T29/49155
摘要： The invention is directed to a method of making an implantable insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable after long exposure to living tissue. Layers of Parylene may be combined with layers of a polymer, such as polyimide, to yield greater design flexibility in the circuit. Multiple electrical conduction layers may be stacked in the circuit to increase packing density.
摘要翻译：本发明涉及一种制造可植入绝缘电路的方法，该方法利用聚对二甲苯，优选作为聚对二甲苯（parylene），已知具有优异活体组织植入特征的聚合物，以提供诸如刺激剂和传感器的导电电气装置的慢性植入。该设备在长时间暴露于生物体组织之后，薄，柔性，电绝缘和稳定。聚对二甲苯层可以与诸如聚酰亚胺的聚合物层结合，以在电路中产生更大的设计灵活性。多个导电层可以堆叠在电路中以增加堆积密度。

59. 发明授权

US09155201B2 Preparation of articles with conductive micro-wire pattern 有权
标题翻译：具有导电微线图案的制品制备
公开(公告)号：US09155201B2
公开(公告)日：2015-10-06
申请号：US14094841
申请日：2013-12-03
申请人： Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright , Julie A. Cummings
发明人： Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright , Julie A. Cummings
IPC分类号： H05K1/09 , H05K3/00 , H05K1/02 , H05K3/04 , H05K3/22
CPC分类号： H05K1/09 , G03F7/0002 , G03F7/0035 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0313 , H05K3/0023 , H05K3/04 , H05K3/22 , H05K2201/0108 , H05K2201/032
摘要： Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity
摘要翻译：导电性物品和器件具有通过在变形温度低于150℃的透明柔性基底上固化光固化层形成的导电微线。光固化层在温度微通道形成时的粘度<5,000帕斯卡 - 秒微通道的平均宽度小于或等于4μm，平均深度和平均宽度比大于或等于1.光固化层暴露于固化紫外线辐射以形成光固化微观图案并且在光固化微通道中形成包含金属纳米颗粒的导电组合物。导电组合物以光固化微通道的图案固化，以在透明柔性基底上的光固化微通道的图案中提供导电微线图案。至少50％的导电微细线中的每一个具有小于0.025欧姆/平方的薄层电阻。

60. 发明授权

US09114425B2 Method for manufacturing a mask having submillimetric apertures for a submillimetric electrically conductive grid, mask having submillimetric apertures and submillimetric electrically conductive grid 有权
标题翻译：用于制造具有亚毫米级导电栅格的亚毫米孔的掩模的方法，具有亚毫米级孔径和亚毫米级导电栅格的掩模
公开(公告)号：US09114425B2
公开(公告)日：2015-08-25
申请号：US13120265
申请日：2009-09-24
申请人： Georges Zagdoun , Bernard Nghiem , Emmanuel Valentin , Svetoslav Tchakarov
发明人： Georges Zagdoun , Bernard Nghiem , Emmanuel Valentin , Svetoslav Tchakarov
IPC分类号： B05D1/32 , H05K3/04 , C03C17/00 , C03C17/06 , C03C17/23 , H01L51/52 , B05D1/38 , B05D3/12 , B05D5/00
CPC分类号： B05D1/322 , B05D1/38 , B05D3/12 , B05D5/00 , C03C17/002 , C03C17/06 , C03C17/23 , C03C2218/328 , C03C2218/34 , H01L51/5203 , H01L51/5206 , H01L51/5209 , H01L2251/5361 , H05K3/048 , Y10T29/49002 , Y10T428/24273
摘要： A process for manufacturing a mask having submillimetric openings, in which: for a masking layer, a solution of colloidal nanoparticles that are stabilized and dispersed in a first solvent is deposited, the particles having a given glass transition temperature Tg, the drying of the masking layer is carried out at a temperature below the temperature Tg until a mask having a two-dimensional network of submillimetric openings is obtained with substantially straight mask area edges, in a zone referred to as a network mask zone, a zone free of masking is formed on the face by mechanical and/or optical removal of at least one peripheral portion of the network mask zone. The invention also relates to the network mask and the grid with an electroconductive solid zone that are thus obtained.
摘要翻译：制造具有亚毫米开口的掩模的方法，其中：沉积稳定和分散在第一溶剂中的胶体纳米颗粒的掩蔽层，所述颗粒具有给定的玻璃化转变温度Tg，所述掩蔽的干燥层在低于温度Tg的温度下进行，直到在被称为网络掩模区的区域中获得具有基本上直的掩模区域边缘的具有亚毫米开口的二维网络的掩模，形成无掩蔽的区域通过机械和/或光学去除网络掩模区域的至少一个周边部分而在表面上。本发明还涉及由此获得的具有导电固体区的网络掩模和网格。

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