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    • 61. 发明授权
    • Phase shift mask
    • 相移掩模
    • US07846625B2
    • 2010-12-07
    • US12172880
    • 2008-07-14
    • Miyoko Kawashima
    • Miyoko Kawashima
    • G03C5/00G03F1/00
    • G03F7/70425G03F1/26G03F7/70558G03F7/70566
    • A phase shift mask includes a substrate including first and second transmissive regions alternately disposed, and absorbers disposed on a surface of the substrate such that each absorber is sandwiched between the first and second transmissive regions. A phase shifter is defined by a difference between a surface height of the first transmissive region and a surface height of the second transmissive region. At least the first transmissive region among the first and second transmissive regions has a trench. An aperture portion formed between opposite side walls of respective adjacent absorbers has a width that increases along a depth direction of the substrate. Each trench has a width that increases along the depth direction of the substrate.
    • 相移掩模包括包括交替设置的第一和第二透射区域的基板和设置在基板的表面上的吸收体,使得每个吸收体夹在第一和第二透射区域之间。 移相器由第一透射区域的表面高度和第二透射区域的表面高度之间的差定义。 至少第一和第二透射区域中的第一透射区域具有沟槽。 形成在各个相邻吸收体的相对侧壁之间的开口部分具有沿衬底的深度方向增加的宽度。 每个沟槽具有沿衬底的深度方向增加的宽度。
    • 63. 发明授权
    • Photomask and method for forming wiring pattern using the same
    • 光掩模和使用其形成布线图案的方法
    • US07829247B2
    • 2010-11-09
    • US11892082
    • 2007-08-20
    • Yoshinori Maeno
    • Yoshinori Maeno
    • G03F1/00G03C5/00
    • G03F1/50
    • A photomask includes a transparent mask substrate, and a plurality of square mask cells provided on the mask substrate. Each mask cell includes at least one of a light transmitting region and a light shielding region. A planar region (in which the mask cells are formed) of the mask substrate includes a first region, a second region surrounding the first region, and a third region outside the second region. The first region includes a first group of mask cells transmitting lights of a first light intensity greater than zero and less than or equal to 1. The second region includes a second group of mask cells transmitting lights of a second light intensity greater than zero and less than the first light intensity. The third region includes a third group of mask cells transmitting lights of a third light intensity greater than or equal to zero and less than the second light intensity.
    • 光掩模包括透明掩模基板和设置在掩模基板上的多个方形掩模单元。 每个掩模单元包括透光区域和遮光区域中的至少一个。 掩模基板的平面区域(其中形成有掩模单元的)包括第一区域,围绕第一区域的第二区域和第二区域外的第三区域。 第一区域包括透射大于零且小于或等于1的第一光强度的光的第一组掩模电池。第二区域包括透射大于零和小于零的第二光强度的光的第二组屏蔽单元 比第一光强度。 第三区域包括透射第三光强度大于或等于零且小于第二光强度的光的第三组掩模单元。
    • 67. 发明授权
    • Pattern forming method, semiconductor device manufacturing method and phase shift photomask having dummy gate patterns
    • 图案形成方法,半导体器件制造方法和具有虚拟栅极图案的相移光掩模
    • US07776514B2
    • 2010-08-17
    • US11374009
    • 2006-03-14
    • Masashi Fujimoto
    • Masashi Fujimoto
    • H01L21/00G03F1/00G03C5/00
    • G03F1/70G03F1/26
    • In a method for forming a plurality of gate patterns in parallel with each other on a photoresist layer within one circuit block, at least one dummy gate pattern is formed in parallel with the gate patterns when a pitch between said gate patterns is larger than a predetermined maximum pitch, so that pitches between the gate patterns including the dummy gate pattern are smaller than the predetermined maximum pitch. Then, a photolithography process is performed upon the photoresist layer by using a phase shift photomask having first and second openings whose difference in phase is π. The first and second openings alternate between the gate patterns including the dummy gate pattern to form phase edges therein.
    • 在一个电路块内的光致抗蚀剂层上形成彼此平行的多个栅极图案的方法中,当所述栅极图案之间的间距大于预定的栅极图案时,形成与栅极图案平行的至少一个伪栅极图案 使得包括伪栅极图案的栅极图案之间的间距小于预定的最大间距。 然后,通过使用具有相位差为“pgr”的第一和第二开口的相移光掩模,在光致抗蚀剂层上进行光刻工艺。 第一和第二开口在包括伪栅极图案的栅极图案之间交替,以在其中形成相位边缘。
    • 70. 发明授权
    • Pattern forming method used in semiconductor device manufacturing and method of manufacturing semiconductor device
    • 半导体器件制造中使用的图案形成方法和半导体器件的制造方法
    • US07749687B2
    • 2010-07-06
    • US11798724
    • 2007-05-16
    • Hiroko Nakamura
    • Hiroko Nakamura
    • G03C5/00
    • G03F7/0035G03F7/40H01L21/0273H01L21/31058H01L21/31144H01L21/76816
    • A method of forming a pattern on a photosensitive resin film in lithography, a method of forming a pattern for a semiconductor device, and a method of manufacturing a semiconductor device using the patterned film are disclosed. In an aspect of the invention, there is provided a method of forming a pattern on a photosensitive resin film, comprising forming a processing-object film above a semiconductor substrate, forming a first patterned photosensitive resin layer on the processing-object film, implanting ions into the first patterned photosensitive resin layer, the sum (Rp+3dRp) of a projected range (Rp) for the ions in the first photosensitive resin layer and three times a standard deviation (dRp) of the projected range being greater than a thickness of the first patterned photosensitive resin layer, and forming a second patterned photosensitive resin layer on the ion-implanted first patterned photosensitive resin layer.
    • 公开了一种在光刻中在感光性树脂膜上形成图案的方法,形成半导体器件用图案的方法以及使用该图案化膜的半导体器件的制造方法。 在本发明的一个方面,提供了一种在感光性树脂膜上形成图案的方法,包括在半导体衬底上形成处理对象膜,在处理对象膜上形成第一图案化感光树脂层,将离子 在第一图案感光性树脂层中,第一感光性树脂层中的离子的投影范围(Rp)的和(Rp + 3dRp)和投影范围的标准偏差(dRp)的三倍大于 第一图案化感光树脂层,并且在离子注入的第一图案化感光树脂层上形成第二图案化感光树脂层。