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    • 75. 发明授权
    • Chemical vapor deposition of chalcogenide materials via alternating layers
    • 化学气相沉积硫族化物材料经交替层
    • US07858152B2
    • 2010-12-28
    • US12284425
    • 2008-09-22
    • Stanford R. OvshinskySmuruthi Kamepalli
    • Stanford R. OvshinskySmuruthi Kamepalli
    • C23C16/00
    • C23C16/305H01L45/04H01L45/06H01L45/144H01L45/1616
    • A chemical vapor deposition (CVD) process for preparing electrical and optical chalcogenide materials. In a preferred embodiment, the instant CVD-deposited materials exhibit one or more of the following properties: electrical switching, accumulation, setting, reversible multistate behavior, resetting, cognitive functionality, and reversible amorphous-crystalline transformations. In one embodiment, a multilayer structure, including at least one layer containing a chalcogen element, is deposited by CVD and subjected to post-deposition application of energy to produce a chalcogenide material having properties in accordance with the instant invention. In another embodiment, a single layer chalcogenide material having properties in accordance with the instant invention is formed from a CVD deposition process including three or more deposition precursors, at least one of which is a chalcogen element precursor. Preferred materials are those that include the chalcogen Te along with Ge and/or Sb.
    • 用于制备电和光硫族化物材料的化学气相沉积(CVD)工艺。 在优选的实施方案中,瞬时CVD沉积的材料表现出一种或多种以下性质:电开关,积聚,凝固,可逆多态行为,复位,认知功能和可逆非晶晶转换。 在一个实施方案中,包括含有硫属元素的至少一层的多层结构通过CVD沉积,并进行后沉积施加能量以产生具有根据本发明的性质的硫族化物材料。 在另一个实施方案中,具有根据本发明的性质的单层硫族化物材料由包括三种或更多种沉积前体的CVD沉积工艺形成,其中至少一种是硫属元素前体。 优选的材料是含有硫族元素Te和Ge和/或Sb的材料。
    • 77. 发明授权
    • Self-aligned memory cells and method for forming
    • 自对准存储单元及其形成方法
    • US07838341B2
    • 2010-11-23
    • US12075913
    • 2008-03-14
    • Charles H. Dennison
    • Charles H. Dennison
    • H01L21/82
    • H01L45/126H01L27/2409H01L27/2436H01L27/2463H01L45/06H01L45/1233H01L45/144H01L45/1683
    • The invention provides a memory cell based on variable resistance material memory element that includes an access device having a pillar structure that may also include a protective sidewall layer. The pillar access device selects and isolates the memory cell from other memory array cells and is adapted to both self-align any memory element formed thereon, and to deliver suitable programming current to the memory element. The pillar structure is formed from one or more access device layers stacked above a wordline and below the memory element. Optional resistive layers may be selectively formed within the pillar structure to minimize resistance in the access device layer and the memory element. The pillar access device may be a diode, transistor, Ovonic threshold switch or other device capable of regulating current flow to an overlying programmable memory material.
    • 本发明提供了一种基于可变电阻材料存储元件的存储单元,其包括具有柱结构的存取装置,所述柱结构还可包括保护侧壁层。 支柱存取装置选择并隔离其他存储器阵列单元的存储单元,并且适于将形成在其上的任何存储元件自对准,并将适当的编程电流传送到存储元件。 柱结构由堆叠在字线上方和存储元件下方的一个或多个访问器件层形成。 可选择性地在柱结构内形成可选的电阻层,以最小化存取器件层和存储元件中的电阻。 柱式存取装置可以是二极管,晶体管,Ovonic阈值开关或能够调节流向上覆可编程存储器材料的电流的其他装置。
    • 78. 发明授权
    • Multilevel phase change memory
    • 多级相变存储器
    • US07833824B2
    • 2010-11-16
    • US12349077
    • 2009-01-06
    • Jong-Won S. Lee
    • Jong-Won S. Lee
    • H01L21/00
    • G11C11/5678G11C13/0004G11C13/004G11C13/0069H01L45/06H01L45/1233H01L45/141H01L45/1683
    • A multilevel phase change memory may be formed of a chalcogenide material formed between a pair of spaced electrodes. The cross-sectional area of the chalcogenide material may decrease as the material extends from one electrode to another. As a result, the current density decreases from one electrode to the other. This means that a higher current is necessary to convert the material that has the largest cross-sectional area. As a result, different current levels may be utilized to convert different amounts of the chalcogenide material to the amorphous or reset state. A distinguishable resistance may be associated with each of those different amounts of amorphous material, providing the opportunity to engineer a number of different current selectable programmable states.
    • 多级相变存储器可以由在一对间隔开的电极之间形成的硫族化物材料形成。 随着材料从一个电极延伸到另一个电极,硫族化物材料的横截面积可能会减小。 结果,电流密度从一个电极降低到另一个电极。 这意味着需要更高的电流来转换具有最大横截面面积的材料。 结果,可以利用不同的电流水平将不同量的硫族化物材料转化为非晶态或复位状态。 可区分的电阻可能与这些不同数量的无定形材料中的每一种相关联,提供了设计多个不同的当前可选可编程状态的机会。