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    • 1. 发明授权
    • Reduction of drift in phase-change memory via thermally-managed programming
    • 通过热管理编程减少相变存储器中的漂移
    • US07978508B2
    • 2011-07-12
    • US12356236
    • 2009-01-20
    • Wolodymyr Czubatyj
    • Wolodymyr Czubatyj
    • G11C11/00
    • G11C13/0035G11C7/04G11C11/5678G11C13/0004G11C13/0069G11C2013/0083G11C2013/0092
    • A method of programming a phase-change material. The method includes providing a transformation pulse to the phase-change material, where the transformation pulse includes a programming waveform and a conditioning waveform. The programming waveform provides sufficient energy to alter the structural state of the phase-change material. In one embodiment, the programming waveform alters the volume fractions of crystalline and amorphous phase regions within the phase-change material. The conditioning waveform provides sufficient energy to heat the phase-change material to a temperature above the ambient temperature but below the crystallization temperature of the phase-change material. The method programs the phase-change material to a state that exhibits a reduced time variation of resistance.
    • 编程相变材料的方法。 该方法包括向相变材料提供变换脉冲,其中变换脉冲包括编程波形和调节波形。 编程波形提供足够的能量来改变相变材料的结构状态。 在一个实施例中,编程波形改变相变材料内的晶体和非晶相区域的体积分数。 调节波形提供足够的能量以将相变材料加热到高于环境温度但低于相变材料的结晶温度的温度。 该方法将相变材料编程为呈现减小的电阻时间变化的状态。
    • 2. 发明授权
    • Memory device and method of making same
    • 存储器件及其制作方法
    • US07902536B2
    • 2011-03-08
    • US11495927
    • 2006-07-28
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • H01L29/02H01L47/00
    • G11C11/5678G11C11/56G11C13/0004H01L45/06H01L45/122H01L45/143H01L45/144H01L45/148
    • A radial memory device includes a phase-change material, a first electrode in electrical communication with the phase-change material, the first electrode having a substantially planar first area of electrical communication with the phase-change material. The radial memory device also includes a second electrode in electrical communication with the phase-change material, the second electrode having a second area of electrical communication with the phase-change material, the second area being laterally spacedly disposed from the first area and substantially circumscribing the first area.Further, a method of making a memory device is disclosed. The steps include depositing a first electrode, depositing a first insulator, configuring the first insulator to define a first opening. The first opening provides for a generally planar first contact of the first electrode. The method further including the steps of depositing a phase-change material, depositing a second insulator, configuring the second insulator, depositing a second electrode having a second contact laterally displaced from said first contact, and configuring said second electrode.
    • 径向存储器件包括相变材料,与相变材料电连通的第一电极,第一电极具有与相变材料电连通的基本平坦的第一区域。 所述径向存储装置还包括与所述相变材料电连通的第二电极,所述第二电极具有与所述相变材料电连通的第二区域,所述第二区域与所述第一区域横向间隔设置并且基本上限定 第一个区域。 此外,公开了一种制造存储器件的方法。 这些步骤包括沉积第一电极,沉积第一绝缘体,构成第一绝缘体以限定第一开口。 第一开口提供第一电极的大致平面的第一接触。 该方法还包括以下步骤:沉积相变材料,沉积第二绝缘体,构成第二绝缘体,沉积具有从所述第一触点横向移位的第二触点的第二电极,以及配置所述第二电极。
    • 10. 发明申请
    • Electrically rewritable non-volatile memory element and method of manufacturing the same
    • 电可重写非易失性存储元件及其制造方法
    • US20070096074A1
    • 2007-05-03
    • US11264129
    • 2005-11-02
    • Isamu AsanoNatsuki SatoTyler LowreyGuy WickerWolodymyr CzubatyjStephen Hudgens
    • Isamu AsanoNatsuki SatoTyler LowreyGuy WickerWolodymyr CzubatyjStephen Hudgens
    • H01L47/00
    • H01L45/06H01L27/2436H01L45/1233H01L45/126H01L45/144H01L45/148
    • A non-volatile memory element includes a first interlayer insulation layer 11 having a first through-hole 11a, a second interlayer insulation layer 12 having a second through-hole 12a formed on the first interlayer insulation layer 11, a bottom electrode 13 provided in the first through-hole 11, recording layer 15 containing phase change material provided in the second through-hole 12, a top electrode 16 provided on the second interlayer insulation layer 12, and a thin-film insulation layer 14 formed between the bottom electrode 13 and the recording layer 15. In accordance with this invention, the diameter D1 of a bottom electrode 13 buried in a first through-hole 11a is smaller than the diameter D2 of a second through-hole 12a, thereby decreasing the thermal capacity of the bottom electrode 13. Therefore, when a pore 14a is formed by dielectric breakdown in a thin-film insulation layer 14 and the vicinity is used as a heating region, the amount of heat escaping to the bottom electrode 13 is decreased, resulting in higher heating efficiency.
    • 非易失性存储元件包括具有第一通孔11a的第一层间绝缘层11,具有形成在第一层间绝缘层11上的第二通孔12a的第二层间绝缘层12, 在第一通孔11中,设置在第二通孔12中的包含相变材料的记录层15,设置在第二层间绝缘层12上的顶部电极16和形成在第二通孔12的底部电极之间的薄膜绝缘层14 13和记录层15。 根据本发明,埋在第一通孔11a中的底部电极13的直径D 1小于第二通孔12a的直径D 2,从而降低底部电极13的热容量 。 因此,当通过薄膜绝缘层14中的电介质击穿形成孔14a并且将其附近用作加热区域时,逸出到底部电极13的热量减少,导致更高的加热效率。