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    • 89. 发明授权
    • Mitigating damage from a chemical mechanical planarization process
    • 减轻化学机械平面化过程造成的损害
    • US09437814B1
    • 2016-09-06
    • US14473879
    • 2014-08-29
    • Crossbar, Inc.
    • Harry Yue GeeMajid MilaniNatividad Vasquez, Jr.Steven Patrick MaxwellSundar Narayanan
    • H01L21/332H01L45/00
    • H01L45/16H01L45/085H01L45/1233H01L45/1253H01L45/145
    • During fabrication of a two-terminal memory device, a terminal (e.g., bottom terminal) can be formed. After formation of the terminal, a chemical mechanical planarization (CMP) process can be applied that, depending on the composition of the terminal, can cause damage that affect operating characteristics of the finished memory device or cell. In some embodiments, such damage can be removed by one or more post-CMP processes. In some embodiments, such damage can be mitigated so as to prevent the damage from occurring at all, by, e.g., forming a sacrificial layer atop the terminal prior to performing the CMP process. Thus, the sacrificial layer can operate to protect the terminal from damage resulting from the CMP process, with the remainder of the sacrificial layer being removed prior to completing the fabrication of the two-terminal memory device.
    • 在制造双端存储器件期间,可以形成端子(例如,底端)。 在端子形成之后,可以应用化学机械平面化(CMP)工艺,根据端子的组成,可以引起影响成品存储器件或电池的工作特性的损坏。 在一些实施例中,可以通过一个或多个后CMP工艺来去除这种损伤。 在一些实施例中,可以减轻这种损害,以便防止在完成CMP过程之前通过例如在端子顶部形成牺牲层来完全发生损坏。 因此,牺牲层可以操作以保护端子免受由CMP工艺引起的损伤,在完成两端存储器件的制造之前牺牲层的其余部分被去除。