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1. 发明授权

US11411029B2 Image sensing chip package structure including adhesive loop 有权
公开(公告)号：US11411029B2
公开(公告)日：2022-08-09
申请号：US16893176
申请日：2020-06-04
申请人： Tong Hsing Electronic Industries, Ltd.
发明人： Chia-Shuai Chang
IPC分类号： H01L27/146
摘要： An image sensing chip package structure includes a chip, an adhesive loop and a light-transmissible substrate member. The chip includes an image sensing region. The adhesive loop is connected to the chip, and has an inner peripheral surface that defines a plurality of protrusions which surround the image sensing region of the chip. The light-transmissible substrate member is connected to the adhesive loop oppositely of the chip to cover the image sensing region of the chip. Methods of manufacturing the image sensing chip package structures are also provided.

2. 发明授权

US09468091B2 Stress-reduced circuit board and method for forming the same 有权
标题翻译：应力减小电路板及其形成方法
公开(公告)号：US09468091B2
公开(公告)日：2016-10-11
申请号：US13960897
申请日：2013-08-07
申请人： Chien-Cheng Wei , Wu-Hui Cheng
发明人： Chien-Cheng Wei , Wu-Hui Cheng
IPC分类号： H05K1/02 , H05K3/06 , H05K3/00 , H05K1/03 , H05K3/10 , H05K3/14 , H05K3/16 , H05K3/38
CPC分类号： H05K1/0271 , H05K1/0265 , H05K1/0306 , H05K3/06 , H05K3/108 , H05K3/146 , H05K3/16 , H05K3/388 , H05K2201/0338 , H05K2201/09845 , H05K2203/058 , H05K2203/1476 , H05K2203/1572
摘要： A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and which respectively have peripheral marginal regions that are configured in a stepped arrangement. The first electrically conductive layer is configured to have an area dimension larger than that of the second electrically conductive layer and a thickness not greater than that of the second electrically conductive layer so as to minimize stress caused by a difference in coefficients of thermal expansion between the insulating substrate and the first and second electrically conductive layers.
摘要翻译：应力降低电路板包括绝缘基板以及彼此堆叠的第一和第二导电层，并且分别具有以阶梯式布置的周边边缘区域。第一导电层被配置为具有比第二导电层的面积尺寸更大的面积尺寸，并且其厚度不大于第二导电层的厚度，以便使由于第二导电层之间的热膨胀系数的差异而引起的应力最小化绝缘基板和第一和第二导电层。

3. 发明授权

US08898892B2 Method of making circuit board module 有权
标题翻译：制作电路板模块的方法
公开(公告)号：US08898892B2
公开(公告)日：2014-12-02
申请号：US14019310
申请日：2013-09-05
申请人： Tong Hsing Electronic Industries, Ltd.
发明人： Wen-Chung Chiang , Keng-Chung Wu , Ying-Chi Hsieh , Cheng-Kang Lu , Ming-Huang Fu
IPC分类号： H05K7/20 , H01L23/373 , H05K3/00
CPC分类号： H05K7/20509 , H01L23/3735 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H05K3/00 , Y10T29/49002 , Y10T29/49126 , Y10T29/49128 , Y10T29/4935 , H01L2924/00014 , H01L2924/00
摘要： A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
摘要翻译：电路板模块包括电路板和散热装置。电路板包括陶瓷衬底和形成在陶瓷衬底的表面上的电路图案。将电路板烧结结合到散热装置的主体上。还公开了制造电路板模块的方法。

4. 发明授权

US08549739B2 Method of making circuit board module 有权
标题翻译：制作电路板模块的方法
公开(公告)号：US08549739B2
公开(公告)日：2013-10-08
申请号：US12800414
申请日：2010-05-13
申请人： Wen-Chung Chiang , Keng-Chung Wu , Ying-Chi Hsieh , Cheng-Kang Lu , Ming-Huang Fu
发明人： Wen-Chung Chiang , Keng-Chung Wu , Ying-Chi Hsieh , Cheng-Kang Lu , Ming-Huang Fu
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L23/3735 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H05K3/00 , Y10T29/49002 , Y10T29/49126 , Y10T29/49128 , Y10T29/4935 , H01L2924/00014 , H01L2924/00
摘要： A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
摘要翻译：电路板模块包括电路板和散热装置。电路板包括陶瓷衬底和形成在陶瓷衬底的表面上的电路图案。将电路板烧结结合到散热装置的主体上。还公开了制造电路板模块的方法。

5. 发明申请

US20130153016A1 Solar Cell Flip Chip Package Structure and Method for Manufacturing the same 审中-公开
标题翻译：太阳能电池倒装芯片封装结构及其制造方法
公开(公告)号：US20130153016A1
公开(公告)日：2013-06-20
申请号：US13330674
申请日：2011-12-20
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H01L31/0224 , H01L31/02 , H01L31/18
CPC分类号： H01L31/02008 , H01L31/048 , H01L2224/73204 , Y02E10/50
摘要： The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.
摘要翻译：本发明提供了一种太阳能电池倒装芯片封装结构，包括：具有第一表面，第二表面和从第一表面延伸到第二表面的开口的基板; 设置在所述基板的第一表面上的导电层; 结合在导电层上的太阳能电池倒装芯片; 安装在所述基板的第二表面上的透明层; 以及形成在从第一表面延伸到第二表面的开口之间的存储空间，太阳能电池倒装芯片和透明层。

6. 发明授权

US08461614B2 Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device 有权
标题翻译：包装衬底装置，用于制造包装衬底装置的方法和封装的发光装置
公开(公告)号：US08461614B2
公开(公告)日：2013-06-11
申请号：US12753371
申请日：2010-04-02
申请人： Wen-Chung Chiang , Keng-Chung Wu , Ying-Chi Hsieh , Cheng-Kang Lu , Ming-Huang Fu
发明人： Wen-Chung Chiang , Keng-Chung Wu , Ying-Chi Hsieh , Cheng-Kang Lu , Ming-Huang Fu
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/3011 , H01L2924/3025 , H05K1/0306 , H05K1/183 , H05K3/4611 , H05K3/4697 , H05K2201/0969 , H05K2201/09781 , H05K2201/10106 , H05K2203/063 , H05K2203/167 , Y10T29/49002 , Y10T29/4935 , Y10T156/10 , Y10T156/1056 , H01L2924/00014 , H01L2924/00
摘要： A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.
摘要翻译：包装基板装置包括：第一层压体，其包括设置在第一陶瓷基板的上表面上的第一陶瓷基板和第一铜图案; 以及设置在所述第一铜图案上并包括第二陶瓷基板的第二层压体，设置在所述第二陶瓷基板的上表面上的第二铜图案，以及贯穿所述第二陶瓷基板和所述第二铜图案的通孔，露出第一铜图案的铜部分。发光半导体管芯可以安装在通孔内的铜部分上。可以通过第一层压板实现有效的散热。

7. 发明申请

US20130127004A1 Image Sensor Module Package and Manufacturing Method Thereof 审中-公开
标题翻译：图像传感器模块的封装和制造方法
公开(公告)号：US20130127004A1
公开(公告)日：2013-05-23
申请号：US13485939
申请日：2012-06-01
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H01L31/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： An image sensor module includes a substrate, a circuit layer, a flip chip, an insulating layer, and a conducting layer. The substrate has at least one transparent area and defines a first surface and a second surface. The circuit layer is provided on the first surface of the substrate. The flip chip is connected to the circuit layer. The insulating layer substantially encases the flip chip and a part of the circuit layer, wherein the insulating layer has at least one groove at a lateral side of said insulating layer thereof each provided with a metal layer. The conducting layer is provided on a top surface of the insulating layer, wherein the conducting layer is electrically connected to the circuit layer via the metal layer.
摘要翻译：图像传感器模块包括基板，电路层，倒装芯片，绝缘层和导电层。衬底具有至少一个透明区域并且限定第一表面和第二表面。电路层设置在基板的第一表面上。倒装芯片连接到电路层。所述绝缘层基本上包含所述倒装芯片和所述电路层的一部分，其中，所述绝缘层在其绝缘层的横向侧具有至少一个设置有金属层的沟槽。导电层设置在绝缘层的顶表面上，其中导电层通过金属层与电路层电连接。

8. 发明申请

US20120171510A1 CERAMIC PLATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有反射膜的陶瓷板及其制造方法
公开(公告)号：US20120171510A1
公开(公告)日：2012-07-05
申请号：US13084977
申请日：2011-04-12
申请人： Ta-Hsiang CHIANG , Chien-Cheng WEI
发明人： Ta-Hsiang CHIANG , Chien-Cheng WEI
IPC分类号： B32B15/04 , C23C14/18 , C23C14/34 , C25D5/54 , B32B17/06 , B05D3/02
CPC分类号： C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00853 , C04B2111/80 , Y10T428/12549 , C04B35/00 , C04B35/10 , C04B41/5022 , C04B41/0072 , C04B41/5116
摘要： A ceramic plate with reflective film and method of manufacturing the same are provided. The ceramic plate with reflective film at least comprises a ceramic substrate and a reflective film. The reflective film at least includes a glass layer and a metal film with metal crystals. Each of the metal crystals possesses a particular diameter for providing high infrared reflectivity with a particular wavelength.
摘要翻译：提供了具有反射膜的陶瓷板及其制造方法。具有反射膜的陶瓷板至少包括陶瓷基板和反射膜。反射膜至少包括玻璃层和具有金属晶体的金属膜。每个金属晶体具有特定的直径以提供具有特定波长的高红外反射率。

9. 发明申请

US20140110159A1 STRESS-REDUCED CIRCUIT BOARD AND METHOD FOR FORMING THE SAME 有权
标题翻译：应力减小电路板及其形成方法
公开(公告)号：US20140110159A1
公开(公告)日：2014-04-24
申请号：US13960897
申请日：2013-08-07
申请人： Chien-Cheng Wei , Wu-Hui Cheng
发明人： Chien-Cheng Wei , Wu-Hui Cheng
IPC分类号： H05K1/02 , H05K3/06 , H05K3/00
CPC分类号： H05K1/0271 , H05K1/0265 , H05K1/0306 , H05K3/06 , H05K3/108 , H05K3/146 , H05K3/16 , H05K3/388 , H05K2201/0338 , H05K2201/09845 , H05K2203/058 , H05K2203/1476 , H05K2203/1572
摘要： A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and which respectively have peripheral marginal regions that are configured in a stepped arrangement. The first electrically conductive layer is configured to have an area dimension larger than that of the second electrically conductive layer and a thickness not greater than that of the second electrically conductive layer so as to minimize stress caused by a difference in coefficients of thermal expansion between the insulating substrate and the first and second electrically conductive layers.
摘要翻译：应力降低电路板包括绝缘基板以及彼此堆叠的第一和第二导电层，并且分别具有以阶梯式布置的周边边缘区域。第一导电层被配置为具有比第二导电层的面积尺寸更大的面积尺寸，并且其厚度不大于第二导电层的厚度，以便使由于第二导电层之间的热膨胀系数的差异而引起的应力最小化绝缘基板和第一和第二导电层。

10. 发明申请

US20140090825A1 LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：液体冷却热消散装置及其制造方法
公开(公告)号：US20140090825A1
公开(公告)日：2014-04-03
申请号：US14077430
申请日：2013-11-12
申请人： TONG HSING ELECTRONIC INDUSTRIES, LTD.
发明人： Wen-Chung CHIANG
IPC分类号： F28F3/12
CPC分类号： F28F3/12 , F28F21/04 , F28F21/085 , F28F2255/18 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.
摘要翻译：一种液冷式散热装置，包括限定液体室的室限制体，其适于容纳液体冷却剂，并且具有围绕液体室的周围壁;盖板，覆盖液体室并烧结结合到周围壁与液体室空间连通的液体入口以及与液体室空间连通的液体出口。还公开了制造液冷式散热装置的方法。

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