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    • 2. 发明授权
    • Pseudo-8T NVSRAM cell with a charge-follower
    • 带有充电跟随器的伪8T NVSRAM单元
    • US08971113B2
    • 2015-03-03
    • US14064220
    • 2013-10-28
    • Aplus Flash Technology, Inc
    • Peter Wung Lee
    • G11C11/34G11C14/00
    • G11C14/0063
    • The present invention discloses a 10T NVSRAM cell with a 6T SRAM cell with 4T Flash cell with one dedicated Flash-based Charger. In addition, a Pseudo-8T NVSRAM cell with a shared Flash-based Charger between two adjacent 8T NVSRAM cells at top and bottom in cell layout is also disclosed to further reduce cell size by 20%. As opposed to the prior art of 12T NVSRAM cell, the Store operation of the above two preferred embodiments use a DRAM-like charge-sensing scheme with Flash cell configured into a voltage follower ensured by the Flash-based Charger to obtain the final ΔVQ-QB>0.2V at Q and QB nodes of each SRAM cell to cover all the mismatched of parasitic capacitance in flash cell devices and layout for a reliable amplification by ramping up SRAM's VDD line and ramping down SRAM's VSS line.
    • 本发明公开了一种具有6T SRAM单元的10T NVSRAM单元,具有4T闪存单元和一个专用的基于闪存的充电器。 此外,还公开了在单元格布局的顶部和底部的两个相邻的8T NVSRAM单元之间具有共享的基于闪存的充电器的伪8T NVSRAM单元,以进一步将单元大小减小20%。 与12T NVSRAM单元的现有技术相反,上述两个优选实施例的存储操作使用具有闪存单元的DRAM状电荷感测方案,其被配置为由基于闪存的充电器确保的电压跟随器以获得最终的&Dgr; 每个SRAM单元的Q和QB节点的VQ-QB> 0.2V,以覆盖闪存单元器件中的所有寄生电容失配,并通过升高SRAM的VDD线并降低SRAM的VSS线来布置可靠的放大。
    • 4. 发明授权
    • NOR-based BCAM/TCAM cell and array with NAND scalability
    • 基于NOR的BCAM / TCAM单元和具有NAND可扩展性的阵列
    • US09001545B2
    • 2015-04-07
    • US14016089
    • 2013-08-31
    • Aplus Flash Technology, Inc.
    • Peter Wung Lee
    • G11C15/00G11C15/04G11C16/04
    • G11C15/046G11C15/04G11C16/0483
    • This invention discloses a 2T-string NOR-based CAM logic cell comprising two physical NAND cells connected in series with two horizontal WLs and one vertical BL and one vertical SL. Additionally, a sector of NOR-based CAM logic cell array is configured with N vertical cell strings each including M 2T-string NOR-based CAM logic cells connected in parallel sharing a local vertical SL and one dedicated vertical ML as an Operand word vertical page. Each 2T-string NOR-based CAM logic cell can be either a binary or ternary CAM cell associated with two or three physical states assigned to NAND cells' Vt levels for defining CAM logic states. Logic match of M-logic-bit inputs is found for at least one vertical page if the corresponding M 2T-string NOR-based CAM logic cells are in non-conduction state, providing M times faster Compare performance over the NAND-based CAM and 2 time faster than SRAM-based CAM.
    • 本发明公开了一种基于2T串NOR的CAM逻辑单​​元,其包括与两个水平WL和一个垂直BL和一个垂直SL串联连接的两个物理NAND单元。 另外,NOR型CAM逻辑单​​元阵列的扇区被配置有N个垂直单元串,每个垂直单元串包括并行连接的M 2T串NOR基CAM逻辑单​​元,共享一个本地垂直SL和一个专用垂直ML作为操作数字垂直页 。 每个2T字符串的基于NOR的CAM逻辑单​​元可以是与分配给NAND单元的Vt级别的两个或三个物理状态相关联的二进制或三元CAM单元,用于定义CAM逻辑状态。 如果对应的M 2T串NOR型CAM逻辑单​​元处于非导通状态,则可以为至少一个垂直页面找到M逻辑位输入的逻辑匹配,提供比基于NAND的CAM提供M倍快比较性能, 比基于SRAM的CAM快2倍。
    • 5. 发明授权
    • Partial/full array/block erase for 2D/3D hierarchical NAND
    • 2D / 3D分层NAND的部分/全阵列/块擦除
    • US09595319B2
    • 2017-03-14
    • US15137284
    • 2016-04-25
    • Peter Wung Lee
    • Peter Wung Lee
    • G11C11/56G11C16/04G11C16/08H01L27/115
    • G11C11/5635G11C11/5628G11C16/0483G11C16/08G11C16/16G11C16/24G11C16/3418G11C16/3445H01L27/11556H01L27/11582
    • A novel 2D/3D hierarchical-BL NAND array with at least one plane on independent Psubstrate comprising a plurality of LG groups respectively associated with a plurality of local bit lines (LBLs) laid at a level below a plurality of broken or non-broken global bit lines (GBLs) connected to Page Buffer. Each LG group includes multiple blocks and connects an independent power supply line to each of the plurality of LBLs. Each block including N-bit 2D/3D NAND strings each with S cells connected in series and terminated by two string-select devices and coupled to a common source line. In particular, random-size partial-block WLs are selected from each block of randomly selected LG groups of one plane of the 2D/3D NAND array for erase at the same time with border WLs being optionally preread and program into another plane of the 2D/3D NAND array or optionally saved off-chip and wrote back for data security.
    • 一种新颖的2D / 3D分层BL NAND阵列,其独立的基板上具有至少一个平面,包括分别与多个局部位线(LBL)相关联的多个LG组,所述多个局部位线布置在低于多个破碎或非断开全局 连接到页面缓冲区的位线(GBL)。 每个LG组包括多个块,并且将独立电源线连接到多个LBL中的每一个。 每个块包括N位2D / 3D NAND串,每个NAND串都具有串联连接的S个单元,并由两个串选择器件终止并耦合到公共源极线。 特别地,随机大小的部分块WL从2D / 3D NAND阵列的一个平面的随机选择的LG组的每个块中选择同时进行擦除,边界WL可选地被预读,并且编程到2D的另一个平面 / 3D NAND阵列或可选地保存在片外,并回写数据安全。
    • 7. 发明授权
    • Low disturbance, power-consumption, and latency in NAND read and program-verify operations
    • NAND读取和程序验证操作中的低干扰,功耗和延迟
    • US09183940B2
    • 2015-11-10
    • US14283209
    • 2014-05-20
    • Peter Wung Lee
    • Peter Wung Lee
    • G11C16/04G11C16/26G11C16/10G11C16/34G11C11/56
    • G11C16/26G11C11/5628G11C16/0483G11C16/10G11C16/3418G11C2211/5641
    • A HiNAND array with a hierarchical-BL scheme configured to divide a large global bit line (GBL) capacitance into J number of small local bit line (LBL) capacitances for reducing bit line precharge voltage and discharge time to achieve faster Read and Program-Verify speed, lower power consumption, lower latency, and lower word line disturbance for a reliable DRAM-like latch sensing. A reduced precharge voltage can be increased by M-fold (M≧2) using a Multiplier between each bitline and each Latch sense amplifier (SA). Between each Multiplier and each Latch SA, there is a Connector with two optional designs for either fully passing a sense voltage to the Latch SA with a same-polarity and value or reversing the polarity the sensing voltage with additional amplification. The Latch SA is configured to transfer stored threshold states of a memory cell into a bit of a page buffer.
    • 具有分层BL方案的HiNAND阵列被配置为将大的全局位线(GBL)电容分成J个小的局部位线(LBL)电容,以减少位线预充电电压和放电时间,以实现更快的读取和编程验证 速度,更低的功耗,更低的延迟和更低的字线干扰,以实现可靠的类DRAM锁存检测。 使用每个位线和每个锁存读出放大器(SA)之间的乘数,可以减小预充电电压M倍(M≥2)。 在每个乘法器和每个锁存器SA之间,具有两个可选设计的连接器,用于将具有相同极性和值的Latch SA的感测电压完全传递,或者通过附加放大来反转感测电压的极性。 Latch SA被配置为将存储器单元的存储的阈值状态传送到页缓冲器的位中。
    • 8. 发明授权
    • On-chip HV and LV capacitors acting as the second back-up supplies for NVSRAM auto-store operation
    • 作为NVSRAM自动存储操作的第二个备用电源的片上HV和LV电容
    • US09001583B2
    • 2015-04-07
    • US14053549
    • 2013-10-14
    • Aplus Flash Technology, Inc
    • Peter Wung LeeHsing-Ya Tsao
    • G11C11/34G11C16/30G11C5/14G11C14/00G11C16/12G11C16/22
    • G11C16/30G11C5/141G11C14/0063G11C16/12G11C16/22
    • Two on-chip capacitors including one HV capacitor VPPcap and one LV VCC capacitor VCCcap are built over a NVSRAM memory chip as a back-up second power supplies for each NVSRAM cell, regardless of 1-poly, 2-poly, PMOS or NMOS flash cell structures therein. The on-chip HV and LV capacitors are preferably made from one or more MIM or MIP layers for achieving required capacitance. A simplified VCC power system circuit without a need of a State machine designed for performing only one NVSRAM Program operation without Erase operations is proposed for initiating NVSRAM's Auto-Store operation without using any off-chip Vbat and Vcap. During the Auto-Store operation, all HV pumps and oscillators associated with the two on-chip capacitors are shut off once VCC voltage drop is detected by a VCC detector to be below 80% of regular VDD level.
    • 两个片上电容器包括一个HV电容器VPPcap和一个LV VCC电容器VCCcap,构成NVSRAM存储器芯片,作为每个NVSRAM单元的备用第二个电源,无论1-poly,2-poly,PMOS或NMOS闪存 其中的细胞结构。 片上HV和LV电容器优选地由用于实现所需电容的一个或多个MIM或MIP层制成。 提出了一种简化的VCC电源系统电路,不需要设计用于仅执行一个NVSRAM编程操作而不进行擦除操作的状态机,用于启动NVSRAM的自动存储操作,而不使用任何片外Vbat和Vcap。 在自动存储操作期间,一旦VCC检测器检测到VCC电压降低到正常VDD电平的80%,则与两个片上电容器相关的所有HV泵和振荡器都将被关闭。