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1. 发明授权

US08736792B2 Viewing-angle-enhancing film for liquid crystal display device, protective film with viewing-angle-enhancing-function, and liquid crystal display device 有权
标题翻译：用于液晶显示装置的视角增强膜，具有视角增强功能的保护膜和液晶显示装置
公开(公告)号：US08736792B2
公开(公告)日：2014-05-27
申请号：US13497482
申请日：2010-10-13
申请人： Katsuaki Kuze , Kenji Kawai , Kazumoto Imai , Akihumi Yasui , Akira Matsuda , Masao Kochi
发明人： Katsuaki Kuze , Kenji Kawai , Kazumoto Imai , Akihumi Yasui , Akira Matsuda , Masao Kochi
IPC分类号： G02F1/1335
CPC分类号： G02B5/045 , G02B5/0231 , G02B5/0257 , G02B5/0273 , G02B6/0053 , G02F1/133504
摘要： To provide a viewing-angle-enhancing film which is set in a liquid crystal display device at a position nearer to an observer than the position of a liquid crystal layer in the device, and which attains, at a high level, the compatibility of being enhanced in viewing angle with a decrease in the darkening of images at the time of observing the screen from the front thereof. A viewing-angle-enhancing film which is set in a liquid crystal display device at a position nearer to an observer than the position of a liquid crystal layer in the device, and simultaneously satisfies the following requirements (1) to (3): (1) the film has a parallel ray transmittance of 5 to 90%; (2) the film has a diffusivity (A) of 1 to 20 degrees in its main diffusion direction; and (3) the film has a diffusivity ratio of 0.25 to 15% in the main diffusion direction.
摘要翻译：为了提供一种视角增强膜，其设置在液晶显示装置中比装置中的液晶层的位置更靠近观察者的位置，并且高水平地实现了在从其前方观察屏幕时图像的变暗减小而观看角度增强。在液晶显示装置中，在比装置中的液晶层位置更靠近观察者的位置设置可视角增强膜，同时满足以下要求（1）〜（3）：（ 1）膜的平行光线透射率为5〜90％; （2）膜的主扩散方向的扩散度（A）为1〜20度; （3）膜的主扩散方向的扩散率为0.25〜15％。

2. 发明授权

US07985485B2 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil 失效
标题翻译：铜箔用于高频电路，生产方法及其生产设备，以及使用铜箔的高频电路
公开(公告)号：US07985485B2
公开(公告)日：2011-07-26
申请号：US12556410
申请日：2009-09-09
申请人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B32B15/20 , C25D1/04 , C25D7/06
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

3. 发明授权

US07794578B2 Method for preparing a circuit board material having a conductive base and a resistance layer 有权
标题翻译：制备具有导电基底和电阻层的电路板材料的方法
公开(公告)号：US07794578B2
公开(公告)日：2010-09-14
申请号：US10719020
申请日：2003-11-24
申请人： Akira Matsuda , Yuuji Suzuki , Hideo Otsuka , Yuuki Kikuchi , Sadao Matsumoto
发明人： Akira Matsuda , Yuuji Suzuki , Hideo Otsuka , Yuuki Kikuchi , Sadao Matsumoto
IPC分类号： C25D3/56
CPC分类号： H05K1/167 , C25D3/562 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723 , Y10T428/12944
摘要： A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.
摘要翻译：一种镀浴，其能够在导电性基体的粗糙化表面上形成具有均匀厚度分布的电阻层，包括镍离子和氨基磺酸或其盐作为必要成分，以及至少一种磷酸，亚磷酸，次磷酸，及其盐; 具有电阻稳定的薄电阻层的导电性基材和使用该导电性基材的电阻电路基板材料。

4. 发明申请

US20090324988A1 COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL 失效
标题翻译：用于高频电路的铜箔，用于生产它们的生产方法和装置以及使用铜箔的高频电路
公开(公告)号：US20090324988A1
公开(公告)日：2009-12-31
申请号：US12556410
申请日：2009-09-09
申请人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B32B15/04 , B21C37/02 , C25D17/00 , C25D5/00
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

5. 发明授权

US07164556B2 Magnetic disk device and magnetic head slider 有权
标题翻译：磁盘装置和磁头滑块
公开(公告)号：US07164556B2
公开(公告)日：2007-01-16
申请号：US11201225
申请日：2005-08-11
申请人： Hidekazu Kohira , Masaaki Matsumoto , Hideaki Tanaka , Teruyoshi Higashiya , Kiyoshi Hashimoto , Akira Matsuda , Takanori Yamazaki
发明人： Hidekazu Kohira , Masaaki Matsumoto , Hideaki Tanaka , Teruyoshi Higashiya , Kiyoshi Hashimoto , Akira Matsuda , Takanori Yamazaki
IPC分类号： G11B5/60
CPC分类号： G11B21/21 , G11B5/012 , G11B5/6082 , G11B33/14
摘要： A magnetic head slider includes a magnetic head mounting surface, a slider rail surface, a step air bearing surface, and a negative pressure groove. The magnetic head mounting surface is arranged in a center area with respect to a width of the slider near an air flow-out edge on the slider and mounts a magnetic head. The slider rail surface has a first depth from the magnetic head mounting surface and its width on an air flow-in side for the magnetic head is wider that its width on an air flow-out side for the magnetic head. The step air bearing surface is formed on an air flow-in side of the slider rail surface and has a second depth from the slider rail surface. The negative-pressure groove which formed on an air flow-in side of the step air bearing surface and has a third depth from the step air bearing surface.
摘要翻译：磁头滑动器包括磁头安装表面，滑块轨道表面，台阶空气轴承表面和负压槽。磁头安装表面相对于滑动器的宽度设置在滑块附近的空气流出边缘的中心区域，并且安装磁头。滑块导轨表面具有从磁头安装表面的第一深度，并且其磁头的空气流入侧的宽度宽于其在磁头的空气流出侧的宽度。台阶空气轴承表面形成在滑块轨道表面的空气流入侧，并且具有从滑块轨道表面的第二深度。负压槽形成在台阶空气轴承面的空气流入侧，并且具有从台阶空气轴承面的第三深度。

6. 发明申请

US20060147742A1 Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil 审中-公开
标题翻译：复合铜箔，其生产方法和使用所述复合铜箔的高频传输电路
公开(公告)号：US20060147742A1
公开(公告)日：2006-07-06
申请号：US10543917
申请日：2004-02-04
申请人： Akira Matsuda , Yuuji Suzuki , Akitoshi Suzuki
发明人： Akira Matsuda , Yuuji Suzuki , Akitoshi Suzuki
IPC分类号： B32B3/00 , C21D1/70 , B21C37/00 , B32B15/01 , B32B15/20 , B23P9/00
CPC分类号： H05K1/09 , C25D7/06 , H05K2201/0355 , Y10T428/12438 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/24917
摘要： A composite copper foil excellent in conductivity and surface shape, having high strength and able to be used for applications such as high frequency transmission circuits and a method of production of the same are provided. A composite copper foil characterized by having a copper foil on at least one surface of which a copper and/or silver smoothing layer is provided. Further, producing this by processing an ingot having a copper alloy to a foil having a desired thickness by rolling, then forming on at least one surface of the processed copper alloy foil a smoothing layer by copper plating and/or silver plating. Alternatively, producing this by processing an ingot having a copper alloy to a foil having a thickness of an intermediate size by rolling, forming on at least one surface of the foil a smoothing layer by copper plating and/or silver plating, then rolling the result to a foil having a desired thickness or applying heat treatment or applying heat treatment and rolling to thereby make the thickness of at least the copper and/or silver plating layer at the surface of the foil 0.01 μm or more. Further, a high frequency transmission circuit characterized by being prepared using the above composite copper foil or the composite copper foil produced by the above method of production.
摘要翻译：提供了导电性和表面形状优异，强度高且能够用于高频传输电路等的应用的复合铜箔及其制造方法。一种复合铜箔，其特征在于在至少一个表面上具有铜箔和/或银平滑层的铜箔。此外，通过将具有铜合金的锭加工成具有期望厚度的箔通过轧制来制造，然后通过镀铜和/或镀银在加工的铜合金箔的至少一个表面上形成平滑层。或者，通过将具有铜合金的锭加工成通过轧制具有中等尺寸的厚度的箔来制造，在箔的至少一个表面上通过镀铜和/或镀银形成平滑层，然后滚动结果到具有所需厚度的箔或施加热处理或施加热处理和轧制，从而使得至少铜箔和/或银镀层在箔表面上的厚度为0.01μm以上。此外，其特征在于，使用上述复合铜箔或通过上述制造方法制造的复合铜箔制备高频传输电路。

7. 发明申请

US20050048306A1 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board 失效
标题翻译：用载体生产超薄铜箔的方法，由其制造的载体的超薄铜箔，印刷电路板，多层印刷电路板和薄膜电路板上的芯片
公开(公告)号：US20050048306A1
公开(公告)日：2005-03-03
申请号：US10929471
申请日：2004-08-31
申请人： Yuuji Suzuki , Akira Matsuda
发明人： Yuuji Suzuki , Akira Matsuda
IPC分类号： H05K1/09 , B32B15/20 , C25D1/04 , C25D7/00 , C25D7/06 , H05K3/02 , H05K3/38 , H05K3/46 , B32B3/00
CPC分类号： C25D1/04 , H01L2924/0002 , H05K3/025 , H05K3/384 , H05K2201/0355 , H05K2201/0723 , Y10T428/12028 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12778 , Y10T428/12806 , H01L2924/00
摘要： An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.
摘要翻译：本发明的目的是制造具有针孔小，表面粗糙度小，厚度小于5μm的载体的超薄铜箔，制造箔的制造方法通过使用具有载体的超薄铜箔制造精细图案的印刷电路板，多层印刷电路板和薄膜电路板上的芯片。本发明提供一种具有载体的超薄铜箔，其通过在载体铜箔的表面上依次层叠剥离层和超薄铜箔而制造，该载体铜箔的表面平滑，使得至少一个侧面的平均表面粗糙度通过化学抛光，电化学溶解或平滑电镀处理方法独立地组合了两个或更多个，或进一步组合机械抛光，Rz为0.01〜2.0μm。

8. 发明授权

US06817802B2 Writing instrument 有权
标题翻译：书写工具
公开(公告)号：US06817802B2
公开(公告)日：2004-11-16
申请号：US10464119
申请日：2003-06-18
申请人： Ichiro Nishitani , Akira Matsuda , Masatoshi Yashima
发明人： Ichiro Nishitani , Akira Matsuda , Masatoshi Yashima
IPC分类号： B43K518
CPC分类号： B43K5/1845
摘要： A writing instrument adapted, responsive to a pressure axially applied to a pen core, to supply ink in an ink chamber to the pen core, and includes a valve seat disposed between the ink chamber and the pen core, a valve body operable to be selectively moved between a close position where the valve body is in contact with the valve seat to isolate the pen core from the ink chamber and an open position where the valve body is spaced apart from the valve seat to communicate the pen core with the ink chamber, a pressing spring for biasing the valve body toward the front end of a pen shaft, and a support member for supporting the valve body and the pressing spring to allow the valve body to be moved in the axial direction. The support member includes a communication channel for communicating the inner space thereof with the ink chamber. The valve body has a channel control portion for allowing the ink flow through the communication channel to be more restricted when the valve body is in the close position that when it is in the open position. The writing instrument can reduce the deposit of ink pigments around the valve body to prevent occurrence of defect in the operation of the valve body.
摘要翻译：一种书写工具，其适于响应于轴向施加到笔芯的压力，将墨室中的墨供应到笔芯，并且包括设置在墨室和笔芯之间的阀座，阀体可操作以选择性地在阀体与阀座接触的关闭位置之间移动以将笔芯与墨水室隔离，以及阀体与阀座间隔开以将笔芯与墨水室连通的打开位置，用于将阀体朝向笔轴的前端偏压的按压弹簧，以及用于支撑阀体和按压弹簧以使阀体沿轴向移动的支撑构件。支撑构件包括用于使其内部空间与墨水室连通的连通通道。阀体具有通道控制部分，用于当阀体处于处于打开位置的关闭位置时允许油墨流过连通通道更受限制。书写工具可以减少油墨颜料在阀体周围的沉积，以防止阀体操作中出现缺陷。

9. 发明授权

US06770383B2 Plated material, method of producing same, and electrical/electronic part using same 有权
标题翻译：电镀材料，其制造方法以及使用其的电气/电子部件
公开(公告)号：US06770383B2
公开(公告)日：2004-08-03
申请号：US10247319
申请日：2002-09-18
申请人： Hitoshi Tanaka , Akira Matsuda , Satoshi Suzuki , Morimasa Tanimoto
发明人： Hitoshi Tanaka , Akira Matsuda , Satoshi Suzuki , Morimasa Tanimoto
IPC分类号： H01R1303
CPC分类号： B32B15/01 , C23C26/00 , C23C28/021 , C23C28/023 , C23C28/028 , H01R13/03 , Y10S428/929 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating of Cu or a Cu alloy, and a top-coating of Sn or an Sn alloy, the undercoating, the intermediate coating and the top-coating being formed on a surface of an electrically conductive base in this order, and the thickness of the top-coating is 1.9 times or more the thickness of the intermediate coating.
摘要翻译：提供具有高耐热性和良好的可插入性/可萃取性的电镀材料。电镀材料包括属于周期表第4族，第5族，第6族，第7族，第8族，第9族或第10族的金属中的任一种的底涂层或含有这些金属中的任一种作为主要成分的合金，Cu或Cu合金的中间涂层以及Sn或Sn合金的顶涂层，底涂层，中间涂层和顶涂层依次形成在导电基材的表面上，并且顶涂层的厚度为中间涂层厚度的1.9倍或更多。

10. 发明授权

US06294263B1 Polyamide laminated film 失效
标题翻译：聚酰胺层压膜
公开(公告)号：US06294263B1
公开(公告)日：2001-09-25
申请号：US09263988
申请日：1999-03-05
申请人： Haruo Okudaira , Akira Matsuda , Sinitiro Okumura , Kazumoto Imai , Tsutomu Oko
发明人： Haruo Okudaira , Akira Matsuda , Sinitiro Okumura , Kazumoto Imai , Tsutomu Oko
IPC分类号： B32B2708
CPC分类号： B32B27/34 , Y10S428/91 , Y10T428/31725 , Y10T428/31728 , Y10T428/31732 , Y10T428/31739 , Y10T428/31743 , Y10T428/3175
摘要： The present invention is to provide a polyamide laminated film comprising a resin layer A and a resin layer B formed on at least one surface of the resin layer A, the resin layer A being composed mainly of a m-xylylene group-containing polyamide polymer (a-1) which is one prepared from monomer components containing a xylylenediamine compound as a main diamine component and an &agr;,&ohgr;-aliphatic dicarboxylic acid having from 6 to 12 carbon atoms as a main dicarboxylic acid component, the xylylenediamine compound being m-xylylenediamine alone or a mixture of m-xylylenediamine and p-xylylenediamine, and the resin layer B being mainly composed of a mixed polymer (b-3) which is a mixture of from 99 to 80% by weight of an aliphatic polyamide (b-1) and from 1 to 20% by weight of an elastomer (b-2). The laminated film is good in a gas barrier property and also in a flexural fatigue resistance and a transparency.
摘要翻译：本发明提供一种聚酰胺层合膜，其包含树脂层A和形成在树脂层A的至少一个表面上的树脂层B，树脂层A主要由含间亚二甲苯基的聚酰胺聚合物组成 a-1），其是含有作为主要二胺组分的苯二甲胺化合物和具有6-12个碳原子的α，ω-脂肪族二羧酸作为主要二羧酸组分的单体成分，所述苯二甲胺化合物是间苯二甲胺单独或间苯二甲胺和对苯二甲胺的混合物，树脂层B主要由混合聚合物（b-3）组成，该混合聚合物是以99〜80重量％的脂肪族聚酰胺（b-1）和1〜20重量％的弹性体（b-2）。该层压膜具有良好的阻气性和抗弯曲疲劳性以及透明性。

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