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1. 发明申请

US20180323438A1 ELECTROLYTIC COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPRISING THE SAME, AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20180323438A1
公开(公告)日：2018-11-08
申请号：US15773046
申请日：2016-10-13
申请人： KCF Technologies Co., Ltd.
发明人： Seung Min KIM
IPC分类号： H01M4/66 , C25D1/04
CPC分类号： H01M4/667 , C25D1/04 , C25D7/06 , H01M4/13 , H01M4/66 , H01M4/661 , H01M10/0525 , H01M2004/027
摘要： Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the invention has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.

2. 发明授权

US09425450B2 Stainless separator for fuel cell and method of manufacturing the same 有权
标题翻译：燃料电池用不锈钢分离器及其制造方法
公开(公告)号：US09425450B2
公开(公告)日：2016-08-23
申请号：US14700676
申请日：2015-04-30
申请人： HYUNDAI HYSCO
发明人： Yoo Taek Jeon , Kyeong Woo Chung
IPC分类号： H01M2/14 , C21D9/00 , C21D6/00 , C22C38/44 , C22C38/42 , C22C38/00 , H01M8/02 , C23C22/73 , C23C22/76 , C23C22/82 , C25D7/06 , C25D5/50
CPC分类号： H01M2/145 , C21D6/004 , C21D9/0068 , C22C38/008 , C22C38/42 , C22C38/44 , C23C8/04 , C23C8/08 , C23C8/22 , C23C8/26 , C23C14/0036 , C23C14/48 , C23C22/46 , C23C22/50 , C23C22/73 , C23C22/76 , C23C22/82 , C23G1/085 , C23G1/088 , C25D5/50 , C25D7/06 , C25D11/34 , H01M8/021 , H01M8/0228 , H01M2008/1095 , Y02E60/50 , Y02P70/56
摘要： A stainless steel separator for fuel cells and a method of manufacturing the same are disclosed. The method includes preparing a stainless steel sheet as a matrix, performing surface modification on a surface of the stainless steel sheet to form a Cr-rich passive film having a comparatively increased amount of Cr in a superficial layer of the stainless steel sheet by decreasing an amount of Fe in the superficial layer of the stainless steel sheet, and forming a coating layer on the surface of the surface-modified stainless steel sheet. The coating layer is one selected from a metal nitride layer (MNx), a metal/metal nitride layer (M/MNx), a metal carbide layer (MCy), and a metal boride layer (MBz) (where 0.5≦x≦1, 0.42≦y≦1, 0.5≦z≦2).
摘要翻译：公开了一种用于燃料电池的不锈钢隔板及其制造方法。该方法包括制备不锈钢板作为基体，在不锈钢板的表面上进行表面改性，以通过减少不锈钢板的表层而形成Cr含量相对较高的Cr的钝化膜在不锈钢板的表层中的Fe量，并在表面改性的不锈钢板的表面上形成涂层。涂层是选自金属氮化物层（MNx），金属/金属氮化物层（M / MNx），金属碳化物层（MCy）和金属硼化物层（MBz）（其中0.5≤x≤1 ，0.42≤y≤1,0.5≤z≤2）。

3. 发明申请

US20150008135A1 METHODS FOR THE IMPLEMENTATION OF NANOCRYSTALLINE AND AMORPHOUS METALS AND ALLOYS AS COATINGS 审中-公开
公开(公告)号：US20150008135A1
公开(公告)日：2015-01-08
申请号：US14496533
申请日：2014-09-25
申请人： Xtalic Corporation
发明人： Christopher A. Schuh , Alan C. Lund
IPC分类号： C25D5/04 , C25D7/06 , C25D3/56
CPC分类号： C25D5/04 , C25D3/56 , C25D3/562 , C25D5/18 , C25D7/06 , C25D7/0607 , C25D7/0614 , Y10T428/12014 , Y10T428/1216 , Y10T428/12174 , Y10T428/25 , Y10T428/31504
摘要： Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby.

4. 发明申请

US20140318973A1 ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPPER FOIL 审中-公开
标题翻译：电解铜箔和电解铜箔的生产方法
公开(公告)号：US20140318973A1
公开(公告)日：2014-10-30
申请号：US14009056
申请日：2012-03-28
申请人： Michiya Kohiki
发明人： Michiya Kohiki
IPC分类号： H01M4/66
CPC分类号： H01M4/661 , C25D1/04 , C25D5/48 , C25D7/06 , C25D11/38
摘要： The present invention provides an electrolytic copper foil that has a high normal tensile strength, a low decrease in tensile strength after a thermal history, and a low concentration of impurities in the copper foil and a method for producing the copper foil. Specifically, the electrolytic copper foil in which a sulfur concentration of the copper foil is not less than 10 ppm by mass but no more than 50 ppm by mass, wherein when lattices with a spacing of 10 nm in a STEM image observed with a scanning transmission electron microscope at a magnification of 1 million times are formed and intersections of each lattice are used as a measurement point for determining a sulfur concentration, there is a measurement point at which the sulfur concentration is higher as compared to the sulfur concentration of the copper foil.
摘要翻译：本发明提供一种电解铜箔，其具有高的正常拉伸强度，热历史后的拉伸强度的低降低和铜箔中的杂质浓度低，以及铜箔的制造方法。具体而言，铜箔的硫浓度为10质量ppm以上且50质量ppm以下的电解铜箔，其中，在扫描透射中观察到STEM图像中间隔为10nm的晶格形成1万倍的倍率的电子显微镜，使用各格子的交点作为测定硫浓度的测定点，与铜箔的硫浓度相比，存在硫浓度高的测定点。

5. 发明授权

US08715836B2 Surface-treated electro-deposited copper foil and method for manufacturing the same 有权
标题翻译：表面处理电沉积铜箔及其制造方法
公开(公告)号：US08715836B2
公开(公告)日：2014-05-06
申请号：US12282231
申请日：2007-03-09
申请人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Junshi Yoshioka , Jo Nishikawa , Takeo Taguchi
发明人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Junshi Yoshioka , Jo Nishikawa , Takeo Taguchi
IPC分类号： H01L27/108 , H01L29/76 , H01L29/94
CPC分类号： H05K3/384 , C25D1/04 , C25D3/38 , C25D5/16 , C25D5/18 , C25D5/48 , C25D7/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1476 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12882 , Y10T428/12903 , Y10T428/12993 , Y10T428/24355 , Y10T428/24917
摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.
摘要翻译：本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平，其中影响布线直线性能的波纹小，及其制造方法。为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解密度。

6. 发明申请

US20140061056A1 METHODS FOR THE IMPLEMENTATION OF NANOCRYSTALLINE AND AMORPHOUS METALS AND ALLOYS AS COATINGS 审中-公开
标题翻译：纳米晶和非晶态金属和合金作为涂层的实施方法
公开(公告)号：US20140061056A1
公开(公告)日：2014-03-06
申请号：US13959291
申请日：2013-08-05
申请人： Xtalic Corporation
发明人： Christopher A. Schuh , Alan C. Lund
IPC分类号： C25D3/56
CPC分类号： C25D5/04 , C25D3/56 , C25D3/562 , C25D5/18 , C25D7/06 , C25D7/0607 , C25D7/0614 , Y10T428/12014 , Y10T428/1216 , Y10T428/12174 , Y10T428/25 , Y10T428/31504
摘要： Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby.
摘要翻译：提供了使用纳米晶体或无定形金属或合金作为工业工艺涂层的方法。三，具体，这些方法已经详细说明了。其中一个优选实施例提供了一种用纳米晶体或无定形金属或合金的许多部件的高体积电沉积的方法，以及由此产生的部件。另一个优选的实施方案提供了一种在连续电沉积方法中应用纳米晶体或无定形涂层的方法以及由此产生的产品。本发明的另一个优选实施例提供了一种用于返修和/或重建部件及其制造的部件的方法。

7. 发明授权

US08486237B2 Process for continuous coating deposition and an apparatus for carrying out the process 失效
标题翻译：连续涂布沉积的方法和用于进行该方法的设备
公开(公告)号：US08486237B2
公开(公告)日：2013-07-16
申请号：US12579002
申请日：2009-10-14
申请人： Lingamaneni Rama Krishna , Nitin Pandurang Wasekar , Govindan Sundararajan
发明人： Lingamaneni Rama Krishna , Nitin Pandurang Wasekar , Govindan Sundararajan
IPC分类号： C25B9/00 , C25D17/00 , C25D5/00
CPC分类号： C25D7/06 , C25D11/00 , C25D11/005 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/26 , C25D11/30 , C25D11/32 , C25D11/34 , C25D17/02 , C25D21/12
摘要： An apparatus for continuously forming thin ceramic coatings on metal sheets, foils or wires. The apparatus has a reaction chamber, perforated nylon sheets, nylon bar guides, copper rods attached to a power supply, nylon collecting rods, and an inlet and an outlet. The reaction chamber is capable of containing an electrolytic solution. The copper rods are separately connected to the R, Y, or B phase of the power supply. Each phase is provided with two thyristors and the output of the thyristors is connected to the copper rods using current transformers. A process for continuously forming thin ceramic coatings on metal sheets, foils or wires is also provided.
摘要翻译：用于在金属板，箔或线上连续形成薄陶瓷涂层的装置。该装置具有反应室，穿孔尼龙片，尼龙条导向件，连接到电源的铜杆，尼龙收集杆以及入口和出口。反应室能够容纳电解液。铜棒分别连接到电源的R，Y或B相。每相设有两个晶闸管，晶闸管的输出端使用电流互感器与铜棒相连。还提供了在金属板，箔或线上连续形成薄陶瓷涂层的方法。

8. 发明授权

US07816015B2 Composite copper foil and method for production thereof 有权
标题翻译：复合铜箔及其制造方法
公开(公告)号：US07816015B2
公开(公告)日：2010-10-19
申请号：US11573059
申请日：2005-07-22
申请人： Yuushi Sato
发明人： Yuushi Sato
IPC分类号： B32B15/04 , C23D7/06
CPC分类号： C25D7/06 , C23C28/023 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455 , C25D1/04 , C25D3/38 , C25D3/562 , C25D5/10 , C25D5/18 , H05K3/025 , Y10T428/12438 , Y10T428/12458 , Y10T428/1259 , Y10T428/12611 , Y10T428/12833 , Y10T428/12903
摘要： A composite copper foil having three layers of a supporting metal layer, an exfoliating layer and a thin copper layer, wherein one surface of the exfoliating layer comprises, as a main component, an alloy of tungsten or an alloy of molybdenum and the other surface thereof comprises, as a main component, a metal oxide containing tungsten or a metal oxide containing molybdenum. The composite copper foil is free from undesired swelling, separation or falling of the supporting metal layer during heating and working at a high temperature, and the supporting metal layer can be exfoliated from the thin copper layer with case, after the heating and the working.
摘要翻译：具有三层支撑金属层，剥离层和薄铜层的复合铜箔，其中剥离层的一个表面作为主要成分包含钨或钼的合金与其另一表面的合金作为主要成分，含有含有钨或含有钼的金属氧化物的金属氧化物。复合铜箔在加热和高温加工期间不会有不希望的支撑金属层的膨胀，分离或掉落，并且在加热和加工之后，支撑金属层可以从薄的铜层剥离。

9. 发明申请

US20080280159A1 Copper Foil and Method of Manufacturing the Same 失效
标题翻译：铜箔及其制造方法
公开(公告)号：US20080280159A1
公开(公告)日：2008-11-13
申请号：US11547517
申请日：2005-03-31
申请人： Kenichiro Iwakiri , Seiji Nagatani
发明人： Kenichiro Iwakiri , Seiji Nagatani
IPC分类号： B23P9/00 , C25F3/00
CPC分类号： C25D7/06 , H05K3/382 , H05K2201/0355 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291 , Y10T428/12993
摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S) (1) where Rz(S) is a numerical value represented by μm.
摘要翻译：本发明的目的是为了提供铜箔的高粘合性，即使铜箔的结节面的粗糙度R z较低，也可以提供铜箔的制造方法。为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得，通过针式粗糙度计测量的铜箔样品S的结节表面的尺寸表面积A（S）和粗糙度R z（S）具有等式（1），并且粗糙度R z（S）为1.0μm〜3.0μm，<？在线式描述=“In-line Formulas”end =“lead”？ > 0.5xR z（S）+0.5 <= C（S）（1）<？在线公式描述=“在线公式”end =“tail”？>其中R < （S）是由mum表示的数值。

10. 发明申请

US20070212566A1 COMPOSITE COPPER FOIL AND METHOD FOR PRODUCTION THEREOF 有权
标题翻译：复合铜箔及其生产方法
公开(公告)号：US20070212566A1
公开(公告)日：2007-09-13
申请号：US11573059
申请日：2005-07-22
申请人： Yuushi Sato
发明人： Yuushi Sato
IPC分类号： C25D7/06
CPC分类号： C25D7/06 , C23C28/023 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455 , C25D1/04 , C25D3/38 , C25D3/562 , C25D5/10 , C25D5/18 , H05K3/025 , Y10T428/12438 , Y10T428/12458 , Y10T428/1259 , Y10T428/12611 , Y10T428/12833 , Y10T428/12903
摘要： In a composite copper foil which comprises three layers comprising a support metal layer, a release layer lying on the support metal layer, and a thin copper layer lying on the release layer, the release layer has one surface formed mainly of a tungsten alloy or a molybdenum alloy and the other surface formed mainly of a metal oxide containing tungsten or a metal oxide containing molybdenum. The composite copper foil is free from the accidental blister, peeling and falling off of the support metal layer during heating processing at high temperatures, but allows the support metal layer to be peeled off easily from the thin copper layer after processing with heat.
摘要翻译：在包含支撑金属层，位于支撑金属层上的剥离层和位于剥离层上的薄铜层的复合铜箔中，剥离层具有主要由钨合金或钼合金，另一个表面主要由含有钨的金属氧化物或含有钼的金属氧化物形成。复合铜箔在高温加热处理期间没有意外的起泡，剥离和脱落的支撑金属层，但是在热处理之后允许支撑金属层容易地从薄的铜层剥离。

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