专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08946866B2 Microelectronic substrate having removable edge extension element 有权
标题翻译：具有可移除边缘延伸元件的微电子基板
公开(公告)号：US08946866B2
公开(公告)日：2015-02-03
申请号：US13490239
申请日：2012-06-06
申请人： Charles W. Koburger, III , Steven J. Holmes , David V. Horak , Kurt R. Kimmel , Karen E. Petrillo , Christopher F. Robinson
发明人： Charles W. Koburger, III , Steven J. Holmes , David V. Horak , Kurt R. Kimmel , Karen E. Petrillo , Christopher F. Robinson
IPC分类号： H01L29/06 , G03F7/20
CPC分类号： G03F7/70691 , G03F7/70341 , G03F7/70808
摘要： An article including a microelectronic substrate is provided as an article usable during the processing of the microelectronic substrate. Such article includes a microelectronic substrate having a front surface, a rear surface opposite the front surface and a peripheral edge at boundaries of the front and rear surfaces. The front surface is a major surface of the article. A removable annular edge extension element having a front surface, a rear surface and an inner edge extending between the front and rear surfaces has the inner edge joined to the peripheral edge of the microelectronic substrate. In such way, a continuous surface is formed which includes the front surface of the edge extension element extending laterally from the peripheral edge of the microelectronic substrate and the front surface of the microelectronic substrate, the continuous surface being substantially co-planar and flat where the peripheral edge is joined to the inner edge.
摘要翻译：提供包括微电子衬底的制品作为在微电子衬底的处理期间可用的制品。这种物品包括具有前表面，与前表面相对的后表面和在前表面和后表面的边界处的周边边缘的微电子基底。前表面是物品的主要表面。具有前表面，后表面和在前表面和后表面之间延伸的内边缘的可拆卸的环形边缘延伸元件具有接合到微电子基板的周边边缘的内边缘。以这种方式，形成连续表面，其包括边缘延伸元件的前表面，该边缘延伸元件从微电子基底的周边边缘和微电子基底的前表面横向延伸，连续表面基本上共平面且平坦，周缘连接到内边缘。

2. 发明申请

US20140061930A1 OVERLAY-TOLERANT VIA MASK AND REACTIVE ION ETCH (RIE) TECHNIQUE 有权
标题翻译：通过掩蔽和反应离子蚀刻（RIE）技术的超耐性
公开(公告)号：US20140061930A1
公开(公告)日：2014-03-06
申请号：US13604660
申请日：2012-09-06
申请人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
发明人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L23/528 , H01L21/31144 , H01L21/76807 , H01L21/76816 , H01L21/76831 , H01L23/5226 , H01L2924/0002 , H01L2924/0001 , H01L2924/00
摘要： A method is provided that includes first etching a substrate according to a first mask. The first etching forms a first etch feature in the substrate to a first depth. The first etching also forms a sliver opening in the substrate. The sliver opening may then be filled with a fill material. A second mask may be formed by removing a portion of the first mask. The substrate exposed by the second mask may be etched with a second etch, in which the second etching is selective to the fill material. The second etching extends the first etch feature to a second depth that is greater than the first depth, and the second etch forms a second etch feature. The first etch feature and the second etch feature may then be filled with a conductive metal.
摘要翻译：提供了一种方法，其包括首先根据第一掩模蚀刻衬底。第一蚀刻在衬底中形成第一深度的第一蚀刻特征。第一蚀刻还在衬底中形成条条开口。然后可以用填充材料填充条子开口。可以通过去除第一掩模的一部分来形成第二掩模。可以用第二蚀刻蚀刻由第二掩模曝光的衬底，其中第二蚀刻对填充材料是选择性的。第二蚀刻将第一蚀刻特征延伸到大于第一深度的第二深度，并且第二蚀刻形成第二蚀刻特征。然后可以用导电金属填充第一蚀刻特征和第二蚀刻特征。

3. 发明授权

US08609534B2 Electrical fuse structure and method of fabricating same 有权
标题翻译：电熔丝结构及其制造方法
公开(公告)号：US08609534B2
公开(公告)日：2013-12-17
申请号：US12890941
申请日：2010-09-27
申请人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
发明人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
IPC分类号： H01L21/4763
CPC分类号： H01L23/5256 , H01L21/76805 , H01L21/76807 , H01L21/76831 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A high programming efficiency electrical fuse is provided utilizing a dual damascene structure located atop a metal layer. The dual damascene structure includes a patterned dielectric material having a line opening located above and connected to an underlying via opening. The via opening is located atop and is connected to the metal layer. The dual damascene structure also includes a conductive feature within the line opening and the via opening. Dielectric spacers are also present within the line opening and the via opening. The dielectric spacers are present on vertical sidewalls of the patterned dielectric material and separate the conductive feature from the patterned dielectric material. The presence of the dielectric spacers within the line opening and the via opening reduces the area in which the conductive feature is formed. As such, a high programming efficiency electrical fuse is provided in which space is saved.
摘要翻译：使用位于金属层顶部的双镶嵌结构来提供高编程效率电熔丝。双镶嵌结构包括图案化电介质材料，其具有位于下面的通孔开口上方并连接到下面的通孔开口的线路开口。通孔开口位于顶部并连接到金属层。双镶嵌结构还包括线路开口和通孔开口内的导电特征。电介质间隔物也存在于线路开口和通孔开口内。介电间隔物存在于图案化电介质材料的垂直侧壁上，并将导电特征与图案化电介质材料分开。在线路开口和通孔开口内的电介质间隔物的存在减少了形成导电特征的区域。因此，提供了节省空间的高编程效率电熔丝。

4. 发明申请

US20130328208A1 DUAL DAMASCENE DUAL ALIGNMENT INTERCONNECT SCHEME 有权
标题翻译：双重对等双向对联方案
公开(公告)号：US20130328208A1
公开(公告)日：2013-12-12
申请号：US13490542
申请日：2012-06-07
申请人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
发明人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
IPC分类号： H01L23/48 , H01L21/28
CPC分类号： H01L21/76897 , H01L21/76807 , H01L21/76808 , H01L21/76811 , H01L21/76819 , H01L21/76831 , H01L21/76832 , H01L21/76834 , H01L21/76883 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A stack of a first metal line and a first dielectric cap material portion is formed within a line trench of first dielectric material layer. A second dielectric material layer is formed thereafter. A line trench extending between the top surface and the bottom surface of the second dielectric material layer is patterned. A photoresist layer is applied over the second dielectric material layer and patterned with a via pattern. An underlying portion of the first dielectric cap material is removed by an etch selective to the dielectric materials of the first and second dielectric material layer to form a via cavity that is laterally confined along the widthwise direction of the line trench and along the widthwise direction of the first metal line. A dual damascene line and via structure is formed, which includes a via structure that is laterally confined along two independent horizontal directions.
摘要翻译：在第一介电材料层的线沟槽内形成第一金属线和第一介电帽材料部分的堆叠。之后形成第二电介质材料层。在第二介电材料层的顶表面和底表面之间延伸的线沟槽被图案化。将光致抗蚀剂层施加在第二介电材料层上并用通孔图案构图。通过对第一和第二介电材料层的介电材料的选择性蚀刻来去除第一电介质盖材料的下部，以形成沿着线沟槽的宽度方向横向限制并沿着宽度方向的第一条金属线。形成双镶嵌线和通孔结构，其包括沿着两个独立的水平方向横向限制的通孔结构。

5. 发明授权

US08492270B2 Structure for nano-scale metallization and method for fabricating same 有权
标题翻译：纳米级金属化结构及其制造方法
公开(公告)号：US08492270B2
公开(公告)日：2013-07-23
申请号：US12885665
申请日：2010-09-20
申请人： Shom Ponoth , David V Horak , Elbert E Huang , Sivananda K Kanakasabapathy , Charles W Koburger, III , Chih-Chao Yang
发明人： Shom Ponoth , David V Horak , Elbert E Huang , Sivananda K Kanakasabapathy , Charles W Koburger, III , Chih-Chao Yang
IPC分类号： H01L21/4763
CPC分类号： H01L23/53266 , H01L21/32139 , H01L21/76885 , H01L21/76897 , H01L23/5283 , H01L2924/0002 , H01L2924/00
摘要： A method for forming structure aligned with features underlying an opaque layer is provided for an interconnect structure, such as an integrated circuit. In one embodiment, the method includes forming an opaque layer over a first layer, the first layer having a surface topography that maps to at least one feature therein, wherein the opaque layer is formed such that the surface topography is visible over the opaque layer. A second feature is positioned and formed in the opaque layer by reference to such surface topography.
摘要翻译：为诸如集成电路的互连结构提供了用于形成与不透明层下面的特征对准的结构的方法。在一个实施例中，该方法包括在第一层上形成不透明层，第一层具有映射到其中的至少一个特征的表面形貌，其中不透明层被形成为使得表面形貌在不透明层上可见。通过参考这种表面形貌，第二特征被定位并形成在不透明层中。

6. 发明申请

US20130112462A1 Metal Alloy Cap Integration 审中-公开
标题翻译：金属合金盖整合
公开(公告)号：US20130112462A1
公开(公告)日：2013-05-09
申请号：US13290557
申请日：2011-11-07
申请人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
发明人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
IPC分类号： H05K1/09 , H05K3/00
CPC分类号： H01L23/53238 , H01L21/76834 , H01L21/76847 , H01L21/76849 , H01L21/76877 , H01L21/76882 , H01L23/5329 , H01L23/53295 , H01L2924/0002 , Y10T29/49124 , H01L2924/00
摘要： A metal interconnect structure, which includes metal alloy capping layers, and a method of manufacturing the same. The originally deposited alloy capping layer element within the interconnect features will diffuse into and segregate onto top surface of the metal interconnect. The metal alloy capping material is deposited on a reflowed copper surface and is not physically in contact with sidewalls of the interconnect features. Thus, there is a reduction in electrical resistivity impact from residual alloy elements in the interconnect structure. That is, there is a reduction, of alloy elements inside the features of the metal interconnect structure. The metal interconnect structure includes a dielectric layer with a recessed line, a liner material on sidewalls, a copper material, an alloy cap, and a capping layer.
摘要翻译：包括金属合金覆盖层的金属互连结构及其制造方法。互连特征内的原始沉积的合金覆盖层元件将扩散到并分离到金属互连的顶表面上。金属合金覆盖材料沉积在回流铜表面上，并且不物理地与互连特征的侧壁接触。因此，互连结构中的残余合金元素的电阻率冲击降低。也就是说，在金属互连结构的特征内部存在合金元素的减少。金属互连结构包括具有凹陷线的介电层，侧壁上的衬垫材料，铜材料，合金盖和覆盖层。

7. 发明申请

US20130069161A1 INTEGRATED CIRCUIT STRUCTURE HAVING SELECTIVELY FORMED METAL CAP 有权
标题翻译：具有选择性金属盖的集成电路结构
公开(公告)号：US20130069161A1
公开(公告)日：2013-03-21
申请号：US13233064
申请日：2011-09-15
申请人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
发明人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
IPC分类号： H01L21/768 , H01L23/48
CPC分类号： H01L29/42372 , H01L21/28247 , H01L21/76834 , H01L21/7685 , H01L21/76856 , H01L21/76888 , H01L21/76897 , H01L29/495 , H01L29/517 , H01L29/78
摘要： Methods of forming an integrated circuit structure utilizing a selectively formed and at least partially oxidized metal cap over a gate, and associated structures. In one embodiment, a method includes providing a precursor structure including a transistor having a metal gate; forming an etch stop layer over an exposed portion of the metal gate; at least partially oxidizing the etch stop layer; and forming a dielectric layer over the at least partially oxidized etch stop layer.
摘要翻译：在栅极上利用选择性地形成和至少部分氧化的金属盖形成集成电路结构的方法以及相关联的结构。在一个实施例中，一种方法包括提供包括具有金属栅极的晶体管的前体结构; 在所述金属栅极的暴露部分上形成蚀刻停止层; 至少部分氧化所述蚀刻停止层; 以及在所述至少部分氧化的蚀刻停止层上形成电介质层。

8. 发明申请

US20120326237A1 LOW-PROFILE LOCAL INTERCONNECT AND METHOD OF MAKING THE SAME 有权
标题翻译：低剖面局部互连及其制作方法
公开(公告)号：US20120326237A1
公开(公告)日：2012-12-27
申请号：US13169081
申请日：2011-06-27
申请人： Shom Ponoth , David V. Horak , Charles W. Koburger, III , Chih-Chao Yang
发明人： Shom Ponoth , David V. Horak , Charles W. Koburger, III , Chih-Chao Yang
IPC分类号： H01L29/772
CPC分类号： H01L21/76895 , H01L21/823475 , H04L45/58 , H04L49/15 , H04L49/45
摘要： Embodiments of the present invention provide a structure. The structure includes a plurality of field-effect-transistors having gate stacks formed on top of a semiconductor substrate, the gate stacks having spacers formed at sidewalls thereof; and one or more conductive contacts formed directly on top of the semiconductor substrate and interconnecting at least one source/drain of one of the plurality of field-effect-transistors to at least one source/drain of another one of the plurality of field-effect-transistors, wherein the one or more conductive contacts is part of a low-profile local interconnect that has a height lower than a height of the gate stacks.
摘要翻译：本发明的实施例提供一种结构。该结构包括多个场效应晶体管，其具有形成在半导体衬底顶部上的栅极叠层，该栅叠层具有形成在其侧壁上的隔离层; 以及直接形成在半导体衬底的顶部上并将多个场效应晶体管之一的至少一个源极/漏极互连到多个场效应中的另一个的至少一个源极/漏极的一个或多个导电触点晶体管，其中所述一个或多个导电触点是具有低于所述栅极堆叠的高度的高度的低轮廓局部互连的一部分。

9. 发明申请

US20120208356A1 Device component forming method with a trim step prior to sidewall image transfer (SIT) processing 审中-公开
标题翻译：在侧壁图像转印（SIT）处理之前具有修整步骤的装置部件形成方法
公开(公告)号：US20120208356A1
公开(公告)日：2012-08-16
申请号：US13456282
申请日：2012-04-26
申请人： Toshiharu Furukawa , David V. Horak , Charles W. Koburger, III , Qiqing C. Ouyang
发明人： Toshiharu Furukawa , David V. Horak , Charles W. Koburger, III , Qiqing C. Ouyang
IPC分类号： H01L21/20 , H01L21/302
CPC分类号： H01L21/28132 , H01L21/0337 , H01L21/0338 , H01L29/66795
摘要： Disclosed is an imaging method for patterning component shapes (e.g., fins, gate electrodes, etc.) into a substrate. By conducting a trim step prior to performing either an additive or subtractive sidewall image transfer process, the method avoids the formation of a loop pattern in a hard mask and, thus, avoids a post-SIT process trim step requiring alignment of a trim mask to sub-lithographic features to form a hard mask pattern with the discrete segments. In one embodiment a hard mask is trimmed prior to conducting an additive SIT process so that a loop pattern is not formed. In another embodiment an oxide layer and memory layer that are used to form a mandrel are trimmed prior to the conducting a subtractive SIT process. A mask is then used to protect portions of the mandrel during etch back of the oxide layer so that a loop pattern is not formed.
摘要翻译：公开了一种用于将部件形状（例如散热片，栅电极等）图案化成基板的成像方法。通过在执行加法或减损侧壁图像转移处理之前进行修整步骤，该方法避免了在硬掩模中形成环形图案，并且因此避免了后SIT工艺修整步骤，需要修剪蒙版对准亚光刻特征以形成具有离散片段的硬掩模图案。在一个实施例中，在进行添加SIT处理之前修剪硬掩模，使得不形成环形图案。在另一个实施例中，用于形成心轴的氧化物层和记忆层在进行减法SIT处理之前被修整。然后在氧化层的回蚀刻期间使用掩模来保护心轴的部分，使得不形成环形图案。

10. 发明授权

US08232204B1 Method of forming borderless contact for transistor 失效
标题翻译：形成晶体管无边界接触的方法
公开(公告)号：US08232204B1
公开(公告)日：2012-07-31
申请号：US13171527
申请日：2011-06-29
申请人： David V. Horak , Charles W. Koburger, III , Steven J. Holmes , Shom Ponoth , Chih-Chao Yang
发明人： David V. Horak , Charles W. Koburger, III , Steven J. Holmes , Shom Ponoth , Chih-Chao Yang
IPC分类号： H01L21/44
CPC分类号： H01L21/76834 , H01L21/76897 , H01L29/49 , H01L29/78
摘要： Embodiments of the present invention provide a method of forming borderless contact for transistor. The method may include forming a gate of a transistor, on top of a substrate, and spacers adjacent to sidewalls of the gate; forming a sacrificial layer surrounding the gate; causing the sacrificial layer to expand in height to become higher than the gate, the expanded sacrificial layer covering at most a portion of a top surface of the spacers and thereby leaving an opening on top of the gate surrounded by the spacers; filling the opening with a dielectric cap layer; replacing the expanded sacrificial layer with a dielectric layer; and forming a conductive stud contacting source/drain of the transistor, the conductive stud being isolated from the gate by the dielectric cap layer.
摘要翻译：本发明的实施例提供一种形成晶体管的无边界接触的方法。该方法可以包括在衬底的顶部上形成晶体管的栅极和邻近栅极的侧壁的间隔物; 形成围绕所述栅极的牺牲层; 导致牺牲层在高度上膨胀以变得高于栅极，所述扩展的牺牲层覆盖所述间隔物的顶表面的至多一部分，从而在由所述间隔物包围的所述栅极的顶部上留下开口; 用介电盖层填充开口; 用介电层代替扩展的牺牲层; 并且形成与晶体管的导电柱接触的源极/漏极，导电柱通过电介质盖层与栅极隔离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式