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    • 5. 发明申请
    • Super Halo Formation Using a Reverse Flow for Halo Implants
    • 超光晕使用反向流动为光晕植入物
    • US20090152626A1
    • 2009-06-18
    • US11959032
    • 2007-12-18
    • Ramesh VenugopalSrinivasan ChakravarthiChris Bowen
    • Ramesh VenugopalSrinivasan ChakravarthiChris Bowen
    • H01L27/092H01L21/8238
    • H01L21/823807H01L21/823814
    • Shrinking dimensions of MOS transistors in integrated circuits requires tighter distributions of dopants in pocket regions from halo ion implant processes. In conventional fabrication process sequences, halo dopant distributions spread during source/drain anneals. The instant invention is a method of fabricating MOS transistors in an integrated circuit in which halo ion are performed after source/drain anneals. In the inventive method, source/drain spacers on MOS gate sidewalls are removed prior to halo ion implant processes. Spacers to offset metal silicide are formed after halo implants and may be of low-k dielectric material to reduce gate to drain capacitance. A compressive stress layer may be deposited on MOS gates after source/drain spacers are removed for greater stress transfer efficiency to the MOS gates. An integrated circuit embodying the inventive method is also disclosed.
    • 集成电路中MOS晶体管的收缩尺寸需要从光晕离子注入工艺在口袋区域中更严格地分配掺杂剂。 在常规制造工艺序列中,卤素掺杂剂分布在源极/漏极退火期间扩散。 本发明是在源极/漏极退火之后执行卤素离子的集成电路中制造MOS晶体管的方法。 在本发明的方法中,在卤素离子注入工艺之前,MOS栅极侧壁上的源极/漏极间隔物被去除。 偏移金属硅化物的间隔物在晕轮植入物之后形成,并且可以是低k电介质材料以减小栅极至漏极电容。 在源极/漏极间隔物被去除之后,压电应力层可以沉积在MOS栅极上,以提高MOS栅极的应力传递效率。 还公开了体现本发明方法的集成电路。