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1. 发明申请

US20150197420A1 MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH GUARD RING AND METHOD FOR MAKING SAME 审中-公开
标题翻译：具有护环的微电子机械系统装置及其制造方法
公开(公告)号：US20150197420A1
公开(公告)日：2015-07-16
申请号：US14670766
申请日：2015-03-27
申请人： Hsin Hui Hsu , Sheng Ta Lee , Chuan Wei Wang
发明人： Hsin Hui Hsu , Sheng Ta Lee , Chuan Wei Wang
IPC分类号： B81C1/00
CPC分类号： B81C1/00698 , B81C1/00571 , B81C2201/014 , B81C2203/0109 , H01L23/585 , H01L41/0472 , H01L41/1132 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： The present invention discloses a MEMS device with guard ring, and a method for making the MEMS device. The MEMS device comprises a bond pad and a sidewall surrounding and connecting with the bond pad, characterized in that the sidewall forms a guard ring by an etch-resistive material.
摘要翻译：本发明公开了一种具有保护环的MEMS器件及其制造方法。 MEMS器件包括接合焊盘和围绕并与接合焊盘连接的侧壁，其特征在于，所述侧壁通过耐蚀刻材料形成保护环。

2. 发明授权

US08829628B2 MEMS package structure 有权
标题翻译： MEMS封装结构
公开(公告)号：US08829628B2
公开(公告)日：2014-09-09
申请号：US13535682
申请日：2012-06-28
申请人： Hsin-Hui Hsu , Sheng-Ta Lee , Chuan-Wei Wang
发明人： Hsin-Hui Hsu , Sheng-Ta Lee , Chuan-Wei Wang
IPC分类号： H01L23/29 , H01L23/31 , B81C1/00
CPC分类号： B81B7/0058 , B81B7/0006 , B81B2201/0264 , B81C1/00246 , B81C1/00293 , B81C2203/0136 , B81C2203/0145 , B81C2203/0714 , B81C2203/0735
摘要： A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.
摘要翻译：提供了包括基板，互连结构，上金属层，沉积元件和封装元件的MEMS封装结构。互连结构设置在基板上。 MEMS结构设置在基板上并在第一腔内。上金属层设置在MEMS结构和互连结构之上，以便形成位于上金属层和互连结构之间的第二腔，并与第一腔连通。上金属层具有位于互连结构上方的至少第一开口和位于MEMS结构上方的至少第二开口。第一开口的面积大于第二开口的面积。沉积元件设置在上金属层上方以密封第二开口。包装元件设置在上金属层上方以密封第一开口。

3. 发明授权

US08772885B2 MEMS sensing device and method for the same 有权
标题翻译： MEMS感测装置及其方法相同
公开(公告)号：US08772885B2
公开(公告)日：2014-07-08
申请号：US13948128
申请日：2013-07-22
申请人： Chuan-Wei Wang , Ming-Han Tsai
发明人： Chuan-Wei Wang , Ming-Han Tsai
IPC分类号： H01L29/84
CPC分类号： B81B3/0021 , B81C1/00333 , B81C2203/0118 , B81C2203/0735 , G01L9/0073
摘要： The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.
摘要翻译：本发明公开了一种MEMS感测装置，其包括衬底，MEMS器件区域，膜，粘合剂层，盖，至少一个开口和多个引线。衬底具有与第一表面相对的第一表面和第二表面。 MEMS器件区域在第一表面上，并且包括腔室。膜被覆盖在MEMS器件区域上，以密封腔室作为密封空间。盖安装在MEMS器件区域上，并通过粘合剂层粘合。开口在盖子或粘合剂层上，允许装置外的空气的压力对膜施加压力。引线电连接到MEMS器件区域，并延伸到第二表面。

4. 发明授权

US08524519B2 MEMS microphone device and method for making same 有权
公开(公告)号：US08524519B2
公开(公告)日：2013-09-03
申请号：US13135417
申请日：2011-07-06
申请人： Chuan-Wei Wang , Chih-Ming Sun
发明人： Chuan-Wei Wang , Chih-Ming Sun
IPC分类号： H01L21/00
CPC分类号： B81B7/0051 , H04R19/005 , H04R19/04
摘要： The present invention discloses a MEMS microphone device and its manufacturing method. The MEMS microphone device includes: a substrate including a first cavity; a MEMS device region above the substrate, wherein the MEMS device region includes a metal layer, a via layer, an insulating material region and a second cavity; a mask layer above the MEMS device region; a first lid having at least one opening communicating with the second cavity, the first lid being fixed above the mask layer; and a second lid fixed under the substrate.

5. 发明申请

US20130186201A1 Micro-Electro-Mechanical System Device, Out-of-Plane Sensor and Method for Making Micro-Electro-Mechanical System Device 有权
标题翻译：微机电系统装置，平面传感器及制造微机电系统装置的方法
公开(公告)号：US20130186201A1
公开(公告)日：2013-07-25
申请号：US13451154
申请日：2012-04-19
申请人： Sheng-Ta Lee , Chuan Wei Wang
发明人： Sheng-Ta Lee , Chuan Wei Wang
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , B81B2201/025 , B81C1/00246 , B81C2203/0714 , G01P15/08 , G01P15/0802
摘要： The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.
摘要翻译：本发明公开了一种微电子机械系统（MEMS）装置，其特征在于，包括：主体和两个位于主体两侧并与主体连接的电容器板的质量体，两个电容器板位于不同高程水平; 位于两个电容器板之一上方的上电极，与其形成一个电容器; 以及位于两个电容器板的另一个下方的下电极，与其形成另一个电容器，其中上电极和下电极在水平方向上彼此不对准。

6. 发明授权

US08368005B2 Optical detection method and optical MEMS detector, and method for making MEMS detector 有权
标题翻译：光学检测方法和光学MEMS检测器，以及制造MEMS检测器的方法
公开(公告)号：US08368005B2
公开(公告)日：2013-02-05
申请号：US12627374
申请日：2009-11-30
申请人： Chuan-Wei Wang , Hsin-Hui Hsu , Chih-Hung Lu
发明人： Chuan-Wei Wang , Hsin-Hui Hsu , Chih-Hung Lu
IPC分类号： G01D5/34 , G01B11/14
CPC分类号： G01P15/093 , G01D5/34 , G01P15/0802
摘要： The present invention discloses an optical MEMS detector, comprising: a substrate; at least one photo diode in a region within the substrate; an isolation wall above the substrate and surrounding the photo diode region; and at least one movable part having an opening for light to pass through and reach the photo diode, wherein when the at least one movable part is moved, an amount of light reaching the photo diode is changed.
摘要翻译：本发明公开了一种光学MEMS检测器，包括：基板; 在所述衬底内的区域中的至少一个光电二极管; 在衬底上方并围绕光电二极管区域的隔离壁; 以及具有用于光通过并到达光电二极管的开口的至少一个可移动部件，其中当至少一个可移动部件移动时，到达光电二极管的光量改变。

7. 发明授权

US08329492B2 Micro electronic device and method for fabricating micro electromechanical system resonator thereof 有权
标题翻译：微电子器件及其制造微机电系统谐振器的方法
公开(公告)号：US08329492B2
公开(公告)日：2012-12-11
申请号：US12819278
申请日：2010-06-21
申请人： Chuan-Wei Wang , Hsin-Hui Hsu , Sheng-Ta Lee
发明人： Chuan-Wei Wang , Hsin-Hui Hsu , Sheng-Ta Lee
IPC分类号： H01L21/467
CPC分类号： B81C1/00246 , B81B2201/0271 , B81C1/00182 , B81C2203/0714 , H03H3/0073
摘要： A method for fabricating a MEMS resonator is provided. A stacked main body including a silicon substrate, a plurality of metallic layers and an isolation layer is formed and has a first etching channel extending from the metallic layers into the silicon substrate. The isolation layer is filled in the first etching channel. The stacked main body also has a predetermined suspended portion. Subsequently, a portion of the isolation layer is removed so that a second etching channel is formed and the remained portion of the isolation layer covers an inner sidewall of the first etching channel. Afterwards, employing the isolation layer that covers the inner sidewall of the first etching channel as a mask, an isotropic etching process through the second etching channel is applied to the silicon substrate, thereby forming the MEMS resonator suspending above the silicon substrate. The method for fabricating MEMS resonator can be integrated with the process of fabricating the CMOS circuit, thereby the process of fabricating a microelectronic device can be simplified and the cost of fabricating a micro electronic device can be reduced. A micro electronic device is also provided in the present invention.
摘要翻译：提供了一种用于制造MEMS谐振器的方法。形成包括硅衬底，多个金属层和隔离层的堆叠主体，并且具有从金属层延伸到硅衬底中的第一蚀刻通道。隔离层填充在第一蚀刻通道中。堆叠的主体还具有预定的悬挂部分。随后，去除隔离层的一部分，使得形成第二蚀刻通道，并且隔离层的剩余部分覆盖第一蚀刻通道的内侧壁。然后，使用覆盖第一蚀刻通道的内侧壁的隔离层作为掩模，通过第二蚀刻通道的各向同性蚀刻工艺被施加到硅衬底，从而形成悬浮在硅衬底之上的MEMS谐振器。制造MEMS谐振器的方法可以与制造CMOS电路的过程集成，从而可以简化微电子器件的制造工艺，并且可以降低制造微电子器件的成本。本发明还提供微电子装置。

8. 发明申请

US20120267732A1 MEMS PACKAGE STRUCTURE 有权
标题翻译： MEMS封装结构
公开(公告)号：US20120267732A1
公开(公告)日：2012-10-25
申请号：US13535682
申请日：2012-06-28
申请人： Hsin-Hui HSU , Sheng-Ta LEE , Chuan-Wei WANG
发明人： Hsin-Hui HSU , Sheng-Ta LEE , Chuan-Wei WANG
IPC分类号： H01L29/84
CPC分类号： B81B7/0058 , B81B7/0006 , B81B2201/0264 , B81C1/00246 , B81C1/00293 , B81C2203/0136 , B81C2203/0145 , B81C2203/0714 , B81C2203/0735
摘要： A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.
摘要翻译：提供了包括基板，互连结构，上金属层，沉积元件和封装元件的MEMS封装结构。互连结构设置在基板上。 MEMS结构设置在基板上并在第一腔内。上金属层设置在MEMS结构和互连结构之上，以便形成位于上金属层和互连结构之间的第二腔，并与第一腔连通。上金属层具有位于互连结构上方的至少第一开口和位于MEMS结构上方的至少第二开口。第一开口的面积大于第二开口的面积。沉积元件设置在上金属层上方以密封第二开口。包装元件设置在上金属层上方以密封第一开口。

9. 发明申请

US20120167683A1 MEMS device and deformation protection structure therefor and method for making same 有权
标题翻译： MEMS器件及其变形保护结构及其制作方法
公开(公告)号：US20120167683A1
公开(公告)日：2012-07-05
申请号：US12932869
申请日：2011-03-08
申请人： Chuan-Wei Wang
发明人： Chuan-Wei Wang
IPC分类号： G01C19/56 , H05K3/00
CPC分类号： G01P15/125 , G01P15/0802 , Y10T29/49002 , Y10T29/49007 , Y10T29/49155
摘要： The present invention discloses a MEMS (Micro-Electro-Mechanical System, MEMS) device with a deformation protection structure. The MEMS device is located on a substrate, and it includes: a movable part; and a deformation protection structure, which has: a fixed plug, which is fixed on the substrate; multiple metal layers, including a top metal layer; and multiple plugs connecting the multiple metal layers. From top view, the top metal layer overlaps a portion of the movable part, and from cross section view, the bottom surface of the top metal layer is higher than the top surface of the movable part by a predetermined distance.
摘要翻译：本发明公开了一种具有变形保护结构的MEMS（微机电系统，MEMS）装置。 MEMS器件位于衬底上，它包括：可动部分; 以及变形保护结构，其具有：固定在所述基板上的固定塞; 多个金属层，包括顶部金属层; 以及连接多个金属层的多个插头。从顶视图看，顶部金属层与可移动部分的一部分重叠，并且从横截面图，顶部金属层的底表面高于可移动部分的顶表面预定距离。

10. 发明申请

US20120075422A1 3D INFORMATION GENERATOR FOR USE IN INTERACTIVE INTERFACE AND METHOD FOR 3D INFORMATION GENERATION 有权
标题翻译：用于交互界面的3D信息发生器和用于3D信息生成的方法
公开(公告)号：US20120075422A1
公开(公告)日：2012-03-29
申请号：US12889825
申请日：2010-09-24
申请人： CHUAN-WEI WANG , Hsin-Chia Chen , Chih-Hung Lu
发明人： CHUAN-WEI WANG , Hsin-Chia Chen , Chih-Hung Lu
IPC分类号： H04N13/02 , G06K9/00
CPC分类号： H04N13/254 , G01S7/4814 , G01S7/4817 , G01S17/48 , G01S17/89 , H04N13/271
摘要： The present invention discloses a 3D information generator for use in an interactive interface. The 3D information generator includes: a MEMS light beam generator having at least one light source for providing a dot light beam and a MEMS mirror for projecting a movable scanning light beam according to the dot light beam to an object; an image sensor for sensing an image of the object to generate a 2D image information; and a processor for generating a distance information by triangulation method according to a reflection result of the scanning light beam scanning on the object, wherein the distance information is combined with the 2D image information to generate a 3D information.
摘要翻译：本发明公开了一种用于交互式界面的3D信息发生器。 3D信息发生器包括：具有至少一个用于提供点光束的光源的MEMS光束发生器和用于将根据点光束将可移动扫描光束投射到物体的MEMS反射镜; 用于感测对象的图像以生成2D图像信息的图像传感器; 以及处理器，用于根据对物体上的扫描光束扫描的反射结果，通过三角测量方法产生距离信息，其中距离信息与2D图像信息组合以产生3D信息。

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