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1. 发明授权

US07312518B2 Miniaturized multi-chip module and method for manufacturing the same 有权
标题翻译：小型化多芯片模块及其制造方法
公开(公告)号：US07312518B2
公开(公告)日：2007-12-25
申请号：US11206843
申请日：2005-08-19
申请人： Kuo-Hsien Liao , Jia-Yang Chen , Chuei-Tang Wang
发明人： Kuo-Hsien Liao , Jia-Yang Chen , Chuei-Tang Wang
IPC分类号： H01L23/02
CPC分类号： H01L23/5385 , H01L23/49822 , H01L23/49838 , H01L25/0657 , H01L2224/32225 , H01L2225/0652 , H01L2225/06572 , H05K1/141 , H05K1/145 , H05K3/3442 , H05K2201/2018 , H05K2203/1572
摘要： A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.
摘要翻译：适用于无线传输设备的小型化多芯片模块包括基板，安装在基板上并与电路连接的集成电路芯片，以及安装在基板的一个表面上的插入器。插入器与基板配合以限制接收空间，用于接收插入器所附接的基板的表面上的集成电路芯片，并且设置有与基板电连接的导体。因此，当插入器安装在电路板上时，导体用作集成电路芯片的外部电连接。还公开了一种用于制造小型化多芯片模块的方法。

2. 发明申请

US20130082364A1 EMI Package AND METHOD FOR MAKING SAME 有权
标题翻译： EMI封装及其制造方法
公开(公告)号：US20130082364A1
公开(公告)日：2013-04-04
申请号：US13250697
申请日：2011-09-30
申请人： Chuei-Tang Wang , Der-Chyang Yeh
发明人： Chuei-Tang Wang , Der-Chyang Yeh
IPC分类号： H01L23/58 , H01L21/768
CPC分类号： H01L23/552 , H01L21/565 , H01L21/76802 , H01L21/76877 , H01L21/76898 , H01L23/3128 , H01L24/16 , H01L24/64 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/02317 , H01L2224/02372 , H01L2224/02373 , H01L2224/0401 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/81191 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K3/284 , H05K2201/0715 , H05K2201/09972 , H05K2201/10378 , H05K2203/1316 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.
摘要翻译：集成电路结构包括基板，在基板的第一侧上的感光模制件，在模制件中形成的通孔，以及沉积在基板的第一侧和通孔中的一致的金属层。可以通过在模制件中与通孔对准的基板形成贯通孔，其中导电衬垫沉积在贯通通孔中，以与适形金属层电接触。集成电路结构还可以包括诸如焊球之间的连接器元件，该连接器元件在通孔的端部上，与第一侧相反的第二面上。集成电路结构还可以包括在基板的第一侧上的与另一通孔或再分布层电接触的管芯。

3. 发明申请

US20060038722A1 Planar inverted-F antenna 失效
公开(公告)号：US20060038722A1
公开(公告)日：2006-02-23
申请号：US10923405
申请日：2004-08-20
申请人： Kuo-Hua Tseng , Kuan-Hsing Li , Hui-Chung Lee , Chuei-Tang Wang
发明人： Kuo-Hua Tseng , Kuan-Hsing Li , Hui-Chung Lee , Chuei-Tang Wang
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0442 , H01Q1/243 , H01Q9/0421
摘要： A planar inverted-F antenna includes a ground element, a shorting element, a radiating element, and a feeding element. The shorting element extends upwardly from the ground element. The radiating element is disposed above the ground element, and extends transversely from the shorting element. The radiating element includes a meandering strip and a flat plate. The meandering strip has opposite first and second ends. The first end of the meandering strip is coupled to the shorting element. The flat plate has a connecting side that is connected to the second end of the meandering strip and that has a length different from that of the second end of the meandering strip. The feeding element has a first end that is connected to the radiating element, and a second end that extends through and that is free from electrical contact with the ground element.

4. 发明授权

US08872312B2 EMI package and method for making same 有权
标题翻译： EMI封装及其制作方法
公开(公告)号：US08872312B2
公开(公告)日：2014-10-28
申请号：US13250697
申请日：2011-09-30
申请人： Chuei-Tang Wang , Der-Chyang Yeh
发明人： Chuei-Tang Wang , Der-Chyang Yeh
IPC分类号： H01L23/552 , H01L29/04 , H01L29/82 , H01L23/48 , H01L23/02 , H01L21/00 , H01L21/56 , H01L23/31 , H01L25/065 , H05K3/28 , H01L23/00
CPC分类号： H01L23/552 , H01L21/565 , H01L21/76802 , H01L21/76877 , H01L21/76898 , H01L23/3128 , H01L24/16 , H01L24/64 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/02317 , H01L2224/02372 , H01L2224/02373 , H01L2224/0401 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/81191 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K3/284 , H05K2201/0715 , H05K2201/09972 , H05K2201/10378 , H05K2203/1316 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.
摘要翻译：集成电路结构包括基板，在基板的第一侧上的感光模制件，在模制件中形成的通孔，以及沉积在基板的第一侧和通孔中的一致的金属层。可以通过在模制件中与通孔对准的基板形成贯通孔，其中导电衬垫沉积在贯通通孔中，以与适形金属层电接触。集成电路结构还可以包括诸如焊球之间的连接器元件，该连接器元件在通孔的端部上，与第一侧相反的第二面上。集成电路结构还可以包括在基板的第一侧上的与另一通孔或再分布层电接触的管芯。

5. 发明申请

US20130320553A1 NOVEL BEAD FOR 2.5D/3D CHIP PACKAGING APPLICATION 有权
标题翻译： 2.5D / 3D芯片包装应用的新颖的珠子
公开(公告)号：US20130320553A1
公开(公告)日：2013-12-05
申请号：US13481974
申请日：2012-05-29
申请人： Feng Wei KUO , Huan-Neng CHEN , Chewn-Pu JOU , Der-Chyang YEH , Chuei-Tang WANG
发明人： Feng Wei KUO , Huan-Neng CHEN , Chewn-Pu JOU , Der-Chyang YEH , Chuei-Tang WANG
IPC分类号： H01L23/48
CPC分类号： H01L23/528 , H01L23/5227 , H01L23/552 , H01L2223/6616 , H01L2224/04105 , H01L2224/24137 , H01L2924/14 , H01L2924/15311 , H01L2924/18162
摘要： An integrated circuit package having a multilayer interposer has one or more metal wiring beads provided in the interposer, each of the one or more metal wiring beads has a convoluted wiring pattern that is formed in one of the multiple layers of wiring structures in the interposer, and two terminal end segments connected to the power lines in the integrated circuit package, wherein the one or more metal wiring beads operate as power noise filters.
摘要翻译：具有多层插入器的集成电路封装具有设置在插入件中的一个或多个金属布线珠，所述一个或多个金属布线珠中的每一个具有形成在所述插入件中的所述多层布线结构中的一层中的卷曲布线图案，以及连接到集成电路封装中的电力线的两个终端段，其中所述一个或多个金属布线珠作为功率噪声滤波器起作用。

6. 发明授权

US09275950B2 Bead for 2.5D/3D chip packaging application 有权
标题翻译：珠子用于2.5D / 3D芯片封装应用
公开(公告)号：US09275950B2
公开(公告)日：2016-03-01
申请号：US13481974
申请日：2012-05-29
申请人： Feng Wei Kuo , Huan-Neng Chen , Chewn-Pu Jou , Der-Chyang Yeh , Chuei-Tang Wang
发明人： Feng Wei Kuo , Huan-Neng Chen , Chewn-Pu Jou , Der-Chyang Yeh , Chuei-Tang Wang
IPC分类号： H01L23/528 , H01L23/552 , H01L23/522
CPC分类号： H01L23/528 , H01L23/5227 , H01L23/552 , H01L2223/6616 , H01L2224/04105 , H01L2224/24137 , H01L2924/14 , H01L2924/15311 , H01L2924/18162
摘要： An integrated circuit package having a multilayer interposer has one or more metal wiring beads provided in the interposer, each of the one or more metal wiring beads has a convoluted wiring pattern that is formed in one of the multiple layers of wiring structures in the interposer, and two terminal end segments connected to the power lines in the integrated circuit package, wherein the one or more metal wiring beads operate as power noise filters.
摘要翻译：具有多层插入器的集成电路封装具有设置在插入件中的一个或多个金属布线珠，所述一个或多个金属布线珠中的每一个具有形成在所述插入件中的所述多层布线结构中的一层中的卷曲布线图案，以及连接到集成电路封装中的电力线的两个终端段，其中所述一个或多个金属布线珠作为功率噪声滤波器起作用。

7. 发明申请

US20060249838A1 Miniaturized multi-chip module and method for manufacturing the same 有权
标题翻译：小型化多芯片模块及其制造方法
公开(公告)号：US20060249838A1
公开(公告)日：2006-11-09
申请号：US11206843
申请日：2005-08-19
申请人： Kuo-Hsien Liao , Jia-Yang Chen , Chuei-Tang Wang
发明人： Kuo-Hsien Liao , Jia-Yang Chen , Chuei-Tang Wang
IPC分类号： H01L23/34
CPC分类号： H01L23/5385 , H01L23/49822 , H01L23/49838 , H01L25/0657 , H01L2224/32225 , H01L2225/0652 , H01L2225/06572 , H05K1/141 , H05K1/145 , H05K3/3442 , H05K2201/2018 , H05K2203/1572
摘要： A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.
摘要翻译：适用于无线传输设备的小型化多芯片模块包括基板，安装在基板上并与电路连接的集成电路芯片，以及安装在基板的一个表面上的插入器。插入器与基板配合以限制接收空间，用于接收插入器所附接的基板的表面上的集成电路芯片，并且设置有与基板电连接的导体。因此，当插入器安装在电路板上时，导体用作集成电路芯片的外部电连接。还公开了一种用于制造小型化多芯片模块的方法。

8. 发明授权

US07106259B2 Planar inverted-F antenna 失效
标题翻译：平面倒F天线
公开(公告)号：US07106259B2
公开(公告)日：2006-09-12
申请号：US10923405
申请日：2004-08-20
申请人： Kuo-Hua Tseng , Kuan-Hsing Li , Hui-Chung Lee , Chuei-Tang Wang
发明人： Kuo-Hua Tseng , Kuan-Hsing Li , Hui-Chung Lee , Chuei-Tang Wang
IPC分类号： H01Q1/24 , H01Q13/10
CPC分类号： H01Q9/0442 , H01Q1/243 , H01Q9/0421
摘要： A planar inverted-F antenna includes a ground element, a shorting element, a radiating element, and a feeding element. The shorting element extends upwardly from the ground element. The radiating element is disposed above the ground element, and extends transversely from the shorting element. The radiating element includes a meandering strip and a flat plate. The meandering strip has opposite first and second ends. The first end of the meandering strip is coupled to the shorting element. The flat plate has a connecting side that is connected to the second end of the meandering strip and that has a length different from that of the second end of the meandering strip. The feeding element has a first end that is connected to the radiating element, and a second end that extends through and that is free from electrical contact with the ground element.
摘要翻译：平面倒F天线包括接地元件，短路元件，辐射元件和馈电元件。短路元件从接地元件向上延伸。辐射元件设置在接地元件上方，并从短路元件横向延伸。辐射元件包括蜿蜒带和平板。曲折带有相反的第一和第二端。蜿蜒条的第一端与短路元件相连。平板具有与蜿蜒带的第二端连接的连接侧，其长度与蜿蜒带的第二端的长度不同。馈电元件具有连接到辐射元件的第一端和延伸穿过并且与地面元件没有电接触的第二端。

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