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1. 外观设计

USD834994S1 Funerary ornament 有权
公开(公告)号：USD834994S1
公开(公告)日：2018-12-04
申请号：US29607649
申请日：2017-06-15
申请人： David R. King
设计人： David R. King

2. 发明申请

US20150073584A1 WIRELESS VISION SYSTEMS AND METHODS FOR USE IN HARSH ENVIRONMENTS 审中-公开
标题翻译：无线视觉系统和在HARH环境中使用的方法
公开(公告)号：US20150073584A1
公开(公告)日：2015-03-12
申请号：US14482518
申请日：2014-09-10
申请人： Andrew Goodale , Schilling Schilling , David R King , George Costigan , Lei Wang
发明人： Andrew Goodale , Schilling Schilling , David R King , George Costigan , Lei Wang
IPC分类号： G05B19/4097
CPC分类号： G05B19/4097 , B23Q17/2428 , G05B19/401 , G05B2219/37009 , G05B2219/45145
摘要： A chuck or spindle mountable wireless vision system and method for use in harsh environments. The vision system includes a sealed housing. The sealed housing includes a tool holder interface to couple to the chuck or spindle of a machine. An optical system to acquire an image is positioned within the sealed housing, the optical system including a processor, memory, and machine vision software to perform at least a portion of image processing. A wireless communication module is operatively coupled to the optical system to wirelessly communicate image data. And, a power source, the power source operatively coupled to the optical system and the wireless communication module.
摘要翻译：用于恶劣环境的卡盘或主轴可安装的无线视觉系统和方法。视觉系统包括一个密封的外壳。密封的壳体包括与机器的卡盘或主轴联接的工具保持器接口。用于获取图像的光学系统位于密封壳体内，光学系统包括处理器，存储器和机器视觉软件，以执行图像处理的至少一部分。无线通信模块可操作地耦合到光学系统以无线地传送图像数据。并且，电源，可操作地耦合到光学系统的电源和无线通信模块。

3. 发明申请

US20140111682A1 CARRIER FRAME AND CIRCUIT BOARD FOR AN ELECTRONIC DEVICE 有权
标题翻译：用于电子设备的载体框架和电路板
公开(公告)号：US20140111682A1
公开(公告)日：2014-04-24
申请号：US13655972
申请日：2012-10-19
申请人： Kai Flügge , Laurens Nunnink , Richard Reuter , David R. King
发明人： Kai Flügge , Laurens Nunnink , Richard Reuter , David R. King
IPC分类号： G02B7/04 , H05K13/04 , H04N5/232
CPC分类号： G02B7/08 , G03B17/02 , G03B17/12 , G03B2217/002 , H04N5/2254 , Y10T29/49769 , Y10T29/49863
摘要： An electronic device includes an electronic circuit board containing a processing element and a vision sensor. A carrier frame is used to support the electronic circuit board. An optical element is positioned over the sensor and supported by the carrier frame. The electronic circuit board is bent to reduce the length, thickness and/or width of the electronic device, without increasing the others of the length, thickness and/or width of the electronic device.
摘要翻译：电子设备包括含有处理元件和视觉传感器的电子电路板。载体框架用于支撑电子电路板。光学元件位于传感器上方并由载体框架支撑。电子电路板被弯曲以减小电子设备的长度，厚度和/或宽度，而不增加电子设备的长度，厚度和/或宽度的其他部分。

4. 发明申请

US20110301537A1 CONTROLLED RELEASE MECHANISM FOR BALLOON CATHETERS 有权
标题翻译：用于气球导管的控制释放机制
公开(公告)号：US20110301537A1
公开(公告)日：2011-12-08
申请号：US13209199
申请日：2011-08-12
申请人： James F. Davidson , Matthew E. Doyle , Peter R. Giovale , David R. King , Paul M. Kroncke , Alison Keach Pearsall
发明人： James F. Davidson , Matthew E. Doyle , Peter R. Giovale , David R. King , Paul M. Kroncke , Alison Keach Pearsall
IPC分类号： A61M25/10
CPC分类号： A61M25/10184 , A61M25/1011 , A61M2025/1015 , A61M2025/1093
摘要： This invention relates to the field of balloon catheters and more particularly to catheter balloons having controlled failure mechanisms for the prevention of catastrophic failure of the balloon during overpressure conditions.
摘要翻译：本发明涉及气囊导管领域，更具体地说涉及具有控制失效机制的导管球囊，用于在超压条件下防止气囊的灾难性故障。

5. 发明授权

US5635293A High capacitance sheet adhesives 失效
标题翻译：高电容片粘合剂
公开(公告)号：US5635293A
公开(公告)日：1997-06-03
申请号：US609760
申请日：1996-02-16
申请人： Joseph E. Korleski , David R. King
发明人： Joseph E. Korleski , David R. King
IPC分类号： C08J9/40 , C08J5/18 , H01B3/44 , H01G4/18 , H01G4/20 , H05K1/03 , H05K1/16 , B32B5/22
CPC分类号： C08J5/18 , H01B3/445 , H01G4/206 , H05K1/0373 , H05K1/162 , C08J2327/18 , H05K1/034 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , Y10S428/901 , Y10T428/249953 , Y10T428/249958 , Y10T428/249982 , Y10T428/249986 , Y10T428/249987 , Y10T428/31522 , Y10T428/3154 , Y10T428/31544
摘要： The present invention relates to thin adhesive composite films formed from fluoropolymers imbibed with adhesives and containing a filler at least within the infra-structure of the polymer to provide the film with a high dielectric constant. The films of the present invention are particularly suitable for use in a capacitor or in applications requiring high capacitive properties.
摘要翻译：本发明涉及由粘合剂吸收的含氟聚合物形成的薄粘合复合膜，并且至少在聚合物的基础结构内含有填料以提供高介电常数。本发明的膜特别适用于电容器或需要高电容性能的应用。

6. 发明授权

US5604026A Electrically conductive adhesives 失效
标题翻译：导电胶
公开(公告)号：US5604026A
公开(公告)日：1997-02-18
申请号：US465021
申请日：1995-06-05
申请人： David R. King
发明人： David R. King
IPC分类号： C09J7/02 , C09J7/00 , C09J7/04 , C09J9/02 , C09J163/00 , C09J201/00 , H01B1/22 , H01L21/60 , H01L23/482 , H05K3/32 , B32B3/26 , B32B7/12
CPC分类号： H01L24/83 , C09J7/00 , C09J9/02 , H01B1/22 , H01L23/4828 , H01L24/29 , H05K3/323 , H01L2224/2919 , H01L2224/29499 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H05K1/0215 , H05K2201/0116 , H05K2201/015 , H05K2201/0278 , H05K2201/10378 , H05K2203/0278 , H05K3/321 , Y10T428/249982 , Y10T428/249983 , Y10T428/249984 , Y10T428/249985 , Y10T428/28 , Y10T428/2804 , Y10T428/2848
摘要： An electrically conductive adhesive is described that is made of a porous substrate having numerous passages extending through it. The walls of the substrate defining the passages are plated with a conductive metal. This provides a continuous plating from one side of the porous substrate to the other. The remaining passage volume is substantially filled with an adhesive resin. The adhesive can be used to electrically connect two metal surfaces.
摘要翻译：描述了一种导电粘合剂，其由具有延伸通过其的许多通道的多孔基材制成。限定通道的基板的壁用导电金属镀覆。这提供从多孔基材的一侧到另一侧的连续电镀。剩余通道体积基本上用粘合剂树脂填充。粘合剂可用于电连接两个金属表面。

7. 发明授权

US4992059A Ultra fine line cable and a method for fabricating the same 失效
标题翻译：超细线电缆及其制造方法
公开(公告)号：US4992059A
公开(公告)日：1991-02-12
申请号：US445292
申请日：1989-12-01
申请人： David R. King , David B. Harris
发明人： David R. King , David B. Harris
IPC分类号： H01L23/498
CPC分类号： H01L23/4985 , H01L23/49827 , H01L2924/0002 , Y10T29/49158 , Y10T29/4921
摘要： The invention is a fine line electrical cable with two ends having a plurality of first conductor lines in a plane. The lines of the cable are embedded in an insulating laminate material, are closely spaced at one end to be compatible with the closely spaced contacts from IC chips and are fanned out along the length of the cable to the other end where the lines are spaced somewhat apart and compatible with conventional electrical connectors. Contact posts extent from each line end so that external connections may be made with the IC chips and the conventional connectors. At least one second conductor line may be embedded within the other side of the laminate material and appropriate contact posts extend from the line ends so that external connections may also be made at these locations. A method for fabricating the fine line elecrical cable is also disclosed.
摘要翻译：本发明是一种细线电缆，其两端在平面内具有多条第一导体线。电缆的线被嵌入绝缘层压材料中，在一端紧密间隔开以与IC芯片紧密隔开的触点相容，并沿着电缆的长度被扇形地延伸至另一端，其中线间隔一些与传统的电连接器兼容。每个线端的接触柱范围，以便可以利用IC芯片和常规连接器进行外部连接。至少一个第二导体线可以嵌入在层压材料的另一侧内，并且适当的接触柱从线端延伸，使得也可以在这些位置处形成外部连接。还公开了一种用于制造细线电缆的方法。

8. 发明授权

US4912020A Printed circuit boards and method for manufacturing printed circuit boards 失效
标题翻译：印刷电路板和制造印刷电路板的方法
公开(公告)号：US4912020A
公开(公告)日：1990-03-27
申请号：US240852
申请日：1988-09-02
申请人： David R. King , Mark S. Lee , Richard W. Decker
发明人： David R. King , Mark S. Lee , Richard W. Decker
IPC分类号： H05K1/11 , H05K3/20 , H05K3/24 , H05K3/28 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： H05K3/205 , H05K1/112 , H05K3/4614 , H05K3/4647 , H05K3/4658 , H05K2201/0367 , H05K2201/0394 , H05K2201/09563 , H05K2203/0152 , H05K2203/061 , H05K2203/063 , H05K2203/0726 , H05K2203/0733 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/423 , H05K3/4652
摘要： A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminated to the second board panel (30) with a laminate insulating material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14,34) of conductive material are removed from the laminate insulating material (40).
摘要翻译：描述了一种印刷电路板，其中电绝缘层压材料（40）具有第一和第二侧面。导电第一电路图案（15）嵌入在层压材料（40）的第一侧中，并且导电的第二电路图案（20）嵌入在层压材料（40）的第二侧中，与第第一电路图案（15）由层压材料（40）构成。固体互连构件（20）延伸穿过层压材料（40）并且在其选定位置处电连接第一和第二电路图案（15,20）。制造基板的方法包括作为第一步骤制造具有从导电材料的基底层（14）延伸的升高的导电第一电路图案（15）的第一板面板（10）和升高的导电的第二电路图案（20）从第一电路图案（15）延伸。还制造了第二板面板（30），其具有从导电材料的另一基底层（34）延伸的凸起的导电第三电路图案（35）。第一板面板（10）用位于其间的层叠绝缘材料（40）层叠到第二板面板（30），使第一电路图案（15）与第三电路图案（35）电绝缘，并且第二电路图案（20）在其选定部分与第一电路图案（15）电接触。最后，将导电材料的基层（14,34）从叠层绝缘材料（40）中去除。

9. 发明授权

US09746636B2 Carrier frame and circuit board for an electronic device 有权
公开(公告)号：US09746636B2
公开(公告)日：2017-08-29
申请号：US13655972
申请日：2012-10-19
申请人： Kai Flügge , Laurens Nunnink , Richard Reuter , David R. King
发明人： Kai Flügge , Laurens Nunnink , Richard Reuter , David R. King
IPC分类号： G02B7/08 , G03B17/02 , G03B17/12 , H04N5/225
CPC分类号： G02B7/08 , G03B17/02 , G03B17/12 , G03B2217/002 , H04N5/2254 , Y10T29/49769 , Y10T29/49863
摘要： An electronic device includes an electronic circuit board containing a processing element and a vision sensor. A carrier frame is used to support the electronic circuit board. An optical element is positioned over the sensor and supported by the carrier frame. The electronic circuit board is bent to reduce the length, thickness and/or width of the electronic device, without increasing the others of the length, thickness and/or width of the electronic device.

10. 发明授权

US09642974B2 Method and apparatus for warming intravenous fluids 有权
公开(公告)号：US09642974B2
公开(公告)日：2017-05-09
申请号：US13820779
申请日：2011-09-12
申请人： David R. King
发明人： David R. King
IPC分类号： A61M5/44 , F24J1/00 , A61M5/142
CPC分类号： A61M5/44 , A61M2005/14272 , A61M2205/3368 , A61M2205/364 , F24V30/00
摘要： A system and method for warming a fluid for intravenous administration is presented. The system includes an enclosure, a frangible bladder disposed at least partially within the enclosure, and a first reactant of an exothermic reaction disposed within the frangible bladder. The apparatus includes a second reactant of the exothermic reaction disposed within the enclosure and external to the frangible bladder, and a channel at least partially enclosed by the enclosure. The frangible bladder is configured to be ruptured to mix at least a portion of the first reactant and the second reactant to initiate the exothermic reaction, thereby warming at least a portion of the channel.

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