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1. 发明授权

US5304297A Reducing agent regeneration system 失效
标题翻译：还原剂再生系统
公开(公告)号：US5304297A
公开(公告)日：1994-04-19
申请号：US23653
申请日：1993-02-26
申请人： D. Morgan Tench , Dennis P. Anderson , Leslie F. Warren, Jr.
发明人： D. Morgan Tench , Dennis P. Anderson , Leslie F. Warren, Jr.
IPC分类号： C25C3/24 , B23K1/20 , B23K35/38 , C23C18/16 , C23G1/36 , C25C1/00 , C25C1/14 , C25C3/36 , C25D21/18 , C25D5/02 , C25D17/00
CPC分类号： B23K1/206 , B23K35/38 , C23C18/1617 , C23G1/36 , C25D21/18 , B23K2201/42
摘要： A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode. The cathode comprises an electrode having a high hydrogen overvoltage so that sufficiently negative potentials can be attained while minimizing hydrogen evolution. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte. Ideally, the anodic reaction is breakdown of water to form oxygen, which is vented, and protons that migrate across the ionic barrier to the catholyte replacing protons consumed in the ancillary process. The overall reaction in a system for restoring solderability of electronic components is reduction of metallic oxide to metal and release of oxygen, with no net chemical change in the composition of the regeneration system.
摘要翻译：提供了用于再生用于辅助化学或电化学过程中的还原剂的系统，例如恢复电子部件的可焊性。该系统包括阴极，阳极和电解质系统，其由半透性离子屏障分离成阴极电解液和阳极电解液。阴极电解质包括氧化还原对的还原成员，其可以电化学地再生。电解液系统的氧化还原电极像电池一样充电并在辅助过程中放电。在阴极处实现氧化还原对的还原成员的再生。阴极包括具有高氢过电压的电极，使得可以在使氢析出最小化的同时实现足够的负电位。化学平衡通过半透性离子屏障保持，这允许质子从阳极电解液迁移到阴极电解液，但是作为阻止阳离子从阴极电解液到阳极电解液的扩散和迁移的屏障。理想地，阳极反应是水的分解以形成被排出的氧，以及迁移穿过离子屏障到阴极电解液的质子代替在辅助过程中消耗的质子。用于恢复电子部件的可焊性的系统中的总体反应是将金属氧化物还原为金属和释放氧，而在再生系统的组成中没有净化学变化。

2. 发明授权

US5425859A Method and apparatus for assessing and restoring solderability 失效
标题翻译：评估和恢复可焊性的方法和装置
公开(公告)号：US5425859A
公开(公告)日：1995-06-20
申请号：US60328
申请日：1993-05-11
申请人： D. Morgan Tench , Dennis P. Anderson
发明人： D. Morgan Tench , Dennis P. Anderson
IPC分类号： B23K1/20 , G01N27/416 , G01N27/42 , G01N27/48 , H05K3/07 , H05K3/22 , H05K3/34 , G01N27/26
CPC分类号： B23K1/206 , B23K1/20 , G01N27/4161 , G01N27/42 , H05K3/22 , B23K2201/40 , B23K2201/42 , H05K2203/0315 , H05K2203/1157 , H05K3/07 , H05K3/3489
摘要： A sequential electrochemical reduction method and apparatus are provided for assessing and restoring solderability of electronic component leads. The method detects and quantifies the presence of metallic oxides that are detrimental to solderability by sequential electrochemical reduction in contact with an electrolyte in an inert atmosphere. A cathode having a high hydrogen overvoltage is placed in contact with the electrolyte. A solderable portion of the component to be tested is placed in contact with the cathode and the electrolyte. An inert counter electrode and a reference electrode are also placed in contact with the electrolyte. A current is passed between the cathode and inert electrode, and the voltage and current are measured as a function of time during reduction of metallic oxides on the solderable portions of the component. The measurements of voltage, current, time, and charge density may be compared with baseline data from specimens having known oxide compositions that correlate with degradation of solderability.
摘要翻译：提供了用于评估和恢复电子元件引线的可焊性的顺序电化学还原方法和装置。该方法通过在惰性气氛中与电解质接触的顺序电化学还原来检测和量化对可焊性不利的金属氧化物的存在。具有高氢过电压的阴极与电解质接触。要测试的组件的可焊接部分与阴极和电解质接触。惰性对电极和参比电极也与电解质接触。在阴极和惰性电极之间通过电流，并且在部件的可焊接部分上的金属氧化物还原期间，测量电压和电流作为时间的函数。可以将电压，电流，时间和电荷密度的测量值与具有与可焊性劣化相关的已知氧化物组成的样品的基线数据进行比较。

3. 发明授权

US5178965A Uniform solder coating on roughened substrate 失效
标题翻译：粗糙基材上的均匀焊料涂层
公开(公告)号：US5178965A
公开(公告)日：1993-01-12
申请号：US837297
申请日：1992-02-14
申请人： D. Morgan Tench , Dennis P. Anderson
发明人： D. Morgan Tench , Dennis P. Anderson
IPC分类号： B23K1/00 , B23K1/20 , C23F1/18 , C25D5/34 , H05K1/11 , H05K3/24 , H05K3/34 , H05K3/38 , H05K3/42
CPC分类号： H05K3/3473 , B23K1/0008 , B23K1/20 , C23F1/18 , H05K3/383 , B23K2201/36 , B23K2203/12 , H05K1/111 , H05K2203/0307 , H05K2203/0392 , H05K2203/043 , H05K2203/0723 , H05K2203/125 , Y10T428/12472 , Y10T428/12715
摘要： A roughened surface of a conductive substrate, such as copper, provides uniform Sn-Pb solder coatings and improved solder retention at printed wiring board (PWB) plated through-hole rims (knees) and surface pads during solder dipping or reflow. A high density of copper surface features of moderate average roughness provides the most favorable solder coating thickness distribution. Various chemical or electrochemical etching processes may be used to produce the desired copper surface topography. Reflowed solder thickness distribution in a PWB knee region attained with a ferric chloride copper etching process peaks at 4 .mu.m, which provides a good margin of safety for preventing exposure/oxidation of the underlying Cu-Sn intermetallics. The ferric chloride copper etching process yields only 1% of solder thickness measurements in the undesirable 0-1.5 .mu.m range for plated through-hole rims. Copper surface roughening is expected to greatly reduce solderability loss in mass produced PWBs. In addition, solder bearing on PWB surface pads is avoided with copper surface roughening so that alignment of surface mount component leads prior to soldering is greatly facilitated.
摘要翻译：诸如铜的导电基底的粗糙表面在焊料浸渍或回流期间提供均匀的Sn-Pb焊料涂层和改进的印刷线路板（PWB）电镀通孔边缘（膝盖）和表面焊盘处的焊料保持性。中等平均粗糙度的高密度铜表面特征提供了最有利的焊料涂层厚度分布。可以使用各种化学或电化学蚀刻工艺来产生所需的铜表面形貌。用氯化铜铜蚀刻工艺获得的PWB膝部区域中的回流焊料厚度分布达到4μm，这为防止下面的Cu-Sn金属间化合物的暴露/氧化提供了良好的安全余地。氯化铁铜蚀刻工艺在镀层通孔边缘的不合需要的0-1.5微米范围内仅产生1％的焊料厚度测量。铜表面粗糙度预计将大大降低批量生产的PWBs的可焊性损失。此外，通过铜表面粗糙化避免了PWB表面焊盘上的焊料轴承，从而大大方便了焊接前的表面安装部件引线的对准。

4. 发明授权

US5401380A Apparatus for assessing solderability 失效
标题翻译：评估可焊性的设备
公开(公告)号：US5401380A
公开(公告)日：1995-03-28
申请号：US95139
申请日：1993-07-20
申请人： D. Morgan Tench , Dennis P. Anderson
发明人： D. Morgan Tench , Dennis P. Anderson
IPC分类号： G01N27/42 , B23K1/20 , G01N27/416 , G01N27/26
CPC分类号： G01N27/4161 , B23K1/206 , B23K2201/40 , B23K2201/42 , H05K2203/0315 , H05K2203/1157
摘要： Apparatus for assessing solderability of electronic component leads and printed wiring boards by sequential electrochemical reduction. The apparatus detects and quantifies the oxides present on copper, solder, andintermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability. The apparatus is useful for testing off-the-shelf components and for control of circuit board manufacturing and assembly processes.
摘要翻译：用于通过连续电化学还原来评估电子元件引线和印刷电路板的可焊性的装置。该装置检测并量化对可焊性有害的铜，焊料和金属间化合物上存在的氧化物。要测试的部件的可焊接部分浸入电解质中以形成电极。惰性对电极和参比电极也放置在电解质中。电流从惰性对电极传递到测试部件，并且部件和参考电极之间的电位作为时间的函数被记录。在电极电位与通过的总电荷的图中，一系列拐点识别并定量存在于焊料上的特定金属氧化物。将该图与先前对具有与可焊性劣化相关的氧化物组成的老化样品的分析进行比较。该设备可用于测试现成的组件和控制电路板的制造和组装过程。

5. 发明授权

US5262022A Method of assessing solderability 失效
标题翻译：评估可焊性的方法
公开(公告)号：US5262022A
公开(公告)日：1993-11-16
申请号：US706142
申请日：1991-05-28
申请人： D. Morgan Tench , Dennis P. Anderson
发明人： D. Morgan Tench , Dennis P. Anderson
IPC分类号： G01N27/42 , B23K1/20 , G01N27/416 , G01N27/26
CPC分类号： G01N27/4161 , B23K1/206 , B23K2201/40 , B23K2201/42 , H05K2203/0315 , H05K2203/1157
摘要： A sequential electrochemical reduction method and apparatus for assessing solderability of electronic component leads and printed wiring boards. The method detects and quantifies the oxides present on copper, solder, and intermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability. The method is useful for testing off-the-shelf components and for control of circuit board manufacturing and assembly processes.
摘要翻译：用于评估电子元件引线和印刷线路板的可焊性的顺序电化学还原方法和装置。该方法检测和量化铜，焊料和金属间化合物上存在的对可焊性有害的氧化物。要测试的部件的可焊接部分浸入电解质中以形成电极。惰性对电极和参比电极也放置在电解质中。电流从惰性对电极传递到测试部件，并且部件和参考电极之间的电位作为时间的函数被记录。在电极电位与通过的总电荷的图中，一系列拐点识别并定量存在于焊料上的特定金属氧化物。将该图与先前对具有与可焊性劣化相关的氧化物组成的老化样品的分析进行比较。该方法可用于测试现成的组件和控制电路板的制造和组装过程。

6. 发明授权

US5104494A Method of restoring solderability 失效
标题翻译：恢复可焊性的方法
公开(公告)号：US5104494A
公开(公告)日：1992-04-14
申请号：US724644
申请日：1991-07-02
申请人： D. Morgan Tench , Dennis P. Anderson
发明人： D. Morgan Tench , Dennis P. Anderson
IPC分类号： B23K1/00 , B23H9/00 , B23K1/20 , C25C1/00 , H05K3/07 , H05K3/22 , H05K3/34
CPC分类号： H05K3/22 , B23H9/00 , B23K1/20 , B23K2201/36 , H05K2203/0315 , H05K2203/1157 , H05K3/07
摘要： A low-temperature, nondestructive method of electrochemical reduction is provided for restoring solderability of oxidized electronic component leads and solderable portions of printed wiring boards. The component or circuit board is immersed in an electrolyte solution. The electrolyte is chosen to be non-reactive with the circuit board and component materials. In one embodiment, the electrolyte comprises a benign borate buffer solution. The solderable portion of the component or circuit board is connected to the cathode of an electric power source to form a first electrode. A second, inert electrode is connected to the anode of the current source and immersed in the electrolyte. Current passing between the electrodes electrochemically reduces the metallic oxides on the solderable portions of the component or circuit board. In a second embodiment, the electrolyte comprises an active reducing agent. When the solderable portion of the component or circuit board is immersed in the reducing agent, localized galvanic action causes reduction of any metallic oxides without connection to an external power source. This is particularly useful for restoring solderability of printed wiring boards having non-interconnected circuitry. Reduction of the oxides to their metallic form restores and ensures solderability of the solderable portions of the electronic component or printed wiring board.
摘要翻译：提供了电化学还原的低温，非破坏性方法，用于恢复氧化电子部件引线和印刷线路板的可焊接部分的可焊性。将部件或电路板浸入电解液中。电解质被选择为与电路板和组件材料不反应。在一个实施方案中，电解质包含良性硼酸盐缓冲溶液。部件或电路板的可焊接部分连接到电源的阴极以形成第一电极。第二惰性电极连接到电流源的阳极并浸入电解质中。电极之间的电流通过电化学方式减少部件或电路板的可焊接部分上的金属氧化物。在第二个实施方案中，电解质包含活性还原剂。当组件或电路板的可焊接部分浸入还原剂中时，局部电化作用导致任何金属氧化物的还原，而不与外部电源连接。这对于恢复具有非互连电路的印刷电路板的可焊性特别有用。将氧化物还原为其金属形状还原并确保电子部件或印刷线路板的可焊接部分的可焊性。

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