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    • 3. 发明授权
    • Nitride-based light emitting device and method of manufacturing the same
    • 氮化物基发光器件及其制造方法
    • US07180094B2
    • 2007-02-20
    • US10957704
    • 2004-10-05
    • Tae-yeon SeongKyoung-kook KimJune-o SongDong-seok Leem
    • Tae-yeon SeongKyoung-kook KimJune-o SongDong-seok Leem
    • H01L29/04
    • H01L33/42H01L33/32H01L33/405H01L2933/0016
    • Provided are a nitride-based light emitting device and a method of manufacturing the same. The nitride-based light emitting device has a structure in which at least an n-cladding layer, an active layer, and a p-cladding layer are sequentially formed on a substrate. The light emitting device further includes an ohmic contact layer composed of a zinc (Zn)-containing oxide containing a p-type dopant formed on the p-cladding layer. The method of manufacturing the nitride-based light emitting device includes forming an ohmic contact layer composed of Zn-containing oxide containing a p-type dopant on the p-cladding layer, the ohmic contact layer being made and annealing the resultant structure. The nitride-based light emitting device and manufacturing method provide excellent I–V characteristics by improving ohmic contact with a p-cladding layer while significantly enhancing light emission efficiency of the device due to high light transmittance of a transparent electrode.
    • 提供一种氮化物系发光器件及其制造方法。 氮化物系发光器件具有在衬底上依次形成至少n包层,有源层和p包层的结构。 发光装置还包括由含有含锌(Zn)的氧化物构成的欧姆接触层,该氧化物含有形成在p包覆层上的p型掺杂剂。 制造氮化物系发光器件的方法包括在p包覆层上形成由含有p型掺杂剂的含Zn氧化物构成的欧姆接触层,形成欧姆接触层并退火所得到的结构。 基于氮化物的发光器件和制造方法通过改善与p型覆层的欧姆接触而提供优异的I-V特性,同时由于透明电极的高透光率而显着提高了器件的发光效率。
    • 9. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US07541207B2
    • 2009-06-02
    • US11714843
    • 2007-03-07
    • June-o SongDong-seok LeemTae-yeon Seong
    • June-o SongDong-seok LeemTae-yeon Seong
    • H01L21/285H01L33/00
    • H01L33/405H01L33/32H01L33/42H01L2933/0016
    • A light emitting device and a method of manufacturing the same are provided. A light emitting device has a structure wherein a substrate, an n-type clad layer, a light emitting layer, a p-type clad layer, an ohmic contact layer, and a reflective layer are successively stacked. The ohmic contact layer is formed by adding an additional element to an indium oxide. According to the light emitting device and the method of manufacturing the same, the characteristics of ohmic contact with a p-type clad layer is improved, thus increasing the efficiency and yield of wire bonding during packaging FCLEDS. Also, it is possible to increase the light emitting efficiency and life span of light emitting devices due to the low contactless resistance and the excellent electric current and voltage characteristic.
    • 提供一种发光器件及其制造方法。 发光器件具有依次层叠基板,n型覆盖层,发光层,p型覆盖层,欧姆接触层和反射层的结构。 通过向氧化铟中加入附加元素来形成欧姆接触层。 根据发光器件及其制造方法,提高了与p型覆盖层的欧姆接触的特性,从而提高了包装FCLEDS期间引线接合的效率和产率。 此外,由于低的非接触电阻和优异的电流和电压特性,可以提高发光器件的发光效率和寿命。
    • 10. 发明授权
    • Flip-chip light emitting diode and method of manufacturing the same
    • 倒装芯片发光二极管及其制造方法
    • US07358541B2
    • 2008-04-15
    • US11002797
    • 2004-12-03
    • Tae-yeon SeongJune-o SongDong-seok Leem
    • Tae-yeon SeongJune-o SongDong-seok Leem
    • H01L29/22H01L29/227H01L33/00
    • H01L33/405H01L33/0095
    • Provided are a flip-chip light emitting diode (FCLED) and a method of manufacturing the same. The provided FCLED is formed by sequentially depositing an n-type cladding layer, an active layer, a p-type cladding layer, and a reflective layer on a substrate. The reflective layer is formed of the alloy of silver to which a solute element is added. According to the provided FCLED and the method of manufacturing the same, a thermal stability is improved to improve an ohmic contact characteristic to a p-type cladding layer, thus a wire bonding efficiency and a yield are improved when packaging the provided FCLED. In addition, the light emitting efficiency and the lifespan of the provided FCLED are improved due to a low specific-contact resistance and an excellent current-voltage characteristic.
    • 提供了一种倒装芯片发光二极管(FCLED)及其制造方法。 所提供的FCLED通过在衬底上依次沉积n型包覆层,有源层,p型包覆层和反射层而形成。 反射层由添加溶质元素的银合金形成。 根据提供的FCLED及其制造方法,改善了热稳定性以提高p型包覆层的欧姆接触特性,从而在包装所提供的FCLED时提高了引线接合效率和收率。 此外,由于具有低的比接触电阻和优异的电流 - 电压特性,提供的FCLED的发光效率和寿命得到改善。