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1. 发明申请

US20140116466A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD 有权
标题翻译：基板清洗装置和基板清洗方法
公开(公告)号：US20140116466A1
公开(公告)日：2014-05-01
申请号：US14061686
申请日：2013-10-23
申请人： Ebara Corporation
发明人： Koji Maeda , Soichi ISOBE , Hiroshi SHIMOMOTO , Hideaki TANAKA
IPC分类号： H01L21/02 , H01L21/66
CPC分类号： H01L21/02057 , H01L21/67046
摘要： A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.
摘要翻译：基板清洁装置用细长的圆筒形辊清洁构件进行基板表面的擦洗清洁。基板清洗装置包括用于支撑清洁部件并旋转辊清洁部件的辊保持器，用于使辊保持器垂直移动的垂直移动机构，使得辊清洁部件在清洁基板时向基板施加辊荷载通过具有调节装置的致动器的致动器，用于测量辊荷载的测力传感器，以及控制器，用于根据称重传感器的测量值对通过调节装置的辊载荷进行反馈控制。基板清洗装置还包括监视单元，用于监视调节装置的操作量是否超出对应于预设滚动载荷的操作量的预设基准值的允许范围。

2. 发明申请

US20170271178A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD 有权
公开(公告)号：US20170271178A1
公开(公告)日：2017-09-21
申请号：US15616582
申请日：2017-06-07
申请人： EBARA CORPORATION
发明人： Koji MAEDA , Soichi ISOBE , Hiroshi SHIMOMOTO , Hideaki TANAKA
IPC分类号： H01L21/67 , H01L21/02
CPC分类号： H01L21/02057 , H01L21/67046
摘要： A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

3. 发明申请

US20210394332A1 SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20210394332A1
公开(公告)日：2021-12-23
申请号：US17041734
申请日：2020-03-04
申请人： EBARA CORPORATION
发明人： Kuniaki YAMAGUCHI , Hiroshi SHIMOMOTO , Soichi ISOBE , Koji MAEDA , Kenji SHINKAI , Hidetatsu ISOKAWA , Dai YOSHINARI , Masayuki TAMURA , Haiyang XU , Shun EHARA , Kentaro ASANO
IPC分类号： B24B37/015 , B24B57/02 , B24B53/00
摘要： A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

4. 发明申请

US20230001539A1 LIQUID FEEDER AND POLISHING APPARATUS 有权
公开(公告)号：US20230001539A1
公开(公告)日：2023-01-05
申请号：US17809074
申请日：2022-06-27
申请人： EBARA CORPORATION
发明人： Kuniaki YAMAGUCHI , Masayuki TAMURA , Kenji SHINKAI , Soichi ISOBE , Yusuke MOCHIDA
IPC分类号： B24B53/00 , B24B53/017 , B24B57/02
摘要： A liquid feeder includes: a first arm having a first nozzle; a second arm having a second nozzle; a first rotation shaft supporting a proximal end part of the first arm; a second rotation shaft supporting a proximal end part of the second arm; a first rotation driver configured to rotate the first rotation shaft to turn the first arm from a fluid feed position to a retracted position; a second rotation driver configured to rotate the second rotation shaft to turn the second arm from a fluid feed position to a retracted position; and a controller. The first rotation shaft and the second rotation shaft are disposed coaxially with each other. The controller is capable of controlling the operation of the first rotation driver and the operation of the second rotation driver independently of each other.

5. 发明申请

US20180001440A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
公开(公告)号：US20180001440A1
公开(公告)日：2018-01-04
申请号：US15615375
申请日：2017-06-06
申请人： Ebara Corporation
发明人： Hiroshi AONO , Kuniaki YAMAGUCHI , Hiroshi SHIMOMOTO , Koji MAEDA , Tetsuya YASHIMA , Kenji SHINKAI , Koichi HASHIMOTO , Mitsuhiko INABA , Hidetatsu ISOKAWA , Hidetaka NAKAO , Soichi ISOBE
IPC分类号： B24B37/34 , H01L21/67 , B24B37/10 , B08B3/12 , B08B1/04 , H01L21/687 , B08B1/00
摘要： A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

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