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1. 发明授权

US11478895B2 Substrate holding device, substrate polishing apparatus, and method of manufacturing the substrate holding device 有权
公开(公告)号：US11478895B2
公开(公告)日：2022-10-25
申请号：US16655639
申请日：2019-10-17
申请人： Ebara Corporation
发明人： Shingo Togashi , Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya
IPC分类号： B24B37/32 , B24B37/20
摘要： Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.

2. 发明授权

US11088011B2 Elastic membrane, substrate holding device, and polishing apparatus 有权
公开(公告)号：US11088011B2
公开(公告)日：2021-08-10
申请号：US15950989
申请日：2018-04-11
申请人： EBARA CORPORATION
发明人： Satoru Yamaki , Makoto Fukushima , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Tomoko Owada , Yoshikazu Kato
IPC分类号： H01L21/687 , B24B7/04 , B24B37/10 , B24B37/30
摘要： An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

3. 发明申请

US20210217647A1 SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD, SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, METHOD OF REMOVING LIQUID FROM UPPER SUFACE OF WAFER TO BE POLISHED, ELASTIC FILM FOR PRESSING WAFER AGAINST POLISHING PAD, SUBSTRATE RELEASE METHOD, AND CONSTANT AMOUNT GAS SUPPLY APPARATUS 有权
公开(公告)号：US20210217647A1
公开(公告)日：2021-07-15
申请号：US17213748
申请日：2021-03-26
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Satoru Yamaki , Makoto Fukushima
IPC分类号： H01L21/683 , H01L21/67 , H01L21/02 , B24B37/30 , B24B37/04 , B24B37/005
摘要： A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.

4. 发明授权

US10035239B2 Polishing apparatus, polishing head, and retainer ring 有权
公开(公告)号：US10035239B2
公开(公告)日：2018-07-31
申请号：US15163571
申请日：2016-05-24
申请人： EBARA CORPORATION
发明人： Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya
IPC分类号： B24B37/32 , B24B37/20
摘要： A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.

5. 发明授权

US09999956B2 Polishing device and polishing method 有权
公开(公告)号：US09999956B2
公开(公告)日：2018-06-19
申请号：US14672747
申请日：2015-03-30
申请人： Ebara Corporation
发明人： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima , Shingo Togashi , Satoru Yamaki , Shintaro Isono
IPC分类号： B24B37/015 , B24B37/32 , B24B37/34 , B24B49/00 , B24B49/10 , B24B49/12
CPC分类号： B24B37/015 , B24B37/32 , B24B37/345 , B24B49/003 , B24B49/105 , B24B49/12
摘要： A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.

6. 发明授权

US09833875B2 Polishing apparatus and retainer ring configuration 有权
公开(公告)号：US09833875B2
公开(公告)日：2017-12-05
申请号：US14710535
申请日：2015-05-12
申请人： EBARA CORPORATION
发明人： Osamu Nabeya
IPC分类号： B24B37/32 , B24B37/10 , B24B41/00 , B24B37/30
CPC分类号： B24B37/32 , B24B37/107 , B24B37/30 , B24B41/007
摘要： A polishing apparatus capable of preventing wear of rollers which are to transmit a load to a retainer ring and capable of preventing wear particles from escaping outside is disclosed. The polishing apparatus includes: a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together with a head body; a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring; a stationary ring disposed on the rotary ring; and a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the stationary ring. The rotary ring has rollers which are in contact with the stationary ring.

7. 外观设计

USD793976S1 Substrate retaining ring 有权
公开(公告)号：USD793976S1
公开(公告)日：2017-08-08
申请号：US29573831
申请日：2016-08-10
申请人： EBARA CORPORATION
设计人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki

8. 发明授权

US09662764B2 Substrate holder, polishing apparatus, and polishing method 有权
公开(公告)号：US09662764B2
公开(公告)日：2017-05-30
申请号：US13752659
申请日：2013-01-29
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
IPC分类号： B24B37/04 , B24B37/32 , B24B37/30
CPC分类号： B24B37/32 , B24B37/04 , B24B37/042 , B24B37/30
摘要： The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.

9. 发明授权

US09550271B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US09550271B2
公开(公告)日：2017-01-24
申请号：US14599976
申请日：2015-01-19
申请人： EBARA CORPORATION
发明人： Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya , Masahiko Kishimoto
IPC分类号： B24B37/32 , B24B7/22 , B24B37/10
CPC分类号： B24B37/32 , B24B37/107
摘要： A substrate holding apparatus and a polishing apparatus which can reduce vibrations of a top ring in its entirety by damping vibrations transmitted from a retaining ring to a top ring body is disclosed. The substrate holding apparatus includes a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface, a retaining ring configured to surround the substrate and to contact the polishing surface, and a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect the ring member and the central member. The drive ring includes a first material and a second material having a modulus of longitudinal elasticity smaller than the first material.
摘要翻译：公开了一种基板保持装置和抛光装置，其可以通过阻止从保持环传递到顶环体的振动来整体减小顶环的振动。基板保持装置包括：顶环主体，具有基板保持面，被配置为将基板保持并压靠在研磨面上;保持环，被配置为围绕基板并接触抛光面;以及驱动环，其包括环状构件将保持环保持在其下表面上，中心构件设置在顶环体的中心部分并由顶环体支撑，以及连接部分，其构造成连接环构件和中心构件。驱动环包括第一材料和具有小于第一材料的纵向弹性模量的第二材料。

10. 外观设计

USD769200S1 Elastic membrane for semiconductor wafer polishing apparatus 有权
标题翻译：用于半导体晶片抛光装置的弹性膜
公开(公告)号：USD769200S1
公开(公告)日：2016-10-18
申请号：US29472346
申请日：2013-11-12
申请人： EBARA CORPORATION
设计人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki

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