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1. 发明授权

US08625029B2 HDMI source detection 失效
标题翻译： HDMI源检测
公开(公告)号：US08625029B2
公开(公告)日：2014-01-07
申请号：US12002378
申请日：2007-12-17
申请人： Paul Doyle , Eiji Kono , Tetsuya Nomura , Peter Rae Shintani
发明人： Paul Doyle , Eiji Kono , Tetsuya Nomura , Peter Rae Shintani
IPC分类号： H04N7/00 , H04N11/00 , H04N5/44 , H04N3/27 , H04N5/46
CPC分类号： H04N5/44 , G09G5/006 , G09G2320/08 , G09G2370/047 , G09G2370/12 , H01R13/641 , H04N21/43635 , H04N21/44231
摘要： A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
摘要翻译：用于通过HDMI接收器连接器将HDMI源设备检测到HDMI信宿设备的电路不考虑HDMI源设备的活动状态，具有上拉电阻器，其具有第一和第二端子，其中第一端子耦合到DC电源资源。开关器件在电路节点处耦合在上拉电阻器的第二端子和地之间。当从HDMI接收器连接器电源引脚向其控制端施加电力时，切换装置被接通以将电路节点耦合到地，否则被切断。电路节点耦合到HDMI接收器连接器的DDC / CEC GROUND引脚。电路节点可读取为二进制信号，以指示源设备到HDMI接收器连接器的存在，其中当节点通过DDC / CEC GROUND引脚连接到源设备接地时，节点呈现逻辑低信号，或当开关器件接通时。该摘要不被认为是限制性的，因为其他实施例可能偏离本摘要中描述的特征。

2. 发明申请

US20090139704A1 HEAT SINK DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20090139704A1
公开(公告)日：2009-06-04
申请号：US11910460
申请日：2006-04-06
申请人： Kota Otoshi , Eiji Kono , Hidehito Kubo , Masahiko Kimbara , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
发明人： Kota Otoshi , Eiji Kono , Hidehito Kubo , Masahiko Kimbara , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
IPC分类号： F28F7/00
CPC分类号： H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K3/4015 , H05K2201/0373 , H05K2201/09681 , H05K2201/0969 , Y02P70/613 , H01L2924/00
摘要： A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
摘要翻译：散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在绝缘基板3与发热元件安装侧相反。应力松弛部件4介于绝缘基板3的金属层7和散热片5之间。应力松弛部件4由形成有多个通孔9的铝板10形成，通孔9 作为应力吸收空间。应力松弛部件4钎焊到绝缘基板3的金属层7和散热片5.该散热器1的材料成本低，散热性能优异。

3. 发明授权

US07364632B2 Radiator member for electronic appliances and processes for producing the same 失效
标题翻译：用于电子设备的散热器构件及其制造方法
公开(公告)号：US07364632B2
公开(公告)日：2008-04-29
申请号：US10472802
申请日：2002-03-14
申请人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Eiji Kono , Naohisa Nishino
发明人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Eiji Kono , Naohisa Nishino
IPC分类号： C22C21/00 , C22C29/02
CPC分类号： C22C29/065 , B22F2999/00 , C22C1/1036 , C22C32/0063 , C22C2001/1073 , H01L23/3733 , H01L2924/0002 , Y10T428/12736 , B22F1/0014 , H01L2924/00
摘要： The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressurizing.When the molten-metal temperature and the pre-heating temperature are from the melting point or more of the matrix metal to less than the reaction initiator temperature, it is possible to inhibit the generation of low thermal conductive materials while securing the impregnation of the molten metal into the SiC powder.
摘要翻译：本发明是一种电子电器用散热构件的制造方法，其特征在于，在电子电器用散热构件的制造方法中，散热构件包括SiC颗粒分散在基体金属中的复合材料其主要成分是Al，其包括将SiC粉末填充到模具中的填充步骤，在填充步骤之后将模具预加热到预热温度的预热步骤，该预热温度落在熔化范围内所述基体金属的一个或多个点小于SiC粉末中的基体金属和SiC颗粒的熔融金属开始反应的反应引发温度，以及将熔融金属温度下降的熔融基质金属倒出的倾倒步骤在从基体金属的熔点以上到小于反应开始温度的范围内，在预热工序后进入模具，并将SiC粉末浸渍在通过加压熔融金属。当熔融金属温度和预热温度从基体金属的熔点或更高温度到小于反应引发剂温度时，可以在确保浸渍熔融金属的温度的同时，抑制低导热材料的产生金属进入SiC粉末。

4. 发明授权

US06882096B2 Active landing control system for raster based devices 失效
标题翻译：基于光栅的设备的主动着陆控制系统
公开(公告)号：US06882096B2
公开(公告)日：2005-04-19
申请号：US10616669
申请日：2003-07-10
申请人： Peter Rae Shintani , Ban Kawamura , Eiji Kono
发明人： Peter Rae Shintani , Ban Kawamura , Eiji Kono
IPC分类号： H01J29/38 , H01J29/70 , H01J29/76 , H04N3/233
CPC分类号： H01J29/705 , H01J2229/5688 , H04N3/2335
摘要： Correction of electron beam landing misalignment in a raster-type display is undertaken without using the usual set of coils, but rather by superimposing a landing misalignment correction signal on the already-existing velocity modulation (VM) coil or on another coil located at the junction of the electron beams in the neck of the display. The correction signal may be varied based on pressure, temperature, and ambient magnetic field as indicated by respective sensors to appropriately correct electron beam landing on phosphors the positions of which may be affected by variations in magnetic fields, temperature, and pressure.
摘要翻译：在光栅型显示器中进行电子束着陆未对准的校正是在不使用通常的一组线圈的情况下进行的，而是通过在已经存在的速度调制（VM）线圈或位于结的另一个线圈上叠加着陆不对准校正信号的电子束在显示器的颈部。校正信号可以基于由各个传感器指示的压力，温度和环境磁场而变化，以适当地校正荧光体上的电子束着落，其位置可能受到磁场，温度和压力的变化的影响。

5. 发明申请

US20050007040A1 Active landing control system for raster based devices 失效
公开(公告)号：US20050007040A1
公开(公告)日：2005-01-13
申请号：US10616669
申请日：2003-07-10
申请人： Peter Shintani , Ban Kawamura , Eiji Kono
发明人： Peter Shintani , Ban Kawamura , Eiji Kono
IPC分类号： H01J29/38 , H01J29/70 , H01J29/76 , H04N3/233
CPC分类号： H01J29/705 , H01J2229/5688 , H04N3/2335
摘要： Correction of electron beam landing misalignment in a raster-type display is undertaken without using the usual set of coils, but rather by superimposing a landing misalignment correction signal on the already-existing velocity modulation (VM) coil or on another coil located at the junction of the electron beams in the neck of the display. The correction signal may be varied based on pressure, temperature, and ambient magnetic field as indicated by respective sensors to appropriately correct electron beam landing on phosphors the positions of which may be affected by variations in magnetic fields, temperature, and pressure.

6. 发明授权

US06753093B2 Heat dissipating material and manufacturing method thereof 失效
标题翻译：散热材料及其制造方法
公开(公告)号：US06753093B2
公开(公告)日：2004-06-22
申请号：US10247953
申请日：2002-09-20
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Takashi Yoshida , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Takashi Yoshida , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B702
CPC分类号： B32B15/015 , B22D19/14 , C22C1/0475 , H01L21/4871 , H01L23/3735 , H01L24/32 , Y10T428/12063 , Y10T428/12069 , Y10T428/12493 , Y10T428/12528 , Y10T428/12951
摘要： A heat spreader includes an electromagnetic soft iron sheet and a plating layer formed on the surface of the sheet. The plate is made of a rustproof metal. An electronic component is mounted on an aluminum base with an HITT substrate and the heat spreader in between. The heat spreader is manufactured at low cost and has a favorable property as a heat dissipating material.
摘要翻译：散热器包括电磁软铁片和形成在片材表面上的镀层。该板由防锈金属制成。电子部件安装在具有HITT基板的铝基座和散热器之间。散热器以低成本制造并且具有作为散热材料的有利特性。

7. 发明授权

US06597574B2 Radiator plate and process for manufacturing the same 失效
公开(公告)号：US06597574B2
公开(公告)日：2003-07-22
申请号：US10038265
申请日：2001-10-24
申请人： Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： H05K720
CPC分类号： H01L23/3733 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller than that of the metallic matrix. The radiator plate has a heat-receiving surface, on which an electric device serving as a heat generator is disposed, and a heat-radiating surface for radiating heat received from the heat-receiving surface. The dispersant is dispersed more on the heat-receiving-surface side than on the heat-radiating-surface side. Thus, the radiator plate is inhibited from warping, and is good in terms of the dimensional stability as a final product. Moreover, the thermal resistance is diminished between the heat-receiving surface and the heat-radiating surface. Accordingly, the heat-radiating ability of the radiator plate is secured. Also disclosed is a process for manufacturing the radiator plate.

8. 发明申请

US20140140004A1 HEAT SINK FOR POWER MODULE 审中-公开
标题翻译：电源模块散热器
公开(公告)号：US20140140004A1
公开(公告)日：2014-05-22
申请号：US13779519
申请日：2013-02-27
申请人： Hidehito KUBO , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Hidehito KUBO , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.
摘要翻译：功率模块包括功率器件和散热器。散热器包括冷却介质流动的制冷剂通道和布置在制冷剂通道中的波纹状散热片体。制冷剂通道由表面和背面限定，并且动力装置设置在表面附近。波纹状散热片本体具有沿着冷却介质的流动方向延伸的波峰和波谷，每个侧壁将相应的波峰与相邻的波谷连接。布置在相邻侧壁之间的每个相邻的一对侧壁和相应的一个峰或相应的一个槽形成翅片。在每个散热片中布置有沿冷却介质的流动方向延伸并且用于搅拌冷却介质的引导件。

9. 发明授权

US08411438B2 Heat sink for power module 失效
标题翻译：电源模块散热片
公开(公告)号：US08411438B2
公开(公告)日：2013-04-02
申请号：US11922945
申请日：2006-06-27
申请人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
摘要翻译：用于功率模块的散热器（1）能够将功率器件（101）安装在散热器的至少一个表面上。散热器包括散发由动力装置（101）产生的热量的冷却介质流动的制冷剂通路（1d）和布置在制冷剂通路（1d）中的波纹状散热片体（1a）。波纹状散热片体（1a）具有在冷却介质的流动方向上延伸的波峰（21b）和槽（21c），以及各个顶部（21b）的相应一个与相邻的顶部一个槽（21c）。布置在相邻侧壁（21a）之间的每个相邻的一对侧壁（21a）和相应的一个峰（21b）或相应的一个槽（21c）形成翅片（21）。每个侧壁（21a）具有操作以使至少旋转在相关联的翅片（21）中流动的冷却介质的百叶窗（31）。因此，散热器（1）具有进一步改善的散热性能。

10. 发明授权

US08299606B2 Semiconductor device includes a ceramic substrate and heat sink 有权
标题翻译：半导体器件包括陶瓷衬底和散热器
公开(公告)号：US08299606B2
公开(公告)日：2012-10-30
申请号：US13361446
申请日：2012-01-30
申请人： Shogo Mori , Eiji Kono , Keiji Toh
发明人： Shogo Mori , Eiji Kono , Keiji Toh
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.
摘要翻译：提供一种半导体器件，其可以包括具有陶瓷衬底和在陶瓷衬底的相对表面上的金属涂层的绝缘衬底，安装在绝缘衬底的一个表面上的半导体芯片和直接或间接固定到另一个的散热器绝缘基板的表面，并通过绝缘基板热连接到半导体芯片。散热器可以包括由金属板制成的壳体和固定在壳体中并由铝制成的散热片。金属片可以具有绝缘基板和散热片之间的热膨胀系数。

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