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    • 1. 发明申请
    • COMPACT TID HARDENING NMOS DEVICE AND FABRICATION PROCESS
    • 紧凑的钽硬化NMOS器件和制造工艺
    • US20130285147A1
    • 2013-10-31
    • US13870860
    • 2013-04-25
    • Fethi Dhaoui
    • Fethi Dhaoui
    • H01L29/78H01L29/66
    • H01L29/78H01L29/0653H01L29/0692H01L29/1083H01L29/66477H01L29/66568H01L29/6659H01L29/7836
    • A radiation-hardened transistor is formed in a p-type semiconductor body having an active region doped to a first level and surrounded by a dielectric filled shallow trench isolation region. N-type source/drain regions are disposed in the active region and spaced apart to define a channel. A gate is disposed above the channel, and is self-aligned with the source/drain regions. First and second p-type regions are disposed in the p-type semiconductor body on either side of one of the source/drain regions and are doped to a second level higher than the first doping level. The first and second p-type regions are self aligned with and extend outwardly from a first side edge of the gate. The ends of the gate extend past the first and second p-type regions.
    • 辐射硬化晶体管形成在p型半导体本体中,该半导体主体具有掺杂到第一电平的有源区,并被介质填充的浅沟槽隔离区包围。 N型源极/漏极区域设置在有源区域中并间隔开以限定沟道。 栅极设置在通道上方,并且与源极/漏极区域自对准。 第一和第二p型区域设置在源极/漏极区域之一的任一侧上的p型半导体本体中,并且被掺杂到高于第一掺杂水平的第二电平。 第一和第二p型区域与栅极的第一侧边缘自对准并向外延伸。 栅极的端部延伸超过第一和第二p型区域。
    • 5. 发明申请
    • REDUCED-EDGE RADIATION-TOLERANT NON-VOLATILE TRANSISTOR MEMORY CELLS
    • 降低辐射耐受非挥发性晶体管存储器细胞
    • US20100044768A1
    • 2010-02-25
    • US12196978
    • 2008-08-22
    • Michael SaddFethi DhaouiJohn McCollumRichard Chan
    • Michael SaddFethi DhaouiJohn McCollumRichard Chan
    • H01L29/788H01L21/336
    • H01L27/11519H01L27/11521H01L27/11565H01L27/11568H01L29/66825H01L29/66833
    • An edgeless one-transistor flash memory array includes transistors that have two polysilicon gate layers that overlay an active region. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region. An edgeless two-transistor programmable memory includes memory cells that have two active devices. Two polysilicon gate layers overlay two active regions and are shared between the two active devices. One of the devices is used to program and erase the cell while the other used as a programmable switch in a programmable logic device. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region.
    • 无边形单晶体管闪存阵列包括具有覆盖有源区域的两个多晶硅栅极层的晶体管。 底部多晶硅栅极层被电隔离。 存储器被配置为使得电流在底部多晶硅层下方从漏极流到源极,使得其不接近场氧化物区域。 无刃双晶体管可编程存储器包括具有两个有源器件的存储器单元。 两个多晶硅栅极层覆盖两个有源区,并在两个有源器件之间共享。 其中一个器件用于编程和擦除单元,而另一个用作可编程逻辑器件中的可编程开关。 底部多晶硅栅极层被电隔离。 存储器被配置为使得电流在底部多晶硅层下方从漏极流到源极,使得其不接近场氧化物区域。
    • 7. 发明授权
    • Low-capacitance input/output and electrostatic discharge circuit for protecting an integrated circuit from electrostatic discharge
    • 低电容输入/输出和静电放电电路,用于保护集成电路免受静电放电
    • US07482218B1
    • 2009-01-27
    • US11677441
    • 2007-02-21
    • John McCollumFethi Dhaoui
    • John McCollumFethi Dhaoui
    • H01L21/8238
    • H01L29/1083H01L27/0266H01L29/7833
    • A transistor formed on a semiconductor substrate of a first conductivity type in a well formed in the substrate and doped with the first conductivity type to an impurity level higher than that of the substrate. A drain doped to a second conductivity type opposite to said first conductivity type is disposed in the well. A pair of opposed source regions doped to the second conductivity type are disposed in the well and are electrically coupled together. They are separated from opposing outer edges of the drain region by channels. A pair of gates are electrically coupled together and disposed above and insulated from the channels. A region of the well disposed below the drain is doped so as to reduce capacitive coupling between the drain and the well.
    • 一种形成在第一导电类型的半导体衬底上的晶体管,其形成在衬底中,并且掺杂有第一导电类型的杂质水平高于衬底的杂质水平。 掺杂到与所述第一导电类型相反的第二导电类型的漏极设置在阱中。 掺杂到第二导电类型的一对相对的源极区域设置在阱中并且电耦合在一起。 它们通过通道与漏极区域的相对的外边缘分离。 一对门电耦合在一起并设置在通道上方并与通道绝缘。 掺杂在漏极下方的阱的区域被掺杂以便减小漏极和阱之间的电容耦合。
    • 9. 发明授权
    • Reduced-edge radiation-tolerant non-volatile transistor memory cells
    • 降低辐射耐受性的非易失性晶体管存储单元
    • US07906805B2
    • 2011-03-15
    • US12196978
    • 2008-08-22
    • Michael SaddFethi DhaouiJohn McCollumRichard Chan
    • Michael SaddFethi DhaouiJohn McCollumRichard Chan
    • H01L29/788
    • H01L27/11519H01L27/11521H01L27/11565H01L27/11568H01L29/66825H01L29/66833
    • An edgeless one-transistor flash memory array includes transistors that have two polysilicon gate layers that overlay an active region. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region. An edgeless two-transistor programmable memory includes memory cells that have two active devices. Two polysilicon gate layers overlay two active regions and are shared between the two active devices. One of the devices is used to program and erase the cell while the other used as a programmable switch in a programmable logic device. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region.
    • 无边形单晶体管闪存阵列包括具有覆盖有源区域的两个多晶硅栅极层的晶体管。 底部多晶硅栅极层被电隔离。 存储器被配置为使得电流在底部多晶硅层下方从漏极流到源极,使得其不接近场氧化物区域。 无刃双晶体管可编程存储器包括具有两个有源器件的存储器单元。 两个多晶硅栅极层覆盖两个有源区,并在两个有源器件之间共享。 其中一个器件用于编程和擦除单元,而另一个用作可编程逻辑器件中的可编程开关。 底部多晶硅栅极层被电隔离。 存储器被配置为使得电流在底部多晶硅层下方从漏极流到源极,使得其不接近场氧化物区域。