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    • 5. 发明申请
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US20090278231A1
    • 2009-11-12
    • US12458496
    • 2009-07-14
    • Kouichi NagaiHideaki KikuchiNaoya SashidaYasutaka Ozaki
    • Kouichi NagaiHideaki KikuchiNaoya SashidaYasutaka Ozaki
    • H01L29/92H01L21/02
    • H01L27/11502H01L21/02063H01L27/0688H01L27/11585H01L27/1159H01L28/57
    • The semiconductor device comprises a first insulation film 26 formed over a semiconductor substrate 10, first conductor plug 32 buried in a first contact hole 28a formed down to a source/drain diffused layer 22, a capacitor 44 formed over the first insulation film 26, a first hydrogen diffusion preventing film 48 formed over the first insulation film 26, covering the capacitor 44, a second insulation film 50 formed over the first hydrogen diffusion preventing film and having the surface planarized, a second hydrogen diffusion preventing film 52 formed over the first hydrogen diffusion preventing film 26 and having the surface planarized, a second hydrogen diffusion preventing film 52 formed over the second insulation film 50, second conductor plug 62 buried in a second contact hole 56 formed down to the lower electrode 38 or the upper electrode 42 of the capacitor 44, a third conductor plug 62 buried in a third contact hole 58 formed down to the first conductor plug 32, and an interconnection 64 connected to the second conductor plug 62 or the third conductor plug 62.
    • 半导体器件包括形成在半导体衬底10上的第一绝缘膜26,埋在第一接触孔28a中的第一导体插塞32,第一接触孔28a形成在源极/漏极扩散层22上,形成在第一绝缘膜26上的电容器44 在第一绝缘膜26上形成的覆盖电容器44的第一氢扩散防止膜48,形成在第一氢扩散防止膜上并具有表面平坦化的第二绝缘膜50,形成在第一氢上的第二氢扩散防止膜52 具有表面平坦化的扩散防止膜26,形成在第二绝缘膜50上的第二氢扩散防止膜52,埋在第二接触孔56中的第二导体插塞62,第二接触孔56形成在下电极38或下电极38的上电极42 电容器44,埋在第一接触孔58中的第三导体插头62,并形成在第一导体插塞32的下方 连接到第二导体插头62或第三导体插头62的部分64。