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    • 3. 发明授权
    • Insulated wire having spiral end and method for connecting the same
    • 具有螺旋端的绝缘电线及其连接方法
    • US06420656B1
    • 2002-07-16
    • US09512257
    • 2000-02-24
    • Hiroyasu SugiyamaYoshifumi KawataKyuzo Suzuki
    • Hiroyasu SugiyamaYoshifumi KawataKyuzo Suzuki
    • H01B700
    • H01R4/14
    • The invention intends to simplify the connecting operation of an insulated wire and a pin terminal, and to reduce the cost of connection. A spiral part of the insulated wire having a spiral end according to the invention is formed by removing an insulation at an end of the insulated wire to expose a conductor, and winding the exposed conductor into a spiral form by 1.5 folds or more to produce a spiral part. The insulated wire and the pin terminal are connected in such a manner that the pin terminal is inserted into the central opening of the spiral part, and the spiral part and the pin terminal are fixed with a fixing material, such as solder, or binding agent having a high conductivity. When a solder coating is formed on the conductor in the spiral part, it is possible to fix the spiral part and the pin terminal only by heating the spiral part to melt the coating solder.
    • 本发明旨在简化绝缘电线和引脚端子的连接操作,并降低连接成本。 根据本发明的具有螺旋端的绝缘电线的螺旋部分是通过去除绝缘电线末端的绝缘而形成的,以暴露导体,并将暴露的导体卷绕成螺旋形1.5倍或更多以产生 螺旋部分。 绝缘线和针端子以使销端子插入螺旋部的中心开口的方式连接,螺旋部和销端子用诸如焊料或粘合剂的固定材料固定 具有高导电性。 当在螺旋部分的导体上形成焊料涂层时,可以仅通过加热螺旋部分来固定螺旋部分和销端子来熔化涂层焊料。
    • 9. 发明授权
    • Polishing composition and polishing method
    • 抛光组合物和抛光方法
    • US07368387B2
    • 2008-05-06
    • US11020545
    • 2004-12-22
    • Takanori UnoHiroyasu SugiyamaToshiki Owaki
    • Takanori UnoHiroyasu SugiyamaToshiki Owaki
    • H01L21/311
    • C09K3/1463C09G1/02
    • A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second organic acid is citric acid, the first organic acid is preferably malic acid, while when the second organic acid is malic acid, the first organic acid is preferably citric acid. When the second organic acid is succinic acid, iminodiacetic acid, itaconic acid, maleic acid, malonic acid, crotonic acid, gluconic acid, glycolic acid, lactic acid, or mandelic acid, the first organic acid is preferably either citric acid or malic acid. The polishing composition can be suitably used for polishing the surface of a substrate for a magnetic disk.
    • 抛光组合物包括热解氧化铝,除热解法氧化铝以外的氧化铝,胶体二氧化硅,第一有机酸,第二有机酸,氧化剂和水。 当第二有机酸是柠檬酸时,第一有机酸优选为苹果酸,而当第二有机酸为苹果酸时,第一有机酸优选为柠檬酸。 当第二有机酸是琥珀酸,亚氨基二乙酸,衣康酸,马来酸,丙二酸,巴豆酸,葡糖酸,乙醇酸,乳酸或扁桃酸时,第一有机酸优选是柠檬酸或苹果酸。 抛光组合物可以适用于抛光用于磁盘的基板的表面。