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    • 1. 发明申请
    • Mask and manufacturing method thereof
    • 掩模及其制造方法
    • US20070059611A1
    • 2007-03-15
    • US11444546
    • 2006-05-31
    • Chun-Hao TungChia-Tsung LeeHsien-Kai TsengHorino Shigekazu
    • Chun-Hao TungChia-Tsung LeeHsien-Kai TsengHorino Shigekazu
    • G03C5/00G03F1/00
    • G03F1/32G03F1/54
    • A mask and a manufacturing method thereof are provided. A transparent substrate having three regions is provided first. A non-transmitting layer is formed in a first region of the transparent substrate. Then, a first photoresist layer is formed on the transparent substrate, and the first photoresist layer exposes a second region of the transparent substrate. Next, a first transmitting layer is formed on the transparent substrate and the first photoresist layer. Finally, the first photoresist layer is removed. The first transmitting layer on the first photoresist layer is removed at the same time and the first transmitting layer in the second region of the transparent substrate is remained and a third region of the transparent substrate is exposed. A lift-off process is used in the mask manufacturing method of the present invention to form the transmitting layer.
    • 提供了一种掩模及其制造方法。 首先设置具有三个区域的透明基板。 在透明基板的第一区域中形成非透光层。 然后,在透明基板上形成第一光致抗蚀剂层,第一光致抗蚀剂层露出透明基板的第二区域。 接下来,在透明基板和第一光致抗蚀剂层上形成第一透光层。 最后,去除第一光致抗蚀剂层。 同时去除第一光致抗蚀剂层上的第一透射层,并且保留透明基板的第二区域中的第一透射层,并露出透明基板的第三区域。 在本发明的掩模制造方法中使用剥离处理来形成透射层。
    • 2. 发明授权
    • Mask and manufacturing method thereof
    • 掩模及其制造方法
    • US07704647B2
    • 2010-04-27
    • US11444546
    • 2006-05-31
    • Chun-Hao TungChia-Tsung LeeHsien-Kai TsengHorino Shigekazu
    • Chun-Hao TungChia-Tsung LeeHsien-Kai TsengHorino Shigekazu
    • G03F1/00
    • G03F1/32G03F1/54
    • A mask and a manufacturing method thereof are provided. A transparent substrate having three regions is provided first. A non-transmitting layer is formed in a first region of the transparent substrate. Then, a first photoresist layer is formed on the transparent substrate, and the first photoresist layer exposes a second region of the transparent substrate. Next, a first transmitting layer is formed on the transparent substrate and the first photoresist layer. Finally, the first photoresist layer is removed. The first transmitting layer on the first photoresist layer is removed at the same time and the first transmitting layer in the second region of the transparent substrate is remained and a third region of the transparent substrate is exposed. A lift-off process is used in the mask manufacturing method of the present invention to form the transmitting layer.
    • 提供了一种掩模及其制造方法。 首先设置具有三个区域的透明基板。 在透明基板的第一区域中形成非透光层。 然后,在透明基板上形成第一光致抗蚀剂层,第一光致抗蚀剂层露出透明基板的第二区域。 接下来,在透明基板和第一光致抗蚀剂层上形成第一透光层。 最后,去除第一光致抗蚀剂层。 同时去除第一光致抗蚀剂层上的第一透射层,并且保留透明基板的第二区域中的第一透射层,并露出透明基板的第三区域。 在本发明的掩模制造方法中使用剥离处理来形成透射层。